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Capacitor Selection for DC/DC Convertors: From Basic Application to Advanced Topics TI – Silicon Valley Analog in Santa Clara California USA - This course written by: Simple Switcher Applications Team Members: Alan Martin Marc Davis-Marsh Giuseppe Pinto Ismail Jorio Additional material provided by Chuck Tinsley of capacitor manufacturer KEMET 1

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Table of Contents 2 Capacitors types for DC/DC Conversion CeramicElectrolytic TantalumPolymer Advanced Applications in DC/DC Converters Typical Characteristics Advantages and Disadvantages Failure Modes Selection Process BuckBoost Measurement of capacitor parasitics Simple method to reduce high frequency noise in SMPS Estimating output voltage ripple and transient response RMS current ratings by topology 2

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Capacitor Types 3

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Capacitor Chemistry - Value and Voltage rating 4 100uF - 10000uF 0.1uF- 100uF 1pF – 0.1uF Capacitance Voltage 2V 4V 16V 25V 50V100V COG X5R X5R/X7R Tantalum Polymer Electrolytic

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Aluminum Electrolytics - Overview Least Expensive Capacitors for Bulk Capacitance –Multiple vendors –Small size, surface mountable How is it made? –Etched foil with liquid Electrolyte –Placed in a can with a seal/vent Highest ESR Low Frequency Cap roll off due to higher ESR Wear Out Mechanism – Limited lifetime –Liquid electrolyte – with a vent –Cap changes over time with Voltage and Temp –ESR changes over time Mounting –High shock and vibration can cause failure 5

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Aluminum Electrolytics - Packaging Through hole versions, usually in a round can. –Large ones have screw terminals or solder lugs –Radial or axial leads –Non SMT may have higher inductance because of long leads Surface mountable versions, are modified from radial leaded versions. –SMT versions usually have the capacitor value visibly printed on can. –SMT versions may use letter codes instead of numeric rating. - + 6

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Aluminum Electrolytics - Advantages Low Cost –Mature technology with low cost materials Long History –(Industry started in the 1930’s ) Many Manufacturers to choose from. High capacitance values available. Only choice for SMPS that need high voltage and high capacitance. 7

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Aluminum Electrolytics - Disadvantages Large swings in ESR vs temperature –Cold temps have 4-8x higher ESR than at room temperature 8

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Aluminum Electrolytics - Disadvantages Large Parasitics –High ESR (Effective Series Resistance) – High ESL – (Effective Series Inductance). Electrolytic capacitors eventually degrade over the life of the product. –The electrolyte eventually dries out. –Long term storage may cause Aluminum oxide barrier layer to de-form. Capacitance drops ESR increases. –Higher ESR causes more internal heat causing it to dry out even faster. –This effect is worse at high temperatures. –(Lesson: Don’t use “old stock” aluminum capacitors in your product.) Needs a ceramic in parallel for switch mode applications. –High esr and esl can cause SMPS malfunction. Have measurable dc leakage current. – Probably not an issue in power circuits; Leakage current can be a problem in timing circuits. 9

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Aluminum Electrolytic - Venting failure 450V rated capacitors after accidental application of 600V 10 Fails open or shorted. Catastrophic explosive venting –From Over-Voltage of the capacitor. –From exceeding the Ripple Current Rating of a capacitor May have the same effect as overvoltage; but it takes longer for the capacitor to overheat and vent.

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Ceramics - Overview Lowest Cost devices –Primarily for decoupling and bypass applications –Multiple vendors, sizes –Surface mountable How is it made? –Alternating layers of electrodes and ceramic dielectric materials Significant effects for Class 2 Dielectrics i.e. X5R, X7R. –Voltage bias effect –Temperature effects –Ageing 2%/decade hour for X7R, 5%/decade hour for X5R Starts decay after soldering –High Q Frequency selective 11

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Ceramic Dielectric – 3 Character Codes Class 1: (Best Performance) – Temperature Coefficient Decoder 12 Class 2: (Higher Capacitance) – Temperature and Capacitance Tolerance Decoder Typical Values: – X5R,X7R, values up to 150uF Typical Values: – NP0,C0G, values up to 100,000pF

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Ceramic Capacitors - Advantages Low Cost –Mature technology with low cost materials Many Manufacturers to choose from. Reliable and rugged –Extremely tolerant of over voltage surges Best Choice for local bypassing Not Polarized Lowest effective series resistance (Low ESR) –several milliohms –Leads to high RMS current rating Low effective series inductance (Low ESL) – < 3nH 13

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Ceramic Capacitors - Disadvantages Capacitance limited to around 150 uF / 6.3V Large body sizes prone to cracking with PCB flexing. Several small units in parallel may be a better choice. Have both a voltage and temperature coefficient that reduces capacitance value. Some large package size units exhibit piezo-electric audible “singing”. –Difficult to control. (Ceramic speaker effect.) –More noticeable with Class 2 dielectrics Incomplete data sheets!! –ESR, ESL, SRF and Ripple Current rating often missing from data sheets –Contact the manufacturer for ripple current Capacitance value not printed on SMT device package. –Impossible to visually inspect for value once mounted on the PCB. Some power supply circuits are not stable with ceramic output capacitors. –Usually LDO’s and parts using COT control 14

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Ceramics - Cracking Flex cracking – Number 1 Failure Mode! –Cracks formed after mounting to PCB Mechanically stressed after assembly Larger parts, generate cracks more easily Usually Fails shorted Voltage de-rating –Not required for COG, X7R and X5R…but… Voltage bias or capacitance loss increases as you approach rated voltage on X5R/X7R devices 15

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Voltage Bias Effect on X5R - example X5R, 10uF, 6.3 volt Ceramic capacitor at 0, 3.15 and 6.3 volt bias –10uF becomes 2.9uF under 6.3V bias condition Doesn’t include, temperature, ageing and initial tolerance!!!!!!!!! 16 10uF 2.9uF 0V Bias 6.3V Bias 3.15V Bias

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Voltage Bias Effect Including Case Size 17 1uF 0603 1uF 1206 1uF 0805 X5R, 16V Rated Capacitors Capacitance decreases more quickly with smaller Case sizes

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Ceramic capacitance change due to temperature AVX Capacitor X5R dielectric - typical of any brand You lose another 10% over temperature 18

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Y5V dielectric characteristics DO NOT USE! Y5V and Z5U ceramic dielectrics for power supply designs 19

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Tantalum – Overview (MnO 2 based) High Capacitance per unit Volume Technology –Small package sizes available Thin devices are available How is it made? –Tantalum Anode pressed around a tantalum wire –Oxide grown on surface –Cathode formed by dipping and heat conversion Mn MnO –Epoxy encapsulated Old technology –Requires 50% Voltage derating PPM failure rates increase exponentially above 50% voltage derating –Can fail explosively –High ESR compared to Polymer types –Fairly low cap roll off vs. frequency Tantalum Model 20 2

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Solid Tantalum Capacitors - Packaging Usually rectangular Surface Mount Technology – SMT machine mountable Capacitance ratings for 1uF to 1000uF 21 +-+- +-+- - +

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Solid Tantalum Capacitors - Advantages Lots of capacitance in a small package. –1uF to 1000uF max Medium-high effective series resistance (Low ESR) –10 to 500 milliohms –Medium level of RMS current Low effective series inductance (Low ESL) – < 3nH Numerous manufacturers Good datasheet vs. electrolytic 22

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Solid Tantalum Capacitors - Disadvantages Limited voltage range 50V rating max. –Therefore for circuit voltages less than 25 or 35VDC. Fairly high in cost –Historically Tantalum has had supply shortages Limited inrush surge current capability. –Do not use tantalum for hot pluggable input capacitors! 23 Don’t Hot plug tantalum!

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Solid Tantalum Capacitors – Application Safety ALWAYS observe voltage polarity DO NOT exceed voltage rating. DO NOT exceed inrush surge rating Can fail catastrophically if misapplied. Can fail open or short 24

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Polymer - Overview Highest Capacitance per unit Volume Technology –Small package sizes available How is it made? –Tantalum Anode pressed around a tantalum wire –Oxide grown on surface –Cathode formed by dipping into Monomer and cured at room temperature –Epoxy encapsulated Lower ESR vs MnO2 based Tantalums –Higher frequency operation – over a Mhz…still looks like a cap! –Lower power dissipation Higher ripple current capability May need less capacitance 25

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Polymer & Organic Capacitors - Packaging SMT Block style similar to tantalum. Round / Radial versions in SMT and through-hole. Types –Tantalum polymer / Aluminum polymer / Organic semiconductor 26 - + OSCON PosCap Kemet Tantalum Polymer

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Polymer & Organic Capacitors - Advantages Low ESR –but not as low as equivalent ceramic. Low ESL – depending on construction method New technology – Designed for SMPS. Can be very low profile. High capacitance per unit volume. –Much better performance than aluminum electrolytic and much smaller in size. No voltage coefficient. Viable alternative to solid tantalum. 27

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Polymer - Continued Voltage de-rating is 10/20% depending on rated voltage –PPM failure rates significantly reduced Can withstand higher transient voltages 28

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Polymer & Organic Capacitors - Disadvantages High cost Voltage surges capability depends on chemistry. –Oscon very intolerant of voltage surges Tend to be from a single supplier. –May have availability issues. Polymer & Organic Capacitors – Failure Mode Tantalum Polymer Less prone to catastrophic failure than solid tantalum but will still vent and emit smoke. Organic (OSCON) Emits noxious smoke. 29

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Capacitor Chemistry - Quick Comparison Numerical Rankings from 1 (Best) to 5 (Worst) 30

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Capacitor Chemistry – General Parameters 31

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DC/DC Converter Topologies 32

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Capacitor Selection for DC/DC converters Design factors that are known before selecting capacitors : 33 Switching frequency Fsw : From 50KHz (High power) to 6MHz (Low power) Input voltage range Vin Output voltage Vout Switch duty factor Duty Cycle (D) ~ Vout/Vin (for Buck/Step Down) Output current Iout Inductance L is usually designed such that the ripple current is ~30 - 40% of Iout at the switching frequency Topology Chosen in architectural stage

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Capacitor Selection for DC/DC converters RMS current of a capacitor is one of the most important specifications for capacitor reliability 34 It also effects the converters performance, and varies by topology Self-HeatingProportional to RMS Current and Internal Losses Voltage RippleHigher RMS Current leads to larger voltage ripple Let’s calculate RMS current for different topologies

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35 Common Topologies - BUCK Buck Converter Boost Converter Buck-Boost Converter Critical path Switching Current exist in the input side

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36 Common Topologies - BUCK Buck Converter Boost Converter Buck-Boost Converter Input Capacitor RMS Current Output Capacitor RMS Current

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37 Common Topologies - BOOST Buck Converter Boost Converter Buck-Boost Converter Critical path

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38 Common Topologies - BOOST Buck Converter Boost Converter Buck-Boost Converter Input Capacitor RMS Current Output Capacitor RMS Current

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39 Common Topologies – BUCK BOOST Buck Converter Boost Converter Buck-Boost Converter Critical path Non-Inverting Inverting

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40 Common Topologies – BUCK BOOST Buck Converter Boost Converter Buck-Boost Converter Input Cap RMS Current Output Cap RMS Current Mode 1 (Buck) Mode 2 (Boost) Non-Inverting Input Cap RMS Current Output Cap RMS Current

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Additional Topologies 41 SLUW001A

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Capacitor Parasitics 42

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Ideal capacitor compared to actual capacitor You buy this You get this 22uF 4V X5R 0603 Ceramic Voltage and Temperature De-rated Capacitance (ESL) Effective Series Inductance - Parasitic inductance term - (ESR) Effective Series Resistance - Parasitic resistance term - Buy one part – Get three for the price of one! 43

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Know your parasitics! They are very important! Equipment to use to measure capacitor parasitic elements. RLC Analyzer –Some can apply DC bias RF Network Analyzer –DC bias can easily damage analyzer source and receiver inputs –AC performance measurement very accurate. –Agilent (aka Hewlett Packard) i.e. HP3755A goes to 200MHz –Many other brands Frequency Response Analyzer – Allows DC bias so voltage coefficient can be measured. RLC results are less accurate. Frequency range is lower than network analyzer – 30 MHz max; Usually just 1 or 2 MHz range. May allow plotting on reactance paper with line of constant capacitance and constant inductance. FRA is also used for loop stability analysis. –Brands – Venable Industries – Ridley (A/P) several others. Measure the parasitic terms and include them in the design 44

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Comparison of capacitor types using Frequency Response Analyzer - Shown in reactance coordinate system - 5 different types of 22uF capacitor 45

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Comparative performance of different capacitor types using RF Network Analyzer 46

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Reducing Ripple and Transient Response 47

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Output Caps Selection The output capacitor must be designed to fulfill mainly two requirements: 1.To keep the steady-state peak-to-peak output voltage ripple below the maximum allowed value ∆V opp 2.To keep the output voltage waveform within the required regulation window [V o ± ∆V o_reg ] during the overshoot and undershoot caused by output current transients The output capacitor design of a buck converter will be discussed in this presentation 48

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Output Caps Selection – output ripple Boundary conditions formulated separately for ESR and C of the output capacitor may lead to selection of oversized commercial components. Please note that there is a phase shift between the contribute of C and the contribute of ESR. In this presentation an approach based on Acceptability Boundary Curves which jointly considers the effect of ESR and C will be shown. 49

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Output Caps Selection – stray inductances in output ripple analysis 50 Depending on the constant ESR x C, the output voltage waveform can change from quasi-triangular to quasi-sinusoidal. The effect of stray inductances can be easily separated from the effect of the principal parameters ESR and C of the capacitor. In fact, stray inductances produce additive step-up and step-down effects on the output voltage, whose amplitude is given by: Dominant ESR NO ESL Dominant C Includes ESL CeramicBad layout Electrolytic Tantalum

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Output Voltage Ripple by Chemistry 51 Inductor Current Ceramic Tantalum Polymer OSCON Electrolytic This plot shows a comparison of the output voltage ripple of a buck converter using 4 different capacitor chemistries. All caps = 47uF. Scale = 20mV/div

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Output Caps Selection – stray inductances in output ripple analysis In order to take in account the effect determined by the equivalent series inductance (ESL) of the output capacitor and by the inductance of the printed circuit board trace L PCB it is sufficient to replace the maximum allowed peak-to-peak output ripple voltage amplitude ΔV Opp with the net effective peak-to-peak ripple voltage ΔV Oppeff allowed to ESR and capacitance C, given by: If ESL and L PCB are unknown, the previous formula can also be used to determine the maximum allowed ESL compatible with the ESR and capacitance C of a capacitor selected with the algorithm not including the L PCB : 52

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Output Caps Selection – output ripple analysis The remaining part of the peak to peak output ripple voltage can be determined by analyzing the circuit in the time intervals between switching instants and can be derived by integrating the current flowing into the output capacitor: 53 Where: ON TIME OFF TIME ESR contribute Initial voltage charge capacitance contribute Current flowing into the output capacitor is given by : ON TIME OFF TIME

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Output Caps Selection – output ripple analysis In order to determine analytical expression of output voltage ripple, maximum and minimum values of output voltage waveform must be computed. Instant when minimum occurs is given by: 54 Instant when maximum occurs is given by: v O (t min ) v O (t max ) The analytical output ripple is given by: ∆V Opp = v O (t max ) - v O (t min ) DOMINANT ESR case

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Output Caps Selection – output ripple analysis Two different Domain Boundary Curves (DBC) can be defined as for D 0.5 Three different Acceptability Boundary Curves (ABC) can be defined for HIGH, MID and LOW ESR case 55 For D < 0.5 : ESR ≥ R s- HIGH ESR R i- < ESR < R s- MID ESR ESR ≤ R i- LOW ESR Please note that boundaries are duty cycle and switching frequency dependent + ESR > R s+ ESR < R i+ R s+ < ESR < R i+ HIGH ESR MID ESR LOW ESR

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Output Caps Selection – output ripple analysis The following figure shows Domain Boundary Curves (DBC) and the Acceptability Boundary Curves (ABC) in ESR-C plane for D = 33%, ∆i Lpp = 0.8A, ∆V opp_eff = 55mV, f S = 500kHz. In applications where D > 0.5 the DBC are inverted. ABCs allow to quickly figure out real feasible capacitors representing possible design solutions when load transient constraints are not needed. A real capacitor whose values of ESR and C correspond to a point located below ABCs (green area) is suitable to meet ripple constraints requirements. 56 HIGH ESR MID ESR LOW ESR HIGH ESR MID ESR LOW ESR

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Output Caps Selection – output ripple analysis – simplified formula 57 A simplified equation can be derived by calculating the fundamental component of the output ripple voltage as: There is an overestimation of the needed output cap nearby the MID ESR area

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Output Caps Selection – load transient 58 The overshoot (or undershoot) occurs because of the surplus (or deficit) of charge in the output capacitor. Let’s define the allowed variation for the output voltage as ∆V oreg Because of slope constraints due to the inductor: when D 0.5 OVERSHOOT UNDERSHOOT

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Output Caps Selection – load transient analysis 59 The instant when the peak of the overshoot occurs depends on the type of the output capacitor. The exact point where peak overshoot is reached, and its magnitude, must be calculated by taking into account joined influence of C and ESR.

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Output Caps Selection – load transient 60 Three different cases can be considered when load transient occurs: 1.stepwise load transient: load transient duration T LT is much smaller than closed loop system’s response time given by the crossover frequency f C, T LT << 1/(4f C ) 2.fast load transient: load transient duration T LT is smaller than closed loop system’s response time T LT < 1/(4f C ) 3.slow load transient: load transient duration T LT is larger that closed loop system’s response time T LT > 1/(4f C ) In 1 st and 2 nd case the control network is not able to compensate output voltage variations suddenly after a load variation. Hence, the output filter must be designed to keep the output voltage within the maximum allowed range in early time after the load transient until the loop has the chance to respond. The impact of load transient constraint on the output capacitor size is lower in 3 rd case. For this reason worst case stepwise load transient is treated. The output current slew rate will be considered as infinite (T LT = 0). This is a reasonable assumption in application such FPGA supplies where load-current slew rate may range up to 100A/µs.

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Output Caps Selection – load transient analysis 61 Is it possible to analyze a buck converter during load transient by means of the following circuit. t LT is the instant when the load transient occurs, it can occur during ON time or during OFF time. Worst case condition occurs when: t LT = DT S for overshoot t LT = T S for undershoot ON TIME OFF TIME Let’s assume a high cross over frequency controller. Minimum duty cycle is assumed to be 0 and maximum duty cycle is assumed to be 1.

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Output Caps Selection – load transient analysis – overshoot 62 Assuming that the step down load transient occurs at t LT = DT (overshoot worst case), the instant of peak variation of the output voltage and its maximum overshoot peak value are given by: It t OS = DT S the magnitude of V OS is determined by ESR only (high ESR case ESR H ) If t OS > DT S the magnitude of V OS jointly depends on C and ESR values (low ESR case ESR L )

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CBCB Output Caps Selection – load transient analysis – overshoot 63 The three curves cross at the boundary value of capacitance C B given by: A real capacitor whose values of ESR and C correspond to a point located below this curve (green area) can be considered suitable to maintain the output voltage within the given regulation window in presence of a charging load transient. Zero slope Negative slope Positive slope

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Output Caps Selection – load transient analysis – overshoot 64 It makes sense to consider the effect of stray inductances L ESL = ESL + L PCB only it the real slew-rate SR of the load current transition is known. After the instant t r, the output voltage evolves in the time as if there was no ESL. Load transient constraints are met if C, ESR and ESL are such that both conditions are fulfilled: The effect of L ESL can be accounted by including the following constraints for the ESR ∆V O (t r ) < ∆V Oreg ∆V O (t os ) < ∆V Oreg ∆V Oreg

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Output Caps Selection – load transient analysis – overshoot 65 L ESL = 10nH SR = 3 A/ µs ∆V Oreg

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Output Caps Selection – load transient analysis – overshoot – simplified equation 66 It is possible to derive simplified boundaries for C and ESR. Let’s assume that the minimum output capacitance required is C B previously defined as: It is possible to calculate the maximum allowed value of the ESR by replacing C B value into the ESR crit formula previously defined: Any capacitor whose value of capacitance and ESR is higher than C min and lower the ESR max is suitable to meet load transient requirements for a buck converter.

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Capacitor - Selection Process Summary Electrical specifications: Electrical performance –RMS Current in the capacitor Look for RMS current equation in the chosen DC/DC topology –Applied voltage at the capacitor De-rate the capacitor based on the chemistry Transient requirements –Size bulk capacitance based upon voltage deviation requirements –Check that the selected capacitor meets stability requirements Capacitor impedance –Does this capacitor chemistry look inductive at the frequency of interest? 67

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Capacitor - Selection Process Summary Most designs use a combinations of technologies –Tantalums or Aluminum Electrolytics for bulk Capacitance –Ceramics for decoupling and bypass Depends on Mechanical Challenges –Vibration –Temperature –Cooling Lifetime comes into play –For longer life, improve the quality of the components –Ceramics and polymer have improved lifetime over electrolytic and tantalum Costs - Tradeoffs –Component cost vs Total cost of ownership 68

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Capacitors – Selection Process Summary Use Equations for selected topology –Calculate RMS Currents, Peak voltages, Minimum capacitance, Maximum esr Select Chemistry based upon the designs needs –Remember to de-rate voltage by at least 20% for all chemistries –50% for tantalum to improve reliability –50% for class 2 ceramics to decrease capacitance lost to DC biasing –Note: Capacitor data sheet MUST include 100kHz data if the capacitor is to be applied in a switch mode power supply (SMPS). 120 Hz only versions are not suitable for SMPS –Consider NP0 (C0G), X7R, X5R and X7S ceramic dielectrics* - in this order. DO NOT USE Y5V Place additional units in parallel if one is not enough –Combine chemistries to benefit from their various advantages Use polymer, electrolytic and tantalum for bulk Use Ceramics as your primary decoupling capacitor 69

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Output Caps Selection – References 70 A. De Nardo, N. Femia, G. Petrone, G. Spagnuolo, “A unified method for optimal buck converter output capacitor design”, Proc. Of ISIE2008, Cambridge, UK, pp. 56-61 S. Maniktala, Switching Power Supply Design & Optimization, Mc Graw Hill, New York, 2004 G. Spagnuolo, N. Femia, A. De Nardo, “Optimal Buck Converter Output Filter Design for Point of Load applications”, IEEE Trans. Ind. Electron., DOI10.1109/TIE.2009.2030219, in press R.W. Erickson, D. Maksimovic, “Fundamentals of Power Electronics”, 2001 Kluwer Academic Publishers

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Paralleling capacitors to reduce high frequency output voltage ripple 71

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72 A technique for reducing High Frequency output noise If the output capacitor(s) is not ceramic; then adding a small ceramic(s) in parallel with the output will reduce high frequency ripple. Choose a ceramic capacitor that has an impedance null (self resonance) that is the same as the frequency to be attenuated. One, two or three small ceramics can give 10X improvement (-20 dB.)

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73 High frequency ripple Switch waveform (scope trigger) Vout ripple w/ 20 MHz bandwidth (bw) 5 mV /div 10 mv p-p HF spikes ignored !

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74 Use Zoom function to measure ring frequency 20 MHz bw 200 MHz bw 2 GHz bw Timebase Zoomed traces 300MHz ring 10 mV/div 100 mV/div Need to add 470 pF 0603 bypass SRF ~ 300 MHz

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75 Continue the method 20 MHz bw 200 MHz bw 2 GHz bw 10 mV/div 100 mV/div 115 MHz ring Measured after adding a 470 pF 0603 but before adding 2200pF 0603 Timebase Zoomed traces

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76 Continue the method 20 MHz bw 200 MHz bw 2 GHz bw 10 mV/div 100 mV/div 60 MHz ring Measured after adding a 470pF 0603 and a 2200pF 0603 but before 4700pF 0805 Timebase Zoomed traces

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77 Results after 3 rd added small capacitor Measured after adding a 470pF 0603, 2200pF 0603, and 4700pF 0805 Ring ~377MHz 20 MHz bw 200 MHz bw 2 GHz bw 10 mV/div 100 mV/div

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78 Final amplitude improvement results 20 MHz bw 200 MHz bw 2 GHz bw 10 mV/div 20 mV p-p @ 20MHz bw 80 mV p-p @ 200MHz bw After 470pF 2200pF 4700pF

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79 Starting point for comparison - 3 caps removed 20 MHz bw 200 MHz bw 2 GHz bw 10 mV/div 200 mV/div 696mVp-p @ 200MHz bw

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80 Final schematic and bill of materials: 15 minutes later Cost Approx < $0.03 USD Remember to reserve locations on the schematic and PCB for these parts. You will not know the capacitor values until after you test the running power supply for ringing noise. Plan ahead 1.2VDC OUT @ 5A 2200pF

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81 Bench requirements 2GHz bw / 20Gsps Digital oscilloscope with zoom feature and adjustable channel bandwidth. Selection of small capacitors pre-characterized by Self Resonant Frequency. High quality interconnections with controlled impedances. Example of 3 channel input adapter built for this tutorial (net 4x passive probe)

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Use C0G (NP0) dielectric for high frequency shunt filter capacitors – lower ESR – more stable over temp Start with manufacturer data sheets, then measure SRF on bench to confirm 82

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Thank You Questions? 83

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