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RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday October 9, 2009 11:30 to 1:00pm.

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Presentation on theme: "RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday October 9, 2009 11:30 to 1:00pm."— Presentation transcript:

1 RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday October 9, 2009 11:30 to 1:00pm

2 Team Members Gregory Hintz (EE) Samuel Skalicky (CE) Jeremy Greene (EE) Jared Burdick (EE) Michelle Bard (ME) Anthony Perrone (ME)


4 Power Distribution FPGADDR2 OEM Board Flash MEMSSDINSD3 Cameras Connector Board 1.2V1.8V5V3.3V 3.3V, 5V, 12V 15V3.3V9-36V

5 Power Distribution(cont.) -Schematic Using LT1933 taken from Linear Technology

6 Camera: MT9J003 CMOS Digital Image Sensor Why This Camera? Imaging Array 3664(H) x 2748(V) Speed/Output Frame Rate: 15 fps (HiSPi serial I/F) 7.5 fps (parallel I/F) Data Rate: 2.8 Gb/s (HiSPi serial I/F) 80 Mp/s (parallel I/F) Data Format: 12-bit RAW Temperature Range –30°C to +70°C Power Supply: 1.8V – 2.8V 638mW @ full resolution

7 Interfaces D3 Camera Interface -16-bit parallel output -6 Miscellaneous positions -Two wire I²C bus interface -Several clock and control positions CameraLink -LVDS to achieve theoretical transmission rate of 1.923Gbps -Not dependent on a particular supply voltage because of low signal voltage swing GigE -High bandwidth for high-speed, and high resolution cameras -Downward compatible with 10/100 Mhz Ethernet -Operates at a fast frame rate

8 The Connector Board Speculation of finished product: Ports for data I/O.

9 Where We Started

10 Initial Concept Specifications call for external ports: – (2) CameraLink (LVDS) – (2) Gigabit Ethernet – Power in (9V to 36V) – Sync – Serial (RS-232) Courtesy D3 Engineering

11 Things to Consider Q: What does this do beyond wire connectors? – Will include some IC's that might otherwise be on the main, FPGA board. Q: Do all of these connectors need to be on a circuit board? – Probably not Q: Is there anything else that needs an I/O port? – The Inertial Navigation System (INS) will be housed separately – An external Serial ATA (SATA) will be included Q: How will data be transferred from the connector board to the FPGA board and vice-versa? – A ribbon cable to carry data signals – CameraLink & GigE interfaces adapted to D3

12 After Initial Brainstorming

13 The Inertial Navigation System Provides location and directional data. Location determined by a Global Positioning System (GPS) device. Direction determined by an Inertial Measurement Unit (IMU). Important information to have for this kind of camera system.

14 Considering the Options MicroStrain 3DM Both can be used with RS232 port. NovAtel SPAN

15 Enclosure Consideration Some models contain the GPS and IMU in a single unit, others separate them. May have noteworthy impact on size and design of the system enclosure.

16 Digital Operations

17 FPGA Board

18 Camera/INS Speeds 10 MP Visual Band Image Sensor – 1 image/sec – 1 image approx 32MB VGA IR Band Image Sensor – 30 images/sec – 1 image approx 1MB INS Sensor – 1 capture/image (30/sec) – 1 capture approx 2MB

19 FPGA Hardware Requirements Flash Based (SPI) Configuration Memory – 64MB covers all Spartan 6 LXT packages DDR2 Ram – Image Data: RGB 24 bits, upto 30 bits per pixel Dual Modules -> 32bits wide – Density 2Gb total Approx 62MB image data/sec Approx 60MB INS data/sec

20 FPGA I/O Pin Requirements

21 Spartan 6 FPGA Family

22 End of Electrical Discussion

23 Needs Considerations Approach Maintain optimal temperature range required by components Prevent the heat produced by the electronics from interfering with the operation of cameras Maintain an air/water tight environment Heat Mitigation

24 External environment Temperature on ground : assume 40-70 °F Temperature at 30,000 ft (5.7 miles): -66.8°F to -36.8°F Image ID: wea00041, NOAA's National Weather Service (NWS) Collection Photographer: Ralph F. Kresge #1059 Internal environment External temperature plus temperature of heat generated by electronic components Needs Considerations Approach Heat Mitigation

25 2 Thermally isolated enclosures Conductive heat transfer methods inside the chassis Passive convective heat transfer methods outside Needs Considerations Approach Heat Mitigation

26 Ensure imaging system is securely attached to airframe Reduce vibration of system Image from: Needs Considerations Approach Airframe Mounting

27 Pre-existing bolt patterns in aircraft Pre-existing opening in aircraft for imaging systems Does not interfere with other components of imaging system Needs Considerations Approach Airframe Mounting

28 Utilize airplane’s pre-existing bolt pattern in vibration damping mount to attach vibration damping mount directly to airframe Initial sketch for vibration damping airframe-mount Needs Considerations Approach Airframe Mounting

29 Needs Stabilize Image Prevent Hardware Damage/Malfunctioning Considerations Frequencies of Aircraft Allowable Vibration in Image Component Resonant Frequencies

30 Approach Mechanical isolation of chassis

31 Stock Hardware Interchangeable as needs change Large body of established data

32 Chassis Design Phase 1: Individual Compartments Separate Enclosures Thermally Isolated Modular Minimal Leak Paths

33 Chassis Design Phase 2: Scale

34 Chassis Design Phase 3: Detail

35 RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday October 9, 2009

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