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RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday November 6, 2009 9:00am to 11:00am.

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Presentation on theme: "RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday November 6, 2009 9:00am to 11:00am."— Presentation transcript:

1 RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday November 6, 2009 9:00am to 11:00am

2 Team Members Gregory Hintz (EE) – Project Manager Samuel Skalicky (CE) – Lead Engineer, FPGA Board Jeremy Greene (EE) – Connector Board Jared Burdick (EE) – Power Michelle Bard (ME) – Environmental Tony Perrone (ME) – Physical Design

3 Advisors Scott Reardon (D3 Engineering) Kevin Kearney (D3 Engineering) Dr. Robert Kremens (RIT-Imaging Science) Philip Bryan (RIT – Industry Guide)

4 Project Status Risks BOM Analysis Feasibility Designs Test Plans

5 Schedule for the Design Review Overview – Gregory Hintz Electrical Discussion Processor Board and FPGA – Samuel Skalicky Connector Board, INS System – Jeremy Greene Mechanical Discussion System Design – Tony Perrone Environmental Concerns – Michelle Bard

6 What is the Customer Looking for? Integrate supplied components Ruggedized Unit Flight-capable package Can record and transmit Capable of processing

7 Black Box System Model

8 Electronic System

9 1.Integrate supplied components A.10MP Visual Band Camera B.1.3MP IR Camera C.Spatial Sensors i.NovAtel OEM Board OEMV3 ii.NovAtel OEM Board OEMV2 D.Camera Processing Board 2.Capture data from two cameras 3.Capture 10MP @ 1fps 4.Capture 1.3MP @ 30fps 5.Capture INS data @ 30/sec (simultaneously) Supplied Components Customer Needs Met 6.External INS units 7.Data processing (overlay) 8.Real time viewing 9.Store full-res. Data during flight 10. Support NovAtel GNSS board

10 Electronic System

11 1.Integrate supplied components A.10MP Visual Band Camera B.1.3MP IR Camera C.Spatial Sensors i.NovAtel OEM Board OEMV3 ii.NovAtel OEM Board OEMV2 D.Camera Processing Board 2.Capture data from two cameras 3.Capture 10MP @ 1fps 4.Capture 1.3MP @ 30fps 5.Capture INS data @ 30/sec (simultaneously) Camera Components Customer Needs Met 6.External INS units 7.Data processing (overlay) 8.Real time viewing 9.Store full-res. Data during flight 10. Support NovAtel GNSS board

12 Final Output 10mp Camera

13 Electronic System

14 1.Integrate supplied components A.10MP Visual Band Camera B.1.3MP IR Camera C.Spatial Sensors i.NovAtel OEM Board OEMV3 ii.NovAtel OEM Board OEMV2 D.Camera Processing Board 2.Capture data from two cameras 3.Capture 10MP @ 1fps 4.Capture 1.3MP @ 30fps 5.Capture INS data @ 30/sec (simultaneously) Camera Components Customer Needs Met 6.External INS units 7.Data processing (overlay) 8.Real time viewing 9.Store full-res. Data during flight 10. Support NovAtel GNSS board

15 Final Output CameraLink® IR camera

16 Electronic System

17 1.Integrate supplied components A.10MP Visual Band Camera B.1.3MP IR Camera C.Spatial Sensors i.NovAtel OEM Board OEMV3 ii.NovAtel OEM Board OEMV2 D.Camera Processing Board 2.Capture data from two cameras 3.Capture 10MP @ 1fps 4.Capture 1.3MP @ 30fps 5.Capture INS data @ 30/sec (simultaneously) Spatial Sensing Customer Needs Met 6.External INS units 7.Data processing (overlay) 8.Real time viewing 9.Store full-res. Data during flight 10. Support NovAtel GNSS board

18 Output INS data format # of shot, (FLIGHT INFORMATION, Pitch, ect….) 675,495060.000000,39.377116,-82.774721,1442.237213,177.966706,-6.573488,87.156026 676,495063.000000,39.375698,-82.773364,1437.212509,178.655193,-2.978762,89.591399 677,495066.000000,39.374288,-82.771967,1432.054779,177.896426,-3.434334,92.544970 678,495069.000000,39.372892,-82.770509,1428.557648,177.391126,-12.302477,92.517868 679,495072.000000,39.371514,-82.768882,1425.166306,178.138512,-9.035039,88.154010 680,495075.000000,39.370128,-82.767133,1425.035141,176.875920,-1.502685,89.783104 681,495078.000000,39.368761,-82.765407,1424.326828,176.056416,-6.737449,90.066296 682,495081.000000,39.367471,-82.763622,1421.768311,175.569431,-7.973052,88.809422 683,495084.000000,39.366537,-82.761748,1427.402252,176.045872,-7.985133,86.404080

19 Electronic System

20 1.Integrate supplied components A.10MP Visual Band Camera B.1.3MP IR Camera C.Spatial Sensors i.NovAtel OEM Board OEMV3 ii.NovAtel OEM Board OEMV2 D.Camera Processing Board 2.Capture data from two cameras 3.Capture 10MP @ 1fps 4.Capture 1.3MP @ 30fps 5.Capture INS data @ 30/sec (simultaneously) Processing elements Customer Needs Met 6.External INS units 7.Data processing (overlay) 8.Real time viewing 9.Store full-res. Data during flight 10. Support NovAtel GNSS board

21 OEM Digital Signal Processing Board Signal Processing already done on Customer Supplied Interface. – Image overlay – Compression – Resolution of Images Outputs – 10/100 Ethernet – S-Video Software interface available

22 OEM Board

23 Electronic System

24 FPGA Board Diagram

25 FPGA Board to Scale

26 1.Integrate supplied components A.10MP Visual Band Camera B.1.3MP IR Camera C.Spatial Sensors D.Camera Processing Board 2.Capture data from two cameras 3.Capture 10MP @ 1fps 4.Capture 1.3MP @ 30fps 5.Capture INS data @ 30/sec (simultaneously) Processing elements Customer Needs Met 6.External INS units 7.Data processing (overlay) 8.Real time viewing 9.Store full-res. Data during flight 10. Support NovAtel GNSS board

27 FPGA Inputs/Outputs Flexible Architecture Faster Speed Parallel Processing DSP Energy Efficient Single Pipeline Easy Implementation Math based ISA Processing Elements

28 DSP Customer programmable – Encoding/Decoding media – Peripherals Role in this design – Image compression – Real time streaming of data – INS interface Required skills – Implementable Knowledge of C – DSP/BIOS

29 FPGA FPGA Selection – Quicker time to fabrication – Supreme configurability/Field reprogrammable – Has the I/O needed – Parallel processing

30 FPGA Xilinx Selection – Resources available to the team – Larger range of choices than other companies – Customer preference Model XC6SLX75T Selection – Package size (23mm x 23mm) – High speed transceiver count – I/O pin count – Cost effectiveness

31 FPGA Board Diagram

32 Data Flow – Initial Design Pictures Camera  FPGA  OEM INS Data INS  OEM

33 Data Flow – Final Design Pictures Camera  FPGA  OEM Camera  FPGA  HD INS Data INS  OEM  FPGA  HD

34 Data Speeds **Note: baud = bits per second (RS-232) Image – IR: 30 images / second VGA=640x480 9.2 MHz – Visible :1 image / second 10.7MP=3664x2748 10.07 MHz INS – 30 captures / second 1kB=8kb 8000 baud

35 FPGA Pin Speeds Minimum values – 13ns -> 76 MHz – 5ns -> 200 MHz

36 System Software Design

37 FPGA Image Controller

38 Image Data Input

39 System Software Design

40 FPGA Central Dispatch

41 External Interfaces and the Connector Board Interfaces Specified Originally 2x Camera Link camera2x Gigabit Ethernet camera Power Supply (9V to 36V)10/100 Ethernet External Inertial Navigation System Power Supply Power Supply External INS 2x GigE 2x Camera Link 10/100 Ethernet Connector Board D3 OEM Board

42 External Interfaces and the Connector Board Final Interfaces Specified 2x Camera Link camera2x GigE camera Power Supply (9V to 36V)10/100 Ethernet External Inertial Navigation SystemRCA output USB port Power Supply Power Supply 2x Camera Link External INS RCA output USB port 2x GigE 10/100 Ethernet Connector Panel

43 External Interfaces and the Connector Board Goal: – All interfaces routed through and mounted on the Connector Board Reality: – Various different mountings and routings necessary

44 Interface Routing and Connector Mounting Through the Connector BoardRouted Elsewhere Board Mount 2x Camera Link camera2x GigE camera Panel Mount Power Supply (9V to 36V)10/100 Ethernet External INSRCA output USB port Power Supply 2x Camera Link External INS 2x Camera Link = nearly full width of Connector Board Connector Panel

45 Interface Routing and Connector Mounting Through the Connector BoardRouted Elsewhere Board Mount 2x Camera Link camera2x GigE camera Panel Mount Power Supply (9V to 36V)10/100 Ethernet External INSRCA output USB port 2x GigE GigE mounted on FPGA Board FPGA Board (bottom view) Connector Panel

46 Interface Routing and Connector Mounting Through the Connector BoardRouted Elsewhere Board Mount 2x Camera Link camera2x GigE camera Panel Mount Power Supply (9V to 36V)10/100 Ethernet External INSRCA output USB port RCA output 10/100 Ethernet 10/100 Ethernet D3 OEM Board (top view) RCA and 10/100 Ethernet routed directly to D3 OEM Board RCA Connector Panel 10/100 Ethernet

47 Through the Connector BoardRouted Elsewhere Board Mount 2x Camera Link camera2x GigE camera Panel Mount Power Supply (9V to 36V)10/100 Ethernet External INSRCA output USB port Interface Routing and Connector Mounting USB port Connector Panel USB routed directly to internal GNSS receiver

48 The Connector Board Having determined what it needs to do, design could commence Customer Provided Block Diagram

49 Connector Board Design: Functional Block Diagram

50 Connector Board Design: Scale Diagram

51 Inertial Navigation System (INS) Determines: – Direction Roll, pitch & yaw – Velocity Inertial Measurement Unit (IMU) – Location Global Navigation Satellite System (GNSS) – Global Positioning System (GPS) – GLONASS

52 Global Navigation Satellite System Customer Specified – NovAtel OEMV-2 or OEMV-3 RS-232 interface Different power requirements OEMV-2: 3.3 +5% / -3% V DC OEMV-3: 4.5 to 18 V DC

53 GNSS Software

54 Chassis Interfaces Interface to Plane Small Passenger AircraftRIT U.A.V. Airframe “C” Mountable to a flat plateMountable to a flat wooden base Smaller than a person; Approx 2’ x 2’ x 5’6” tall Less than 16” x 6.5” x 5” tall Less than 150lbs (68kg)Less than 15lbs (6.8kg)

55 Chassis Interfaces Interface to Plane 10.25” Long 6” Wide 6.5” Tall 10.9lbs

56 Chassis Interfaces Interface to Plane ComponentWeight (lbs) Electronics0.91 Electronics Enclosure3.43 Optics2.15 Optics Enclosure4.32 Total11 lbs (Approximate)

57 Chassis Interfaces D3 OEM BoardNovAtel OEMV-3FPGA BoardConnector BoardSolid State Hard Drive (Not Pictured)

58 Chassis Interfaces

59 Camera BoardsLinos Mevis-C Lenses (16 mm) MicroStrain IMU

60 Chassis Interfaces

61 Vibration Damping Two sources of need: 1.Insure structural integrity under vibration 2.Minimize image distortion Item 1 must be tested for, but item 2 can be calculated and designed for.

62 Vibration Damping Characterized per RTCA DO-160 Frequency Range: 5 – 500 Hz Amplitude Range: 0.00001 – 0.1 inches 3 Primary Axes

63 Vibration Damping Image distortion depends on: – Aircraft Speed – Aircraft Altitude – Lens Image Angle – Shutter Speed

64 Vibration Damping Speed induced by vibration taken as derivative of vibration motion profile Profile: X = A·sin(F·t) Speed: X’ = A·F·cos(F·t)

65 Vibration Damping Maximum Aircraft Speed: 36 m/s Maximum Vibration Speed: 1.27 m/s Altitude (ft) Speed Distortion (Pixels) Vibration Distortion (Pixels) 1000 0.660.0233 1500 0.440.0155 2000 0.330.0116 5000 0.130.0047

66 Environmental Needs Maintain internal temp within operating temp of components Optics: 10 Mp cameras » -40 < 0 < 70 Electronics (all temps in  C) FPGA » 0 < T < 85 Connector Board » 0 < T < 70 D3 supplied OEM Board » -40 < T < 85 – Electronics Range 0  C < T < 70  C

67 Environmental Needs Allow for standard Environmental conditions as defined by MIL-STD-810G and DO- 160 Temperature Range: -32C to 45 C (on ground) Humidity: 90%

68 Power Requirements of Devices Voltage Line (Volts) DSP (Amps) FPGA (Amps) SATA (Amps) DDR2 (Amps) INS (Amps) Cameras (Amps) SPI (Amps) Total Current/Voltage (Amps) 12004.50000 50.504.500.42005.42 3.300.54.50000.1045.104 2.50TBD00000 1.80100.27600.7101.986 1.201000001 Total Current/Device (Amps)0.52.513.50.2760.420.710.104 18.01 MAX POWER= 102.78W

69 Environmental Management: Heat Major sources of heat generation inside chassis – Hard drive about the half the heat produced comes from this – Voltage Regulator – FPGA – DSP Net Heat generated by system can be estimated using the net power input to the system

70 Environmental Management: Heat Transfer analysis Heat Transfer model: assuming a steady state Radiation – Least efficient mode – Model as black body From electronics to chassis From chassis to external environment – Model dependant primarily on surface area of components q rad T Chassis T Ambient

71 Environmental Management Heat Transfer: radiation model Treat enclosure as a black box radiating heat to the outside air – Neglect Convection Protected from moving air – Neglect Conduction Temperature at surface of chassis = temperature inside of chassis Heat radiating from chassis is 50% of heat radiating from boards (q c =.5q b ) Board stack Chassis wall q chassis q board T chassis T boards T ambient T chassis

72 Environmental Management Heat Transfer: radiation model Used a ‘double’ radiation model Radiation from electronics to chassis wall Radiation from chassis wall to outside environment – Combined the two models into one by assuming an efficiency between the heat transfer rate of the electronics and the chassis wall External environment Internal environment t  ground  C  P gen (w) T boards Final (°C) -320-51.93 -325-23.10 -3210-1.78 -322030.04 -322542.79 -325090.74 -3270118.75 -32100152.00 45025.06 45538.41 451050.23 452070.61 452579.57 4550116.48 4570139.88 45100168.90

73 Environmental Management Heat Transfer: radiation model ‘Safe zone’ between ~ 10 and ~ 30 W

74 Environmental Management : Humidity dew point: should we be concerned with condensation? Temperature at which water will condense on a surface – Function of ambient temperature and relative humidity – Used to determine whether additional steps should be taken to control temperature/ humidity inside the chassis. Conclusion: Condensation will not be a big problem – May run into trouble at very high humidities (above 80%) Dew point is very close to air temperatures environmental data dew point solution relative humidity (%) t  air  c  dew point ( C) 1-51.7815-83.236 40-51.7815-58.846 50-51.7815-57.167 80-51.7815-53.544 90-51.7815-52.617 125.21848-34.858 4025.2184810.652 5025.2184814.052 8025.2184821.519 9025.2184823.459

75 Environmental Management dew point: should we be concerned with condensation? Some environmental management techniques may be valuable to prevent condensation at high humidities – Main options: include a heating system to keep temperature inside the chassis above dew point reduce humidity inside the chassis to lower the dew point inside the chassis » a common method : silica gel packs condensation control selection matrix Heater system silica gel pack weightrankwith weightrankwith weight effective at reducing/preventing condensation52102 simplicity in manufacturing/implimentation3-313 reusability12222 allows for flexability as heat requirements change41428 allows for air/water tight enclosure22448 total: 17 27

76 RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday November 6, 2009 9:00am to 11:00am

77 RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday November 6, 2009 9:00am to 11:00am

78 RIT Senior Design Project 10662 D3 Engineering Camera Platform Friday November 6, 2009 9:00am to 11:00am


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