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0 Jay Chen 2014/10/23 集成电路设备发展的考量与思索 陈捷 Jay Chen 东电电子(上海)有限公司 总裁 2014北京微电子国际研讨会.

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Presentation on theme: "0 Jay Chen 2014/10/23 集成电路设备发展的考量与思索 陈捷 Jay Chen 东电电子(上海)有限公司 总裁 2014北京微电子国际研讨会."— Presentation transcript:

1 0 Jay Chen 2014/10/23 集成电路设备发展的考量与思索 陈捷 Jay Chen 东电电子(上海)有限公司 总裁 2014北京微电子国际研讨会

2 1 Jay Chen 2014/10/23 3 New waves expanding Semiconductor market Social Networking, Big DataC Expanding applications Automotive, Environment, EHS care, Education Increasing semiconductor content ratio Emerging countries Geographical expansion Semiconductor market trend

3 2 Jay Chen 2014/10/23 Electronics IP & Fabless IDM, Foundry & OSAT WFE Wafer Fab Equipment 未来蓝图离不开全球 IC 产业链的持续贡献 Hierarchy of The Semiconductor Industry IDM: Integrated Device Manufacturer OSAT:Outsource Assembly and Test US$1,493B Semiconducto r US$316B US$27B

4 3 Jay Chen 2014/10/23 Device Technology Drive Equipment Development More Moore Functional Diversification CMOS Scaling New Material New Structure Advanced Packaging (3DI / WLP) 3DI Strained Si High-k Metal Gate Cu/ULK FinFET Patterning ArF ArF-Immersion EUV Source :TEL based on ITRS DP/MP Carbon Tr. / CNT SiGe / III-V NIL, EBDW Flip-Chip 2.5D Wire-Bonding Si Photonics Homogeneous 450mm DSA More than Moore Heterogeneous Diversified technology development is ongoing Tech Trend

5 4 Jay Chen 2014/10/23 New Platform Platform Trend Single Wafer Batch 12 inch

6 5 Jay Chen 2014/10/23 450mm Motivation Ref. Nikon, 2013 Ref. TEL, mm is a cost project (with Big Development) Platform Trend

7 6 Jay Chen 2014/10/23 Wafer Demand Forecast Source: IC knowledge Strategic Industry Model(1200), SPE Marketing 450mm transition will come around 2020 Platform Trend

8 7 Jay Chen 2014/10/23 South America South East Asia Middle East Asia Africa BRICs East Europe North America West Europe East Asia Consumer 0.8B people 1.5B people 4B people Service in China Sales in China Manufacture in China R&D in China Head office in China BusinessTrend Regional expansion and New Targets of Electronic Equipment markets

9 8 Jay Chen 2014/10/23 Top 6 Front-end Equipment Companies Top 6 Front-end Equipment Companies Others 50% 75% The Industry Consolidates- Equipment 8” 0.18μm~0.13μm 12” 28nm~20nm 108 companies 69 companies Source: SEMI, 2014 BusinessTrend

10 9 Jay Chen 2014/10/23 68% 81% 86% The Industry Consolidates- Capital Spending Source: IC Insights, Jan 2014 Y2014(F) Capital Spending Leaders’ Shares of Total WW Semiconductor Industry Spending ($63.4B) Top 5 = 68% Top 10 = 81% Top 15 = 86% 92% Y2005 Share Top 5 = 40% Top 10 = 55% Top 15 = 67% Top 25 = 82% Top 25 = 92% BusinessTrend

11 10 Jay Chen 2014/10/23 The Industry Consolidates- IDMs TOP 5 IDMs in Y2001:32.6% Share of worldwide installed capacity (without discretes) TOP 5 IDMs in Y2013:52.0% Share of worldwide installed capacity (without discretes) Total Revenue: $154BTotal Revenue: $315B Source: Gartner, IHS, 2014 BusinessTrend

12 11 Jay Chen 2014/10/23 Plasma Etch System/ Tactras TM Vigus TM Key initiative : Saving energy consumption of chiller, pump and heater Thermal Processing System/ TELINDY PLUS TM Key initiative: Ensuring the use of proper amount of nitrogen Coater/Developers/ CLEAN TRACK TM LITHIUS Pro TM V-i Key initiative: Reducing the amount of exhaust of rotating cup modules and saving energy in temperature/humidity control Single Wafer Plasma Treatment System/ Trias e +TM SPAi Key initiative: Eliminating temperature control unit by using plant- sourced cooling water directly Elec. N2 EXH Source : TEL Taiwan EHS Seminar, 2014 Energy Saving Activities in 300mm Equipment Green Trend

13 12 Jay Chen 2014/10/23 Single Wafer Cleaning System/ CELLESTA TM - i Key initiative: Ensuring the use of proper amount of nitrogen Gas Chemical Etch System/ Certas WING TM Key initiative: Improving productivity with two-wafer Auto Wet Station/ EXPEDIUS TM - i Key initiative: Reducing pure water consumption in standby mode Wafer Prober/ Precio nano TM Key initiative: Reducing the amount of dry air supply with dew point monitoring Elec. Water Air N2 Source : TEL Taiwan EHS Seminar, 2014 Energy Saving Activities in 300mm Equipment Green Trend

14 13 Jay Chen 2014/10/23 Energy Saving in Taiwa Factory Green Trend

15 14 Jay Chen 2014/10/23 Energy Saving in Taiwa Factory Emergency Power Supply Water Storage Facility Emergency Stock Base Isolation System Green Trend

16 15 Jay Chen 2014/10/23 Energy Saving in Taiwa Factory Green Trend

17 16 Jay Chen 2014/10/ Fiscal Year Base Target 40 50% Reduction 30% Reduction Middle Target Achieved Energy Saving form Corporate Perspective Source: SEMICON China 2014 Green Trend

18 17 Jay Chen 2014/10/23 Eco-Industry: WFE Supplier and IC Maker ~ Old Days End Product (Electronics) IC Design IC Manufacturing IC Development Device Integration Failure Analysis Module Process Process Development Maintenance Hardware Production Current ~ End Product (Electronics) IC Design IC Manufacturing IC Development Device Integration Failure Analysis Module Process Process Development Tool Maintenance Hardware Production WFE Supplier IC Maker WFE Supplier IC Maker Overlap Region : Collaboration Area WFE supplier’s duty is increasing, call for collaboration Partnership Trend

19 18 Jay Chen 2014/10/23 TEL Worldwide R&D Sites imec (Belgium) Japan SEMATECH (US) CEA-Leti (France) Albany NanoTech (US) TEL R&D base Consortium Leading-edge Process Development Center Technology Development Center TEL Technology Center, Sendai TEL Technology Center, America Tohoku University (Japan) G450C Preparing for the future technology : w/w collaboration Partnership Trend

20 19 Jay Chen 2014/10/23 Biz Model Transition : Vertical Integration to Horizontal Specialization Source: T. Higashi, IME 2014 Partnership Trend

21 20 Jay Chen 2014/10/23 ◆集成电路市场三大发展方向 -社交网络普及,设备高性能化,消费区域扩大 ◆集成电路产业五大变化趋势 -技术趋势:后摩尔定律时代的多元发展 -平台趋势: 450/Single Wafer/Cluster Tool -商务趋势:中国时代,产业集聚 -绿色趋势:生产环节,使用环节 -平台趋势:合作共生,协同发展 考量与思索 天时地利人和 中国正扮演世界IC业界的主角

22 21 Jay Chen 2014/10/23


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