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SMART Piezoelectric&MEMS-based Devices/Applications An NGUYEN-DINH

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Presentation on theme: "SMART Piezoelectric&MEMS-based Devices/Applications An NGUYEN-DINH"— Presentation transcript:

1 SMART Piezoelectric&MEMS-based Devices/Applications An NGUYEN-DINH

2 MEMs-based imaging device for the diagnostic of arthritic diseases. This work is funded under FP7 programme « IACOBUS », EC Grant Agreement / HEALTH Contact: Nicolas SENEGOND

3 Outlook IACOBUS project (European FP7 funding program) : Diagnosis and monitoring of Inflammatory and Arthritic diseases using a COmbined approach Based on Ultrasound, optoacoustic and hyperSpectral imaging (project coordinator : Fraunhofer IBMT) Objective: improvement of the diagnosis of arthritis Development of a 3D imaging system combining photoacoustics & echographic for finger joint imaging. Development of the ultrasound system, laser sources & reconstruction algorithm (Fraunhofer IBMT) Development of the smart multi-modality ultrasonic probe (VERMON)

4 Specifications Geometry 4 Tile portions : 2 « Grand Tiles » of 30mm RoC including 256 trx channels 2 « Small Tiles » of 15mm RoC including 128 trx channels TRX maximum thickness = 6 mm Translation of the 4 arcs for 3D reconstruction Transducer Central frequency MHz Inter-element pitch 150 µm Elevation H = 3 mm Transverse focus = 12 mm

5 Mechanical design Water tank Finger holder Finger spacer General view Probes are entirely immersed in a water tank Material used for housing : anodised aluminum Maximum thickness of each Tile: 6 mm Laser sources Translation axes

6 Mechanical design (1/2) “Grand Tiles” 8 x 32 (256) element array cMUT 4 x 64 (256) channels pre-amp PCBs per Tile Coax cable for 256 channel driving + cable for pre- amp supplying and bias voltage for cMUTs 32 element cMUT array Preamp boards

7 Mechanical design (2/2) “Small Tiles” 4 x 32 (256) element array cMUT 2 x 64 (256) channels pre-amp PCBs per Tile Both Tiles are connected together with a single 256 coax cables 32 element cMUT array Pre-amp PCB

8 capacitive Micromachined Ultrasonic Transducer (cMUT) Features A Multiscale Device : Reversible Operations: Transmit mode Vdc+ Vac Movable electrode Vacuum gap Ultrasonic wave Receive mode Ultrasonic wave Vdc ∆u ∆c 40 mm CMUT device CMUT element CMUT cell 300 µm 20 µm

9 cMUT design Batch of simulations (FDM taking into account mechanical, electrostatic & acoustic) Layout design of the masks of photolithography Process used : sacrificial layer process Wafers processed by specialised MEMS foundries BW & central frequency simulation CAD design Wafer fabrication Directory simulation

10 Characterization Z-Profile measurementDimensioning control Impedance measurement

11 Pre-amp circuitry design Preamp-board 1 board = preamplification of 64 channels Sizes 12,5 mm*153 mm Thickness of the board 0,8 mm Thickness with electronic components = 2,65 mm Top view Bottom view 8 channel preamplifier chipset Passive components Connectors to cable Connection with flex Power supply box 3 channels power supply box Provide DC voltages for preamplifier and bias voltages for cMUTs Connection with probes : LEMO 14 points

12 Integration Singulation of the 32 elts cMUT chips from wafer Test of devices : pulse echo measurement in oil BW, central frequency are characterized Interconnection : wirebonded on flexible board Packaging of cMUT chips: silicone rubber (<500µm) compatible with ultrasonic propagation Direct assembly on to pre-amp PCBs (pad/pitch: 75µm/75µm)

13 Current statement Ultrasound Probe with optical mounting available for end First imaging prototype system available early 2015 Preclinical test on 60 patients planned to start mid 2015

14 Low frequency vibrational Piezoelectric Energy Harvesters (PEH) Contact: Guillaume FERIN

15 Energy Piezo-Harvester DuraAct Patch Transducer - PI Main piezoelectric harvesting technics Direct Stress/Strain energy harvesting Indirect external Vibrational harvesting using inertial forces D31 mode D33 mode Vibrations are everywhere and free VERMON - Advanced Research Dpt

16 State-of-the-art Topologies for Vibrational Energy Piezoelectric Harvesters. Common flexural architectures D31 oriented unimorph, Multilayered serial or parallel bimorph D33 interleaved unimorph & bimorph Common topologies Cantilever (clamped/free) beams Bridges (clamped/clamped) Spirals Others Possible integration forms MEMS Macro device Marzecki 2005 : d31 AlN Cant. Jeong 2005 : d33 PZT Cant. FANG 2006 : d31 PZT Cant. Marzecki 2007 : d31 AlN Cant. Dong 2008 : Spiral d31 PZT Renaud 2007 : d31 PZT Cant. 200Hz 204Hz 13.9KHz 608Hz 1.3KHz 200Hz

17 Fabrication CONFIDENTIALVERMON - Advanced Research Dpt Surface roughness (PZT)Optical Thickness control Poling and electrode plating  Bulk PZT  Metallic shim material  Advanced Polymer bonding X50

18 Performance (85.8Hz, 23kΩ) (88.0Hz, 1.57MΩ) Polycrystalline PZT ceramic PMN-PT [011] Single Crystal (With no Tip Mass) Test bench for electrical impedance measurement and harmonic mechanical solicitation W/WO Tip mass Clamping pressure monitored to avoid softening effects Free circulating air (no softening recorded) 1 G max uniaxial acceleration (gravity direction) Electrical load 100kOhms

19 Medical Implants.. Heart as a mechanical source Direct conversuin (external patchs) Hear wall vibrational (external or internal capsules Power output >10µW continuous mean power delivery Up to 2.5V mean voltage Quality standards & requirements years durability Comply with ISO60601 standards on active implantable medical devices Biocompatibility Electrical safety Key developments -Vibrational piezoelectric energy harvester MUST be : Highly reliable No damageable Long lifetime >25years Highly efficient high power density Works in every position Great Integrability Miniaturization Compatible with MEMS & CMOS process “Conformal piezoelectric energy harvesting from motions of the heart, lung, and diaphragm” C. Dagdeviren, 2014 “Implantable vibrational low Frequency energy harvester”, VERMON

20 SHM Applications.. Vibrational piezoelectric energy harvester MUST have : High reliability No damageable: Embedded in structures if possible & Forget: Long lifetime >30years Harsh environment (-40/+50°C) Efficiency high power density or multiple harvester hosting architectures : Stackable PEH Works in every position (multi- axis approach) Cost : below battery costs FAA Technical center, William J. Hugues

21 Embedded Autonomous Sensing General specifications Aircraft vibration source Harvesting frequency range from 10 to 50Hz 1 mm max displacement 1G max available acceleration Goals : save maintenance costs 10b$ a year for all airlines companies 35% could be saved with autonomous sensors Geometrical specs Flat enough to be embedded into composite sandwiches between foams and skins Compatible with internal composite stress/strain Flaws detection and localization Passive acoustic or LRU sensors for guided wave processing Other inertial sensors Autonomous acoustic sensor nodes

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