Presentation on theme: "XFP System and 10G Common Electrical Interface Dong Zheng BitBlitz Communications Milpitas, California"— Presentation transcript:
XFP System and 10G Common Electrical Interface Dong Zheng BitBlitz Communications Milpitas, California
Agenda XFP modules vs. others Host systems architectures Implementation examples
Box-to-Box: Optical Modules 300 pin MSA Large on Board Footprint Cost: 20x x16 Mux I/F Xenpak Plug-able Cost: 4-6x XAUI I/F Xpak/X2 Plug-able Cost: 2x XAUI I/F XFP/SFP Plug-able Cost: 1x 10G Ser I/F REQUIREMENTS! Lower Cost Smaller Form Factor (Greater Line Card density) Lower Power
XFP vs. other modules Notes: * The XFI electrical spec is part of the XFP spec, but is expected to be used elsewhere. XENPAKXPAKX2XFPXFP/XENPAK Power (W) , 2.5, 3.5, >3.5 ~50% (level 2,3) Width (mm) ~50% Length (mm) ~50% Depth ~50%
Summaries XFP modules are lower power, smaller form factor, lower cost for higher line card density over competing solutions 10G electrical interface is more challenging compared to XENPAK based modules Reference system has demonstrated feasibility of the XFP host system, with significant margin on 10G electrical interface.