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SMART Piezoelectric&MEMS-based Devices/Applications

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Presentation on theme: "SMART Piezoelectric&MEMS-based Devices/Applications"— Presentation transcript:

1 SMART Piezoelectric&MEMS-based Devices/Applications

2 MEMs-based imaging device for the diagnostic of arthritic diseases.
All of you have certainly heard about the « GOUT » disease historically known as «Rich man’s disease » owing to overindulgence in certain foodstuffs (meat & alcohol) this is in fact caused by kidney inability to excrete uric acid so this crystallizes in joints and causing an onset of inflammatory arthritis. Arthritis is a complex condition that covers a wide range of disorders and the only common feature is joint inflammation characterized by stiffness, swelling and redness of the affected area. Traditionally this is regarded as a disease of the elderly, arthritis can affect a range of age groups and the mechanism that induce it can just be as varied. In Iacobus project we aim at developing multimodal diagnostic tool that will combine NIR Hyperspectral, Ultrasonic and Photoacoustic imaging. MEMs-based imaging device for the diagnostic of arthritic diseases. This work is funded under FP7 programme « IACOBUS », EC Grant Agreement / HEALTH Contact: Nicolas SENEGOND

3 (project coordinator : Fraunhofer IBMT)
Outlook IACOBUS project (European FP7 funding program) : Diagnosis and monitoring of Inflammatory and Arthritic diseases using a COmbined approach Based on Ultrasound, optoacoustic and hyperSpectral imaging (project coordinator : Fraunhofer IBMT) Objective: improvement of the diagnosis of arthritis Development of a 3D imaging system combining photoacoustics & echographic for finger joint imaging. Development of the ultrasound system, laser sources & reconstruction algorithm (Fraunhofer IBMT) Development of the smart multi-modality ultrasonic probe (VERMON)

4 Specifications Geometry Transducer 4 Tile portions :
2 « Grand Tiles » of 30mm RoC including 256 trx channels 2 « Small Tiles » of 15mm RoC including 128 trx channels TRX maximum thickness = 6 mm Translation of the 4 arcs for 3D reconstruction Transducer Central frequency MHz Inter-element pitch 150 µm Elevation H = 3 mm Transverse focus = 12 mm

5 Mechanical design General view Translation axes
Probes are entirely immersed in a water tank Material used for housing : anodised aluminum Maximum thickness of each Tile: 6 mm Water tank Laser sources Finger holder Finger spacer

6 Mechanical design (1/2) “Grand Tiles” Preamp boards
8 x 32 (256) element array cMUT 4 x 64 (256) channels pre-amp PCBs per Tile Coax cable for 256 channel driving + cable for pre- amp supplying and bias voltage for cMUTs 32 element cMUT array

7 Mechanical design (2/2) “Small Tiles” 4 x 32 (256) element array cMUT
2 x 64 (256) channels pre-amp PCBs per Tile Both Tiles are connected together with a single 256 coax cables 32 element cMUT array Pre-amp PCB

8 capacitive Micromachined Ultrasonic Transducer (cMUT)
Features A Multiscale Device : Reversible Operations: 40 mm CMUT device CMUT element CMUT cell 300 µm 20 µm Transmit mode Vdc+Vac Movable electrode Vacuum gap Ultrasonic wave Receive mode Vdc ∆u ∆c

9 cMUT design Batch of simulations (FDM taking into account mechanical, electrostatic & acoustic) Layout design of the masks of photolithography Process used : sacrificial layer process Wafers processed by specialised MEMS foundries BW & central frequency simulation Directory simulation CAD design Wafer fabrication

10 Characterization Dimensioning control Z-Profile measurement
Impedance measurement

11 Pre-amp circuitry design
Top view Bottom view 8 channel preamplifier chipset Passive components Connectors to cable Connection with flex Preamp-board 1 board = preamplification of 64 channels Sizes 12,5 mm*153 mm Thickness of the board 0,8 mm Thickness with electronic components = 2,65 mm Power supply box 3 channels power supply box Provide DC voltages for preamplifier and bias voltages for cMUTs Connection with probes : LEMO 14 points

12 Integration Singulation of the 32 elts cMUT chips from wafer
Test of devices : pulse echo measurement in oil BW, central frequency are characterized Interconnection : wirebonded on flexible board Packaging of cMUT chips: silicone rubber (<500µm) compatible with ultrasonic propagation Direct assembly on to pre-amp PCBs (pad/pitch: 75µm/75µm)

13 Current statement Ultrasound Probe with optical mounting available for end 2014. First imaging prototype system available early 2015 Preclinical test on 60 patients planned to start mid 2015

14 Low frequency vibrational Piezoelectric Energy Harvesters (PEH)
Contact: Guillaume FERIN

15 Energy Piezo-Harvester
Main piezoelectric harvesting technics Vibrations are everywhere and free Direct Stress/Strain energy harvesting Indirect external Vibrational harvesting using inertial forces D31 mode D33 mode DuraAct Patch Transducer - PI

16 State-of-the-art Topologies for Vibrational Energy Piezoelectric Harvesters. 13.9KHz Common flexural architectures D31 oriented unimorph, Multilayered serial or parallel bimorph D33 interleaved unimorph & bimorph Common topologies Cantilever (clamped/free) beams Bridges (clamped/clamped) Spirals Others Possible integration forms MEMS Macro device 204Hz Marzecki 2005 : d31 AlN Cant. Jeong 2005 : d33 PZT Cant. 608Hz 1.3KHz FANG 2006 : d31 PZT Cant. Marzecki 2007 : d31 AlN Cant. 200Hz 200Hz Renaud 2007 : d31 PZT Cant. Dong 2008 : Spiral d31 PZT

17 Fabrication X50 Bulk PZT Metallic shim material
Surface roughness (PZT) Optical Thickness control Poling and electrode plating Bulk PZT Metallic shim material Advanced Polymer bonding CONFIDENTIAL

18 Performance (88.0Hz, 1.57MΩ) (85.8Hz, 23kΩ)
Test bench for electrical impedance measurement and harmonic mechanical solicitation W/WO Tip mass Clamping pressure monitored to avoid softening effects Free circulating air (no softening recorded) Polycrystalline PZT ceramic PMN-PT [011] Single Crystal (With no Tip Mass) 1 G max uniaxial acceleration (gravity direction) Electrical load 100kOhms

19 Medical Implants.. Heart as a mechanical source Power output
Direct conversuin (external patchs) Hear wall vibrational (external or internal capsules Power output >10µW continuous mean power delivery Up to 2.5V mean voltage Quality standards & requirements 20-25 years durability Comply with ISO60601 standards on active implantable medical devices Biocompatibility Electrical safety Key developments -Vibrational piezoelectric energy harvester MUST be : Highly reliable No damageable Long lifetime >25years Highly efficient high power density Works in every position Great Integrability Miniaturization Compatible with MEMS & CMOS process “Implantable vibrational low Frequency energy harvester”, VERMON “Conformal piezoelectric energy harvesting from motions of the heart, lung, and diaphragm” C. Dagdeviren, 2014

20 SHM Applications.. Vibrational piezoelectric energy harvester MUST have : High reliability No damageable: Embedded in structures if possible & Forget: Long lifetime >30years Harsh environment (-40/+50°C) Efficiency high power density or multiple harvester hosting architectures : Stackable PEH Works in every position (multi- axis approach) Cost : below battery costs FAA Technical center, William J. Hugues

21 Embedded Autonomous Sensing
General specifications Aircraft vibration source Harvesting frequency range from 10 to 50Hz 1 mm max displacement 1G max available acceleration Goals : save maintenance costs 10b$ a year for all airlines companies 35% could be saved with autonomous sensors Geometrical specs Flat enough to be embedded into composite sandwiches between foams and skins Compatible with internal composite stress/strain Flaws detection and localization Passive acoustic or LRU sensors for guided wave processing Other inertial sensors Autonomous acoustic sensor nodes

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