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研华科技. 研华网络通讯事业群 客户服务部 李腊全 下一代网络通讯平台 ---- 研华 Compact PCI System 下一代网络通讯平台 ---- 研华 Compact PCI System.

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Presentation on theme: "研华科技. 研华网络通讯事业群 客户服务部 李腊全 下一代网络通讯平台 ---- 研华 Compact PCI System 下一代网络通讯平台 ---- 研华 Compact PCI System."— Presentation transcript:

1 研华科技

2 研华网络通讯事业群 客户服务部 李腊全

3 下一代网络通讯平台 ---- 研华 Compact PCI System 下一代网络通讯平台 ---- 研华 Compact PCI System

4 Agenda 1. CPCI 规范简介 2. CPCI 市场分析 - 为什么选择 CPCI - CPCI 与 IPC 3. 研华 NCG 能提供什么产品 - 产品规划 - 第三方的认证

5 1. 定义 “Compact PCI” 一种开放的架构 (PICMG) PCI-based 工业计算机 强固型安装机构 ( 欧卡结构 ) 适合高速计算及高速数据通讯应用 * Industrial standard developed by a consortium of over 700 companies whose goal is to increase availability and reduce cost of computing products ( )www.picmg.org

6 欧卡规格 工业级规格 PICMG 定义了 3U 及 6U 两种规格 100 mm 160 mm mm 160 mm 3U 6U

7 VDC data showing forecasted growth of standard board architectures through 2004VDC data showing forecasted growth of standard board architectures through 市场 * VDC projects CPCI growing past VME by 2002, exceeding the billion-dollar barrier. ~ by RTC Magazine 2001 June

8 Market adoption of CPCI by Industrial / application for 1999 & 2004 市场应用趋势 Trends and forecasts show that telecommunications dominance is likely to strengthen over times. ~ by RTC magazine 2001 June 70%

9 2.1 为什么选择 Compact PCI? 高可靠性 易于扩展 操作方便降低风险节省时间减少投资 Low Risk Low Time Low Cost

10 Why CPCI? Why CPCI? – 高可靠性 前面板 针孔连接器 导轨 分级针脚具有热拔插能力 散热气流 空气自然流动路径 Minimize MTTR Maximize MTBF 插拔手柄 CPCI Platform Mechanism

11 Why CPCI? – Why CPCI? – 易于扩展 - 最灵活的架构 - 每个总线段支持 8 个 CPCI 扩展插槽 ( Desktop/ PCI : 4 ) - 操作系统及应用软硬件无需修改, 完全兼容 -MS-DOS, Window95/ 98/ 2000/ XP/ NT, UNIX, Linux,VxWork, Solaris, … * To meet the needs of enterprises, telcos and XSP today CPCI card designed for front-loading and removal from a card cage 机箱 : - N+1 hot-swap power and fans - Front and rear slot access

12 Why CPCI? – Why CPCI? – 效率更高 versus vs 15 cables in a 2-meter rack - Difficult v.s. simple serviceability - 系统内连接电缆易于管理, 维护更简单 - 在有限空间容纳更多设备 ( 接口 ) - 用户总成本降低 * Reduce floor spaces, downtime, and the need for skilled resource and costs, * suitable for data center, XSP and telecom application Traditional IPC Telecom CPCI

13 A TDM bus provides 1024/2048/4096 time slots for exchanging voice, fax, or other network resources on the CPCI backplane w/o occupying the system bus and reducing noise. H.110 Bus J5 Telephony I/O J4 H.110 Bus J3 Optional J2 64 bit CPCI Bus J1 32 bit CPCI Bus CT - Bus versus CCPI CT Platform * 在 ISA/ PCI 架构下, CT-Bus 通过外部电 缆传送语音信号, 但 容易产生噪音并会 占用系统总线. Typical IPC-Based CT Platform CT Bus: CT 行业系统扩展解决方案

14 2.2 CompactPCI vs. Industrial PC 可维护性 抗振动及抗冲击能力 系统散热能力

15 CompactPCI vs. IPC ( I ) 可维护性

16 CompactPCI vs. IPC ( II ) 抗振动与抗冲击能力

17 CompactPCI vs. lPC ( III ) 系统散热能力

18 * 6U Compact PCI 将取代 VME 在电信 / 通讯领域的市场 ; 3U Compact PCI 将取代 STD 总线在工业控制领域的市场. ~ by RTC Magazine U Telecom/ Datacom 3U Industrial Control/ Traffic 2.3. Application

19 CPCI 潜在用户 Telcom( 电信 ): - major focus market of CPCI - like wireless device, real time control, Mobile Control and so on - any application need high-speed computing or hot-swap feature Military applications( 军工 ) Medical Instrument( 医疗设备 ) Bank( 银行 ): like billing system, monitoring equipment and so on Manufacturing( 制造业 ) Harsh Environment Application( 特殊环境应用 ): like Semiconductor

20 3. 研华能为客户提供什么产品 ? MIC-3365 Socket 370 PIII/Celeron MIC-3376 Slot 1 Pentium III MIC-3021/8 8-slot, front I/O MIC-3031/14 14-slot with CT- Bus and rear I/O MIC-3032/8 8-slot with CT bus and rear I/O MIC-3033/5 5-slot with CT- bus and rear I/O Enclosures CPU Boards MIC-3301MIC-3302 MIC-3385 Dual Pentium III Rear I/O MIC-3377/M Single PIII/Celeron MIC-3365 Single PIII/Celeron MIC slot, 1U-high

21 Q4’02Q3’02 Q1’03 Q203 Entry Value Performance MIC-3357 UP, PII 266Mhz MIC-3389 DP, PIII 1Ghz MIC-3369 UP, Banias/Plumas 64bit/66Mhz Dual GbE Dec. ‘ MIC-3358 UP, P4-M 32bit/33Mhz Dual GbE Dec. ‘ MIC-3368 UP, PIII LP 700Mhz MIC-3366 MIC-3377 UP, PIII 1Ghz MIC-3365 UP, PIII 850Mhz PlanningShipping 2.16 PICMG PICMG 3.0 Shipping date CPU Board Roadmap MIC-3368C/E UP, PIII 700Mhz 64bit/33Mhz Dual PMC Oct. ‘

22 Q4’02Q3’02 Q1’03 Q203 MIC-3671 PCMCIA Oct. ‘02 Mgnt board PMC card MIC-3920 MIC-3662D Dual GbE MIC-3924A CMM Aug. ‘02 MIC-3950/51 PMC Carrier board 32/64bits MIC-3960 Storage Carrier board MIC-3961 PCI to CPCI Carrier board PlanningShipping 2.16 PICMG PICMG 3.0 Shipping date Peripheral Board Roadmap MIC-3661D Dual 10/100 LAN MIC-3681 SCSI Dec. ‘02 6U board MIC-3924B CMM Sept. ‘ MIC-7101 CMM Nov. ‘ MIC-8101 Switch board Aug. ‘ MIC- 3662F Dual GbE, Fiber Oct. ‘02 MIC-8102 Switch board GbE Q1 ‘ NEW

23 Q4’02Q3’02 Q1’03 Q203 MIC U, 8 slots W/Devices Redundant N+1 PWR Sept. ‘02 1U/2U >8U MIC U, w/RIO PlanningShipping 2.16 PICMG PICMG 3.0 Shipping date Chassis Roadmap 4U MIC U, Redundant PWR MIC U, wo/RIO MIC-30362U MIC U, w/Devices MIC U, 8 slots Redundant PWR MIC U, 5 slots w/Devices MIC U, 8 slots w/Devices Redundant PWR MIC U, 14 slots w/Devices Redundant PWR MIC U, 21 slots Redundant N+1 PWR Dec. ‘ MIC U, 8 slots Redundant PWR2.16 Dec. ‘02 Intel MIC U, 6 slots w/Devices, Redundant PWR NEW Dec. ‘

24 Q4’02Q3’02 Q1’03 Q203 >8U PlanningShipping 2.16 PICMG PICMG 3.0 Shipping date Blade Server Roadmap 4U SF-420 4U, 8 Servers w/ CMM Redundant N+1 PWR Oct. ‘ SF U, 21 Servers w/ CMM Redundant N+1 PWR Q1 ‘ SF-400 4U, 8 Servers w/ CMM Redundant N+1 PWR Sept. ‘02 SF-420B 4U, 8 Servers wo/ CMM Redundant N+1 PWR Aug. ‘ SF-421 4U, 7 Servers, P4 w/ CMM Redundant N+1 PWR Q2 ‘ SF-401 4U, 8 Servers, P4 w/ CMM Redundant N+1 PWR Q2 ‘03 NEW

25 Dual sites for PMC 32bits/33Mhz Carrier boards MIC-3950 Dual PMC Carrier Dual sites for either CD-ROM or FDD and HDD 32bits/33Mhz MIC-3960 Storage device Carrier MIC-3961 PCI card Carrier One site for PCI card to CPCI interface 32bits/33Mhz * 64 bits is available on MIC-3951

26 4 U 高,8 槽 6UCompactPCI 支持 H.110 CT 总线 支持 Rear I/O 冗余及热拔插电源 –300W + 300W load sharing 超薄驱动器可选 –One 2.5” HDD –One slim type CO-ROM 热拔插风扇 –1 x 150 CFM fan inlet –1 x 15 CFM fan exhaust Dimensions: 440 x 177 x 340 mm MIC-3038: 4U Blade Server Chassis Media bladeCPU blade

27 MIC-3056: 2U HA Chassis 2 U 高,4 槽 6U CompactPCI H.110 bus compliant Rear I/O support Redundant & hot swap P/S with PFC –300W + 300W load sharing Hot swap fan –3 x 22 CFM fans inlet Dimensions: 440 x 88 x 355 mm

28 10U 高 8 槽 6U CompactPCI H.110 bus compliant Rear I/O support Alarm Module or CMM integrated Redundant & hot swap P/S with PFC –1+1 total 300W –2+1 total 560W Hot swap fans –2 x 150 CFM fan inlet –2 x 35 CFM blower exhaust Dimensions: 440 x 406 x 340 mm MIC-3081: 10U Chassis

29 11U 高 11 槽 6U CompactPCI Rear I/O support Redundant & hot swap P/S with PFC –3+1 total 900W Hot swap fans –2 x 150 CFM fan inlet –3 x 35 CFM Blower exhaust Dimensions: 440 x 447 x 340 mm MIC-3082: 11U Server blade Chassis

30 Blade Server Series Blade Server Series

31 4 U-high Enclosure MIC-8101 Switch blade 7 blade servers MIC-3368 –Low power P-III 700Mhz –512MB memory –30GB HDD –Hot swappable PICMG 2.16 compliant Redundant & hot swap P/S with PFC –300W+300W Hot swap fans Rear I/O support Redundant AC-IN Hot swappable chassis management module –SNMP support –Remote Web based system manager SF- 420

32 3.2 第三方认证 NEBS ( Network Equipment Building System ) : Safety - a stringent set of specifications originally set forth by Bell Labs - to certify telecommunications equipment for worse-case operating scenarios - products w/ NEBS are designed for the most heavy-duty of environments - QA Test Report by Advantech ( MIC-3032 ) - Firespread Criteria Test by Garwood Lab ( MIC-3031/14, MIC-3032/8, MIC-3033/5 ) NMS: Compatibility & Hot swap test - based on WindowsNT / Solaris environment (compatibility & hot swap test ) * All relative doc., pls surf:

33 Garwood Laboratories, Inc. Since 1954 ® 7829 Industry Ave Pico Rivera, CA Tel. (562) Fax. (562) May 4, 2001 Advantech Technologies, Inc Barnes Canyon Rd. Suite A-209 San Diego, CA This letter is to inform you that the following Advantech systems have been R&D tested for informational purposes to Telcordia’s (formerly Bellcore) NEBS (Network Equipment Building Systems) GR-63-CORE, Issue 1, October 1995, Section 4.2, Fire Resistance: the MIC-3031/14, the MIC-3032/8, the MIC-3033/5, and the SPC-520. These units were tested on Thursday April 26 and Friday April 27, No data was captured for the program, as it was R&D for informational purposes only. Videos were taken of every burn test performed, which clearly shows the burn locations for each test and configurations of each system. The video also includes thermal imaging to assess the spread of heat and flames within the units. The fans were powered for the tests per a 120 VAC plug. Power was applied to the system, and the fans were running as per normal installation. Under normal test guidelines, all of the above mentioned units would be found to conform to the requirements and objectives of GR-63, Section 4.2, Fire Resistance. The normal guideline states the following: Firespread Criteria R4-20[86] When ignited according to the procedures of Section 5.2, fire shall not spread beyond the confines of the equipment assembly being tested. The fire shall be judged to have spread beyond the equipment under test in any of the following occur: · Ignition of the circuit boards placed above the test shelves as specified in Section 5.2 or any material in equipment frames placed adjacent to the test frame. · Visible burning of any exterior surface material for 30 seconds or more. · Visible flames extending beyond the horizontal confines of the equipment under test for 30 seconds or more. · Visible flames extending beyond the vertical confines of the equipment under test for 30 seconds or more, after 3.5 minutes past the start of the test. · Flaming drippings that continue to burn upon reaching the ground. · Heat flux, as measured by the radiometers specified in Section 5.2, that exceeds 15kW/m² for 30 seconds or more. · Temperature, as measured by any of the thermocouples specified in Section 5.2, exceeding 540  C (1004  F) for 30 seconds or more. Measurements for heat flux, and temperature were not performed, as the testing was solely R&D. The information obtained at Garwood Laboratories has been supplied to Advantech, and all R&D testing has been completed. Sincerely, Don Bennett Telecommunications Test Manager NEBS : NEBS : Firespread Criteria Test by Garwood Lab.

34 部分研华客户的应用 CustomerConfigurationApplication CHT/ TaiwanMIC-3032+MIC-3377SS7 Gateway Fusion in Tech/ KoreaMIC-3033+MIC-3376VoIP JapanMIC-3351Dam Controller AustraliaMIC-3377Medical device 華盛興業 / China MIC-3365FFiber Optics backbone monitoring equipment EuropeGas station controller STI ( Flextech )/ Singapore Semiconductor SMT Line for image processing unit

35 研华能为你做什么 ? 最灵活的客制化服务 –Engineering service provided: like BIOS modification support in small quantity –BTOS –Global logistics By CPCI technology, Advantech reduce Cost, Risk, and Time to revenue for customer.

36 Thank you


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