Presentation on theme: "XFP System and 10G Common Electrical Interface"— Presentation transcript:
1 XFP System and 10G Common Electrical Interface Dong Zheng BitBlitz CommunicationsMilpitas, California
2 Agenda XFP modules vs. others Host systems architectures Implementation examples
3 (Greater Line Card density) Box-to-Box: Optical Modules300 pin MSALarge on Board FootprintCost: 20xx16 Mux I/FXenpakPlug-ableCost: 4-6xXAUI I/FXpak/X2Plug-ableCost: 2xXAUI I/FREQUIREMENTS!Lower CostSmaller Form Factor(Greater Line Card density)Lower PowerXFP/SFPPlug-ableCost: 1x10G Ser I/F
4 XFP vs. other modules XENPAK XPAK X2 XFP XFP/XENPAK Power (W) 6 4 1.5, 2.5, 3.5, >3.5~50%(level 2,3)Width (mm)3618.35Length (mm)12185.49171Depth115.275.777.261.7Notes: * The XFI electrical spec is part of the XFP spec, but is expected to be used elsewhere.Notes: * The XFI electrical spec is part of the XFP spec, but is expected to be used elsewhere.
5 XFP philosophy: Minimal electrical circuits in module 10GE ApplicationsHostModuleXGMIIXAUIASIC3GSerDes8016XENPAK,XPAK, X2XFIASICXGMII3GSerDes10GSerDesXAUI48016XFPOpticalXFP philosophy: Minimal electrical circuits in module
10 SummariesXFP modules are lower power, smaller form factor, lower cost for higher line card density over competing solutions10G electrical interface is more challenging compared to XENPAK based modulesReference system has demonstrated feasibility of the XFP host system, with significant margin on 10G electrical interface.