1. Chapter 1
Introduction to
Materials Science

2. Course Objectives properties & processing.
Introduce fundamental concepts in Materials
Science
Provide the interrelationships among structure,
properties & processing.

3. Learning Outcomes
At the end of this course the students should be able to:
Describe the classifications, structures & applications of metals, ceramics and polymers correctly.
Analyse deformations behavior and strengthening mechanisms relying to its structure & properties of materials clearly.
Apply Fick’s Law in calculating the diffusion process and its mechanism in solids properly.

4. Learning Outcomes
At the end of this course the students should be able to:
Demonstrate appropriate test methods in determining mechanical properties.
Apply the relation between composition, microstructure and properties of metallic materials by using apposite phase diagram and heat treatment process.

5. Course Synopsis
This course comprises the fundamentals of Materials Science and its applications, atomic structure, crystal structure, solidification, imperfections and solid diffusion, mechanical and physical properties, phase diagrams and transformation, synthesis, types and applications of materials.

6. Course References
Callister W. D., 2008, Fundamentals of Materials Science and Engineering, 3rd Edition, John Wiley & Sons.
Smith W. F., 2004, Foundation of Materials Science and Engineering, 4th Edition, McGraw Hill.
Shackleford J. F. , 2000, Introduction to Materials Science for Engineers, 5th Edition, Prentice Hall.
Budinski K. G. and Budinski M.G., 1999, Engineering Materials: Properties and Selection, 6th Edition, Butterworth-Heinemann UK.
Askeland D. R., 1994, The Science and Engineering of Materials, 3rd Edition, PWS Publication Co.

7. Tutorial/Lab. Sections
Lectures
Lecturer: Wan Mohd Farid bin Wan Mohamad
Time: 8 – 10 a.m (Tuesday)
Place: BK 3, Fasa B
Tutorial/Lab. Sections
Group 1
Lecturer: Wan Mohd Farid
Time: 2 – 5 p.m (Tuesday)
Place: BK 1/MSTB
Group 2
Lecturer: Sushiela Edayu
Time: 2 – 5 p.m (Monday)
Place: MCS /MSTB
Technician (G1 & G2)
Mahader bin Muhamad

8. Course Evaluations Criteria % Test 15 Assignment 5 Quiz Laboratory 12
Course work
Test
1 Test (1½ hour) 15
Assignment
1 assignment
Will be submitted 4 weeks after tutorial
1 Group presentation (week 15) 5
Quiz
2 Quizzes
Laboratory
3 Informal Group Reports (hand written)
Will be submitted 3 days after lab session 12
1 Formal Individual Report (hand written)
Will be submitted 1 week after lab session 8
Final examination
Exam
1 Final Exam (2 ½ hours) 40
Total
100

9. Hari Raya Aidilfitri Break
Course Schedules
Week
1,2
3,4
5,6 7
8,9
10,11 12
13,14 15 16
17,
18,19,20
Topic
General Intro; Atomic Structure & Bonding
Crystalline Structures; Polymers
Defects; Diffusion
Mid-Semester Break
Mechanical Properties; Strength Mechanisms
Failure; Phase Diagrams
Hari Raya Aidilfitri Break
Phase Transform; Appl. of Materials
Physical Properties
Revision & Group presentation
Study week
Final exam
Chapter
1,2
3,4
5,6
7,8
9,10
11,12 13
Lectures: will highlight important portions of each chapter.

10. General Introduction What is materials science?
Why should we know about it?
Materials drive our society
Stone Age
Bronze Age
Iron Age
Now?
Silicon Age?
Polymer Age?

11. Example – Hip Implant
With age or certain illnesses joints deteriorate. Particularly those with large loads (such as hip).
Adapted from Fig , Callister 7e.

12. Example – Hip Implant Requirements mechanical strength (many cycles)
good lubricity
biocompatibility
Adapted from Fig , Callister 7e. 12

13. Example – Hip Implant
Adapted from Fig , Callister 7e. 13

14. Hip Implant Key problems to overcome Ball
fixation agent to hold acetabular cup
cup lubrication material
femoral stem – fixing agent (“glue”)
must avoid any debris in cup
Ball
Acetabular
Cup & Liner
Femoral
Stem
Adapted from chapter-opening photograph, Chapter 22, Callister 7e. 14

15. Structure, Processing, & Properties
• Properties depend on structure
ex: hardness vs structure of steel
martensitic
(d)
30 mm 6 00
tempered martensite
pearlite + proeutectoid ferrite 5 00
(c)
4 mm
spheroidite
Data obtained from Figs (a)
and with 4 wt% C composition,
and from Fig and associated
discussion, Callister & Rethwisch 3e.
Micrographs adapted from (a) Fig.
11.19; (b) Fig ;(c) Fig ;
and (d) Fig , Callister & Rethwisch 3e. 4 00
(b)
30 mm
(a)
30 mm
Hardness (BHN) 3 00 2 00
100
0.01
0.1 1 10
100
1000
Cooling Rate (ºC/s)
• Processing can change structure
ex: structure vs cooling rate of steel 15

16. Types of Materials Metals:
Strong, ductile
High thermal & electrical conductivity
Opaque, reflective.
Polymers/plastics: Covalent bonding  sharing of e’s
Soft, ductile, low strength, low density
Thermal & electrical insulators
Optically translucent or transparent.
Metals have high thermal & electrical conductivity because valence electrons are free to roam
Ceramics: ionic bonding (refractory) – compounds of metallic & non-metallic elements (oxides, carbides, nitrides, sulfides)
Brittle, glassy, elastic
Non-conducting (insulators) 16

17. The Materials Selection Process1.
Pick Application
Determine required Properties
Properties: mechanical, electrical, thermal,
magnetic, optical, deteriorative. 2.
Properties
Identify candidate Material(s)
Material: structure, composition. 3.
Material
Identify required Processing
Processing: changes structure and overall shape
ex: casting, sintering, vapor deposition, doping
forming, joining, annealing. 17

18. ELECTRICAL • Electrical Resistivity of Copper: Resistivity, r T (°C)
-200
-100
Cu at%Ni
Cu at%Ni
deformed Cu at%Ni 1 2 3 4 5 6
Resistivity, r
(10-8 Ohm-m)
Cu at%Ni
“Pure” Cu
Adapted from Fig. 12.8, Callister & Rethwisch 3e. (Fig adapted from: J.O. Linde, Ann Physik 5, 219 (1932); and C.A. Wert and R.M. Thomson, Physics of Solids, 2nd edition, McGraw-Hill Company, New York, 1970.)
• Adding “impurity” atoms to Cu increases resistivity.
• Deforming Cu increases resistivity. 18

19. THERMAL • Space Shuttle Tiles: • Thermal Conductivity of Copper:
-- Silica fiber insulation
offers low heat conduction.
• Thermal Conductivity
of Copper:
-- It decreases when
you add zinc!
Adapted from chapter-opening photograph, Chapter 17, Callister & Rethwisch 3e. (Courtesy of Lockheed
Missiles and Space
Company, Inc.)
Composition (wt% Zinc)
Thermal Conductivity
(W/m-K)
400
300
200
100 10 20 30 40
100 mm
Adapted from
Fig. 19.4W, Callister 6e. (Courtesy of Lockheed Aerospace Ceramics Systems, Sunnyvale, CA)
(Note: "W" denotes fig. is on CD-ROM.)
Adapted from Fig. 17.4, Callister & Rethwisch 3e. (Fig is adapted from Metals Handbook: Properties and Selection: Nonferrous alloys and Pure Metals, Vol. 2, 9th ed., H. Baker, (Managing Editor), American Society for Metals, 1979, p. 315.) 19

20. OPTICAL • Transmittance:
-- Aluminum oxide may be transparent, translucent, or
opaque depending on the material structure.
single crystal
polycrystal:
low porosity
high porosity
Adapted from Fig. 1.2,
Callister & Rethwisch 3e.
(Specimen preparation,
P.A. Lessing; photo by S. Tanner.)
transparent translucent opaque 20

21. DETERIORATIVE • Heat treatment: slows • Stress & Saltwater...
-- causes cracks!
• Heat treatment: slows
crack speed in salt water!
“held at
160ºC for 1 hr
before testing”
increasing load
crack speed (m/s)
“as-is” 10
-10 -8
Alloy 7178 tested in
saturated aqueous NaCl
solution at 23ºC
Adapted from Fig (b), R.W. Hertzberg, "Deformation and Fracture Mechanics of Engineering Materials" (4th ed.), p. 505, John Wiley and Sons, (Original source: Markus O. Speidel, Brown Boveri Co.)
Adapted from chapter-opening photograph, Chapter 16, Callister & Rethwisch 3e.
(from Marine Corrosion, Causes, and Prevention, John Wiley and Sons, Inc., 1975.)
4 mm
-- material:
7150-T651 Al "alloy"
(Zn,Cu,Mg,Zr)
Adapted from chapter-opening photograph, Chapter 11, Callister & Rethwisch 3e. (Provided courtesy of G.H. Narayanan and A.G. Miller, Boeing Commercial Airplane Company.) 21

22. SUMMARY Course Goals: • Use the right material for the job.
• Understand the relation between properties,
structure, and processing.
• Recognize new design opportunities offered
by materials selection. 22

23. End of Chapter 1