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Welcome to HEAD Electronics BV 1 Corporate Presentation HEAD Electronics BV Presentation of HEAD Electronics BV.

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Presentation on theme: "Welcome to HEAD Electronics BV 1 Corporate Presentation HEAD Electronics BV Presentation of HEAD Electronics BV."— Presentation transcript:

1 Welcome to HEAD Electronics BV 1 Corporate Presentation HEAD Electronics BV Presentation of HEAD Electronics BV

2 Welcome to HEAD Electronics BV 2 Founded in 1987 by our director A. van Leeuwen Company privately held HEAD = Holland Electronics Advanced Development Started as component shop + design engineer Customer needs leads to grow in capabilities and in organisation Nowadays Electronic Manufacturing Services Company as a One Stop Shop for Industrial Electronics 45 employees, incl. partime Informal, flat structured organization, documented processes and improvements Supplier Overview History CultureHistory-Culture

3 Welcome to HEAD Electronics BV 3 FHI: Federatie Het Instrument Exhibition Electronics & Automation 2003 – 2012 Nevat: Nederlandse Vereniging Algemene Toelevering Member and secretary of the Technology-taskforce Managing the website for Technology-taskforce Supplier Overview History CultureMemberships

4 Welcome to HEAD Electronics BV 4 Electronics development Hardware Embedded software Pre-compliant EMC Assembling of electronics SMD Conventional Combination PCB-Intermediair Work preparation PCB Specification PCB Mechatronics Housings Wiring Coating Product Offerings Supplier Overview Product Offerings

5 Welcome to HEAD Electronics BV 5 One Stop Shop From idea to product Product-redesign and - engineering Purchasing of components PCB work preparation and purchasing Assembling of SMD and THT (trough hole) Prototyping, pre-production, series production Assemble in housing or system, cabling In-house testing of product and CE-EMC Deliveries on call (JIT) and as series Logistics, warehouse, outscoursing Service, upgrades and customer repairs Supplier Overview Product Offerings

6 Welcome to HEAD Electronics BV 6 HEAD Electronics BV Ambachtsweg AH Katwijk zh Tel. +31 (0) Fax. +31 (0) Supplier Overview Locations, Geografic Locations, Geografic

7 Welcome to HEAD Electronics BV 7 Industrial electronics Machinery factories Explosion Safety applications Measuring- & control equipment Led-solutions Power electronics Transportation Consumer electronics Markets served Supplier Overview Markets Served - Products & Geographic

8 Welcome to HEAD Electronics BV 8 Customer Service Capabilities Choose your own menu…  Project definition  Electronics development / Design  Project management / engineering support  Assembling of electronics  Mechatronics, wiring, coating etc.  Testing, test engineering  Logistics  After sales  Prototypes Supplier Overview Customer Service Capabilities Menu

9 Welcome to HEAD Electronics BV 9 1.Project definition (product, specification, planning etc) 2.Electronics development / design (by customer and/or HEAD) 3.Project management / engineering support (work preparation PCB & BOM, documenting, overall view, etc) 4.PCB assembly (SMD, THT, manual soldering, etc.) 5.Mechatronics (total assemblies, wiring, coating etc.) 6.Testengineering (AOI, EMC, X-ray etc) 7.Purchase & Logistics (forecast, purchasing, storage, consignment, etc.) 8.After sales (upgrades, changes, customer repairs, etc) 9.Prototyping & pre-production (hand + machine & machine) Supplier Overview Customer Service Capabilities Menu explained Customer Service Capabilities

10 Welcome to HEAD Electronics BV 10 1.Defining a project (enquiry, requirements, specs, etc) 2.Calculation (BOM, labour, machine costs, etc) 3.Specification (PCB, BOM, etc.) 4.Planning (lead times) 5.Purchase preparation (BOM + planning in MRP) 6.Terms & conditions (general, planning, warranty, payments, etc)  QUOTATION + ORDER + ORDER CONFORMATION Manufacturing Capabilities Menu Project Definition Project Definition

11 Welcome to HEAD Electronics BV 11 Project Definition - RFQ Manufacturing Capabilities Menu Project Definition RFQ

12 Welcome to HEAD Electronics BV 12 Electronics Development Manufacturing Capabilities Menu Development / Design From idea to functioning product Balancing development vs. product costs Specification Hardware Embedded software Availability of components Costprice components Production friendly Programming & testing CE, EMC pre-compliant Working prototype TPD Technical Product Documentation

13 Welcome to HEAD Electronics BV 13 Project Management Manufacturing Capabilities Menu Project Management General Customer partnership Operations management Project management Quality management Work preparation PCB/BOM Documentation in AEGIS Logistics, purchase, storage Outsourcing Planning, controlling Cost control, invoicing

14 Welcome to HEAD Electronics BV 14 Work Preparation PCB Manufacturing Capabilities Menu Project Management Work Preparation PCB Panellizing and specification before purchasing: PCB data Multilayer PCB Panelization with CAM350 Design/edit with Pulsonics Own internet tool for PCB specification Enquire PCB-quotations Prepare purchase of PCB’s

15 Welcome to HEAD Electronics BV 15 Work Preparation BOM Manufacturing Capabilities Menu Project Management Work Preparation BOM

16 Welcome to HEAD Electronics BV 16 Work Preparation Machines Manufacturing Capabilities Menu Project Management Work Preparation Machines

17 Welcome to HEAD Electronics BV 17 Work Preparation Documentation Manufacturing Capabilities Menu Project Management Work Preparation Documentation (MOS) Documentation in AEGIS MOS = Manufacturing Operations Software

18 Welcome to HEAD Electronics BV 18 Floor Documentation Manufacturing Capabilities Menu Project Management Floor Documentation Shop Floor paperless by AEGIS

19 Welcome to HEAD Electronics BV 19 Electronics Assembling Surface Mounted Devices Manufacturing Capabilities Menu Electronics Assembling SMD Fast, flexible and accurate Samsung CP series SMD Placing SMD-components to 0402 Finepitch QFP 0,4 mm Finepitch (µ)BGA Prepared for intelligent feeders Up to 60k components / hour Soltec My Reflow 10 zone Reflow Oven DEK Horizon 2 screenprinter

20 Welcome to HEAD Electronics BV 20 Electronics Assembling Surface Mounted Devices Manufacturing Capabilities Menu Electronics Assembling SMD Close up

21 Welcome to HEAD Electronics BV 21 Electronics Assembling Surface Mounted Devices Manufacturing Capabilities Menu Electronics Assembling SMD Barcode

22 Welcome to HEAD Electronics BV 22 Electronics Assembling Surface Mounted Devices Manufacturing Capabilities Menu Electronics Assembling SMD network C pF C PF C pF C PF ETHERNET (TCP/IP) FEEDER-STATION DATABASE SERVER BARCODE PRINTER REEL BARCODE READER REEL BARCODE READER SM FEEDER DOCKING-CART Feeder ID Reading Feeder Event (insert, remove, …) MACHINE DeviceNet PART-STATION

23 Welcome to HEAD Electronics BV 23 Manufacturing Capabilities Menu Electronics Assembling Conventional Electronics Assembling Conventional Components Component preparation as cut, bend etc. Placing of all remaining components Soldering of the leaded components End-assembling, built in housings Programming and loading of software Routine testing Packing, labeling

24 Welcome to HEAD Electronics BV 24 Electronics Assembling Conventional Components Manufacturing Capabilities Menu Electronics Assembling Conventional Close up

25 Welcome to HEAD Electronics BV 25 Electronics Assembling Wave Soldering Manufacturing Capabilities Menu Electronics Assembling Conventional Wave Soldering Wave soldering N2 with the Soltec “Deltawave” (leaded) In-line wave soldering N2 met EPM IBL (RoHS)

26 Welcome to HEAD Electronics BV 26 Electronics Assembling Selective Soldering Selective soldering with the Soltec My Selective 6745 (RoHS) Manufacturing Capabilities Menu Electronics Assembling Conventional Selective Soldering

27 Welcome to HEAD Electronics BV 27 Electronics Assembling Mechatronics / Total Assembly Cleaning of PCB’s Coating of PCB’s Potting of PCB’s Cabling in house or outsourced Total assemblies, housing, 19” racks etc. Burn-in test Manufacturing Capabilities Menu Electronics Assembling Mechatronics

28 Welcome to HEAD Electronics BV 28 Electronics Assembling Cleaning & Coating Manufacturing Capabilities Menu Electronics Assembling Mechatronics Cleaning & Coating

29 Welcome to HEAD Electronics BV 29 Test, Test Engineering Manufacturing Capabilities Menu Test, Test Engineering PCB: Visual, probe tester, sleeves /microscope SMD: AOI (Viscom), X-ray (Dage 2 M pixel) CE- precompliant EMC Product: Visual, Functional, In-circuit, self-test, climate-test Realization of project test tools with customers

30 Welcome to HEAD Electronics BV 30 Logistics - Storage Manufacturing Capabilities Menu Logistics Storage Year order, rolling forecast, MRP Purchasing and incoming goods Identification / inspection (ATEX) / part storage Packing following instructions, ESD measures Storage half and end products, consignation

31 Welcome to HEAD Electronics BV 31 Logistics - Transportation Manufacturing Capabilities Menu Logistics Transportation Just in time, track and trace Destinations to customer and endcustomer Transportation boxes with UPS in NL, UK (Europe) Pallet Benelux with Wesseling Transport Sassenheim Worldwide via expedition centres, airport etc.

32 Welcome to HEAD Electronics BV 32 After Sales Service Manufacturing Capabilities Menu After Sales Service After sales service, upgrades, customer repair For hard- and software During the lifecycle of your product Redesign and use of other/newer parts Spare parts, obsolete part replacements

33 Welcome to HEAD Electronics BV 33 Manufacturing Capabilities Menu Series / Proto Types Series / Proto Types Production series Mid serie k pcb’s Pre-production series pcb’s Prototypes 1-10 pcb’s Prototyping Manual Partly SMD-line Paste stencil + reflow oven With components from the series or specific small volume PO’s from Farnell, Digikey etc.

34 Welcome to HEAD Electronics BV 34 Manufacturing Quality Management Quality Management ISO 9001: 2008 accredited management system Scope Head Electronics BV: “Design and manufacturing of printed circuit boards and assemblies, Incl. SMD production. Design and manufacturing of electronic end products”. Quality manual: MSH Head electronics IPC 6XX / IPC 4101B: Bare Printed Circuits Boards Assembling of PCB’s Cabling Repair activities EU-Regulations: RoHS, REACH by Manufacturer (assembling) (CE/ WEEE) by Producer (market)

35 Welcome to HEAD Electronics BV 35 Your contact persons HEAD Contactpersons Managing Director: Arie van Leeuwen Marketing & Sales: Eric Verkerke Operations & Finances: Arjan van der Ploeg Production: Wim de Boer Head Electronics BV Ambachtsweg AH Katwijk ZH tel.: fax.: Internet:

36 Welcome to HEAD Electronics BV 36 Next steps ……. HEAD Next Steps …… Moving aHEAD for you!


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