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研华科技.

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Presentation on theme: "研华科技."— Presentation transcript:

1 研华科技

2 研华网络通讯事业群 客户服务部 李腊全

3 下一代网络通讯平台 ----研华Compact PCI System

4 Agenda 1. CPCI 规范简介 2. CPCI 市场分析 3. 研华 NCG 能提供什么产品 - CPCI与IPC - 第三方的认证
- 产品规划 - 第三方的认证

5 1. 定义 “Compact PCI” 一种开放的架构 (PICMG) PCI-based 工业计算机 强固型安装机构 ( 欧卡结构 )
适合高速计算及高速数据通讯应用 * Industrial standard developed by a consortium of over 700 companies whose goal is to increase availability and reduce cost of computing products ( )

6 欧卡规格 6U 3U 工业级规格 PICMG 定义了 3U 及 6U 两种规格 160 mm
Eurocard is an industrial-grade mechanical form factor for rack-based systems. It is used in VME, Multibus II, and other applications defined by the IEEE (Institute of Electrical and Electronics Engineers) and IEC (International Electrotechnical Committee). 3U boards are 100 mm by 160 mm. 6U boards are mm by 160 mm. 3U boards can have J1 and J2 connectors while 6U boards can accommodate J1 through J5 connectors. The front panels of CompactPCI boards are IEEE and IEEE compliant and may include an EMC gasket to minimize electromagnetic interference. The front panel typically contains I/O connectors, LED indicators, and switches.

7 2. 市场 * VDC projects CPCI growing past VME by 2002, exceeding the billion-dollar barrier. ~ by RTC Magazine 2001 June VDC data showing forecasted growth of standard board architectures through 2004

8 市场应用趋势 Trends and forecasts show that telecommunications dominance is likely to strengthen over times. ~ by RTC magazine 2001 June 70% Market adoption of CPCI by Industrial / application for 1999 & 2004

9 降低风险 节省时间 减少投资 2.1 为什么选择 Compact PCI? 高可靠性 易于扩展 操作方便 Low Cost Low Risk
Low Time

10 Why CPCI? – 高可靠性 CPCI Platform Mechanism Maximize MTBF Minimize MTTR
导轨 Maximize MTBF 空气自然流动路径 针孔连接器 前面板 导轨 插拔手柄 Minimize MTTR MTTR: mean time to repair, MTBF: mean time to failure * CompactPCI pin-and-socket connectors are very tight. Each connector is equal to 10 kgw, which means a 6U CompactPCI board with J1 to J5 needs 50 kgw (500 N) to remove the board from the backplane. 分级针脚具有热拔插能力 散热气流

11 Why CPCI? – 易于扩展 最灵活的架构 每个总线段支持 8 个CPCI 扩展插槽( Desktop/ PCI : 4 )
操作系统及应用软硬件无需修改,完全兼容 MS-DOS, Window95/ 98/ 2000/ XP/ NT, UNIX, Linux,VxWork, Solaris, … * To meet the needs of enterprises, telcos and XSP today Replacement of a card from a conventional industrial PC system is always time-consuming. Users need to unfasten the chassis cover, disconnect all wiring from the card, replace the card, reconnect the wiring, and refasten the chassis cover. It is a process prone to error because there can be internal cabling between cards and peripheral devices, and it is necessary to remove all cabling before a card can be replaced. The serviceability of conventional industrial PC systems is not as simple and fast as CompactPCI systems. CompactPCI, on the other hand, is designed to be a front loading and removal system. The replacement of a CompactPCI board can be very simple without even having to remove the chassis cover. In addition, if the I/O is cabled through the back of the system, the front of the CompactPCI boards will remain “clean”, without any connected wiring, and the replacement of a CompactPCI board is quick and easy. The maintenance time can be reduced from a matter of hours to a matter of minutes, meaning a lower Mean-Time to Repair (MTTR). 机箱: - N+1 hot-swap power and fans - Front and rear slot access CPCI card designed for front-loading and removal from a card cage

12 Why CPCI? – 效率更高 - 系统内连接电缆易于管理,维护更简单 - 在有限空间容纳更多设备(接口) 用户总成本降低 Telecom
* Reduce floor spaces, downtime, and the need for skilled resource and costs, * suitable for data center, XSP and telecom application - 200 vs 15 cables in a 2-meter rack - Difficult v.s. simple serviceability Known as CT spec. or PICMG 2.5, theoretically, standard CPCI enables up to 16 E1 or T1 PCMs to be terminated on a single CompactPCI card. It also suggests that up to 20 slots could be available in a single chassis, which would have the net result of allowing 320 E1 or T1s to be switched in a single unit. The largest ISA-based systems could only support 32 E1 or T1 terminations in a single chassis. Telecom CPCI versus Traditional IPC

13 Typical IPC-Based CT Platform
CT Bus: CT行业系统扩展解决方案 A TDM bus provides 1024/2048/4096 time slots for exchanging voice, fax, or other network resources on the CPCI backplane w/o occupying the system bus and reducing noise. CT - Bus H .110 Bus J5 Telephony I/O J4 H.110 Bus J3 Optional J2 64 bit CPCI Bus J1 32 bit CPCI Bus versus Typical IPC-Based CT Platform TDM: time division multiplex J4 for Computer Telephony: H.110 CT bus, defined in PICMG 2.5 specification (Non-system slot) *在 ISA/ PCI架构下, CT-Bus 通过外部电缆传送语音信号,但容易产生噪音并会占用系统总线. CCPI CT Platform

14 2.2 CompactPCI vs. Industrial PC
可维护性 抗振动及抗冲击能力 系统散热能力

15 CompactPCI vs. IPC ( I ) 可维护性

16 CompactPCI vs. IPC ( II ) 抗振动与抗冲击能力

17 CompactPCI vs. lPC ( III )
系统散热能力

18 Industrial Control/ Traffic
2.3. Application * 6U Compact PCI 将取代 VME 在电信/通讯领域的市场 ; 3U Compact PCI 将取代 STD 总线在工业控制领域的市场. ~ by RTC Magazine 2001 6 U Telecom/ Datacom 3U Industrial Control/ Traffic STD: subscriber trunk dialing VME: VersaModule Eurocard

19 CPCI潜在用户 Telcom(电信): Military applications(军工)
- major focus market of CPCI - like wireless device, real time control, Mobile Control and so on - any application need high-speed computing or hot-swap feature Military applications(军工) Medical Instrument(医疗设备) Bank(银行): like billing system, monitoring equipment and so on Manufacturing(制造业) Harsh Environment Application(特殊环境应用): like Semiconductor

20 3. 研华能为客户提供什么产品? Enclosures CPU Boards Rear I/O MIC-3031/14
14-slot with CT-Bus and rear I/O MIC-3032/8 8-slot with CT bus and rear I/O MIC-3033/5 5-slot with CT-bus and rear I/O MIC-3021/8 8-slot, front I/O MIC slot, 1U-high CPU Boards MIC-3365 Socket 370 PIII/Celeron MIC-3376 Slot 1 Pentium III MIC-3385 Dual Pentium III MIC-3377/M Single PIII/Celeron MIC-3365 Single PIII/Celeron Rear I/O MIC-3301 MIC-3302

21 CPU Board Roadmap Performance MIC-3389 MIC-3369 MIC-3368 MIC-3366
DP, PIII 1Ghz MIC-3368 UP, PIII LP 700Mhz MIC-3369 UP, Banias/Plumas 64bit/66Mhz Dual GbE Dec. ‘02 2.16 MIC-3366 UP, PIII LP 700Mhz MIC-3368C/E UP, PIII 700Mhz 64bit/33Mhz Dual PMC Oct. ‘02 2.16 Value MIC-3377 UP, PIII 1Ghz MIC-3365 UP, PIII 850Mhz MIC-3358 UP, P4-M 32bit/33Mhz Dual GbE Dec. ‘02 2.16 MIC-3357 UP, PII 266Mhz Entry Q3’02 Q4’02 Q1’03 Q203 Shipping Planning Shipping date 2.16 PICMG 2.16 3.0 PICMG 3.0

22 Peripheral Board Roadmap
MIC-3662D Dual GbE Oct. ‘02 MIC- 3662F Dual GbE, Fiber MIC-3681 SCSI Dec. ‘02 PMC card MIC-3661D Dual 10/100 LAN MIC-3671 PCMCIA Oct. ‘02 MIC-3950/51 PMC Carrier board 32/64bits NEW MIC-3960 Storage Carrier board 6U board MIC-8102 Switch board GbE Q1 ‘03 2.16 MIC-8101 Switch board Aug. ‘02 2.16 MIC-3961 PCI to CPCI Carrier board MIC-7101 CMM Nov. ‘02 2.16 The MIC-8101 switch board and MIC-7101 CMM are licensed from Intel with model ZT-8101 and ZT-7101 respectively. Mgnt board MIC-3920 MIC-3924A CMM Aug. ‘02 MIC-3924B CMM Sept. ‘02 2.16 Q3’02 Q4’02 Q1’03 Q203 Shipping Planning Shipping date 2.16 PICMG 2.16 3.0 PICMG 3.0

23 Chassis Roadmap NEW MIC-3031 MIC-3082 >8U MIC-3081 MIC-3032
12U, 14 slots w/Devices Redundant PWR MIC-3082 11U, 21 slots Redundant N+1 PWR Dec. ‘02 2.16 >8U MIC-3081 10U, 8 slots W/Devices Redundant N+1 PWR MIC-3032 9U, 8 slots w/Devices Redundant PWR Sept. ‘02 NEW MIC-3041 4U, 6 slots w/Devices, Redundant PWR MIC-3033 4U, 5 slots w/Devices MIC-3038 4U, 8 slots Redundant PWR MIC-3038 4U, 8 slots Redundant PWR 2.16 2.16 4U Intel Dec. ‘02 Dec. ‘02 MIC-3036 2U MIC-3056 2U, Redundant PWR MIC-3035 1U, w/Devices 1U/2U MIC-3037 1U, wo/RIO MIC-3039 1U, w/RIO Q3’02 Q4’02 Q1’03 Q203 Shipping Planning Shipping date 2.16 PICMG 2.16 3.0 PICMG 3.0

24 Blade Server Roadmap NEW NEW SF-1000 >8U SF-420 SF-421 SF-420B 4U
11U, 21 Servers w/ CMM Redundant N+1 PWR Q1 ‘03 2.16 >8U NEW SF-420 4U, 8 Servers w/ CMM Redundant N+1 PWR Oct. ‘02 2.16 SF-421 4U, 7 Servers, P4 w/ CMM Redundant N+1 PWR 2.16 Q2 ‘03 SF-420B 4U, 8 Servers wo/ CMM Redundant N+1 PWR Aug. ‘02 2.16 4U NEW SF-400 4U, 8 Servers w/ CMM Redundant N+1 PWR Sept. ‘02 SF-401 4U, 8 Servers, P4 w/ CMM Redundant N+1 PWR Q2 ‘03 Q3’02 Q4’02 Q1’03 Q203 Shipping Planning Shipping date 2.16 PICMG 2.16 3.0 PICMG 3.0

25 Carrier boards MIC-3950 Dual PMC Carrier
Dual sites for PMC 32bits/33Mhz * 64 bits is available on MIC-3951 MIC-3960 Storage device Carrier Dual sites for either CD-ROM or FDD and HDD 32bits/33Mhz MIC-3961 PCI card Carrier One site for PCI card to CPCI interface 32bits/33Mhz

26 MIC-3038: 4U Blade Server Chassis
4 U高,8槽6UCompactPCI 支持H.110 CT总线 支持Rear I/O 冗余及热拔插电源 300W + 300W load sharing 超薄驱动器可选 One 2.5” HDD One slim type CO-ROM 热拔插风扇 1 x 150 CFM fan inlet 1 x 15 CFM fan exhaust Dimensions: 440 x 177 x 340 mm Media blade CPU blade

27 MIC-3056: 2U HA Chassis 2 U高,4槽6U CompactPCI H.110 bus compliant
Rear I/O support Redundant & hot swap P/S with PFC 300W + 300W load sharing Hot swap fan 3 x 22 CFM fans inlet Dimensions: 440 x 88 x 355 mm

28 MIC-3081: 10U Chassis Preliminary 10U高8槽6U CompactPCI
H.110 bus compliant Rear I/O support Alarm Module or CMM integrated Redundant & hot swap P/S with PFC 1+1 total 300W 2+1 total 560W Hot swap fans 2 x 150 CFM fan inlet 2 x 35 CFM blower exhaust Dimensions: 440 x 406 x 340 mm

29 MIC-3082: 11U Server blade Chassis
Preliminary MIC-3082: 11U Server blade Chassis 11U高11槽6U CompactPCI Rear I/O support Redundant & hot swap P/S with PFC 3+1 total 900W Hot swap fans 2 x 150 CFM fan inlet 3 x 35 CFM Blower exhaust Dimensions: 440 x 447 x 340 mm

30 Blade Server Series

31 SF- 420 4 U-high Enclosure MIC-8101 Switch blade
7 blade servers MIC-3368 Low power P-III 700Mhz 512MB memory 30GB HDD Hot swappable PICMG 2.16 compliant Redundant & hot swap P/S with PFC 300W+300W Hot swap fans Rear I/O support Redundant AC-IN Hot swappable chassis management module SNMP support Remote Web based system manager

32 3.2 第三方认证 NEBS ( Network Equipment Building System ) : Safety
- a stringent set of specifications originally set forth by Bell Labs - to certify telecommunications equipment for worse-case operating scenarios - products w/ NEBS are designed for the most heavy-duty of environments - QA Test Report by Advantech ( MIC-3032 ) - Firespread Criteria Test by Garwood Lab (MIC-3031/14, MIC-3032/8, MIC-3033/5 ) NMS: Compatibility & Hot swap test - based on WindowsNT / Solaris environment (compatibility & hot swap test ) NEBS : Network Equipment Building System - Central Office(CO) Requirement - GR-63-Core(Environmental Requirements) - GR-1089-Core(EMI/RFI) - Level 1 : Non-vital Services & Access Provider equipment - Level 2 : Non-critical network & highly controlled environment, such as : Data center - Level 3 : Critical network(Digital switch,Transport products, Power system ) * All relative doc., pls surf:

33 NEBS : Firespread Criteria Test by Garwood Lab.
Garwood Laboratories, Inc. Since 1954 ® Industry Ave Pico Rivera, CA Tel. (562) Fax. (562) May 4, 2001 Advantech Technologies, Inc. 10225 Barnes Canyon Rd. Suite A-209 San Diego, CA 92121 This letter is to inform you that the following Advantech systems have been R&D tested for informational purposes to Telcordia’s (formerly Bellcore) NEBS (Network Equipment Building Systems) GR-63-CORE, Issue 1, October 1995, Section 4.2, Fire Resistance: the MIC-3031/14, the MIC-3032/8, the MIC-3033/5, and the SPC These units were tested on Thursday April 26 and Friday April 27, No data was captured for the program, as it was R&D for informational purposes only. Videos were taken of every burn test performed, which clearly shows the burn locations for each test and configurations of each system. The video also includes thermal imaging to assess the spread of heat and flames within the units. The fans were powered for the tests per a 120 VAC plug. Power was applied to the system, and the fans were running as per normal installation. Under normal test guidelines, all of the above mentioned units would be found to conform to the requirements and objectives of GR-63, Section 4.2, Fire Resistance. The normal guideline states the following: Firespread Criteria R4-20 [86] When ignited according to the procedures of Section 5.2, fire shall not spread beyond the confines of the equipment assembly being tested. The fire shall be judged to have spread beyond the equipment under test in any of the following occur: ·        Ignition of the circuit boards placed above the test shelves as specified in Section 5.2 or any material in equipment frames placed adjacent to the test frame. ·        Visible burning of any exterior surface material for 30 seconds or more. ·        Visible flames extending beyond the horizontal confines of the equipment under test for 30 seconds or more. ·        Visible flames extending beyond the vertical confines of the equipment under test for 30 seconds or more, after 3.5 minutes past the start of the test. ·        Flaming drippings that continue to burn upon reaching the ground. ·        Heat flux, as measured by the radiometers specified in Section 5.2, that exceeds 15kW/m² for 30 seconds or more. ·        Temperature, as measured by any of the thermocouples specified in Section 5.2, exceeding 540C (1004F) for 30 seconds or more. Measurements for heat flux, and temperature were not performed, as the testing was solely R&D. The information obtained at Garwood Laboratories has been supplied to Advantech, and all R&D testing has been completed.    Sincerely, Don Bennett Telecommunications Test Manager The Fire Resistance testing that we had done is only ONE standard that must be met to claim we are NEBS compliant

34 部分研华客户的应用 Customer Configuration Application CHT/ Taiwan
MIC-3032+MIC-3377 SS7 Gateway Fusion in Tech/ Korea MIC-3033+MIC-3376 VoIP Japan MIC-3351 Dam Controller Australia MIC-3377 Medical device 華盛興業/ China MIC-3365F Fiber Optics backbone monitoring equipment Europe Gas station controller STI ( Flextech )/ Singapore Semiconductor SMT Line for image processing unit

35 Advantech reduce Cost, Risk, and Time to revenue for customer.
研华能为你做什么? 最灵活的客制化服务 Engineering service provided: like BIOS modification support in small quantity BTOS Global logistics By CPCI technology, Advantech reduce Cost, Risk, and Time to revenue for customer.

36 Thank you


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