Presentation on theme: "Dry Etch and Thin films & Process Integration Jan 6th, 2015 NNfC monthly admin committee meeting."— Presentation transcript:
Dry Etch and Thin films & Process Integration Jan 6th, 2015 NNfC monthly admin committee meeting
Dry Etch– Tool status Update Dec 2014 RIE – AMC 2014 – Etch rate optimization post AMC Etch rates were same as before except SiO 2, SiO 2 etch rate decreased by 20nm/min. –Installation of Thermocouple for RIE-Cl has to be done. –DC bias interlock is installed in RIE-Cl (Max 500V). Al 2 O 3 and ITO recipes are optimized accordingly. (No etch rate and profile variation) PECVD – AMC 2014 – Post AMC deposition rates were checked- Same results as before with good uniformity. – Issue with Wafer Lift Bellow Assembly- Wafer transfer is done in manual mode. Spare part acquired and need to be installed. – SiO 2 High deposition rate recipe optimization in process.
Tool issues – Nov-Dec eBeam deposition: Issue with GOLD deposition … seeing “gold balls” on surface of the films on the order od 1-2 microns! This is could be the potential cause of the failure of the RF- MEMS switch for MSRIT project. Several other users have seen the same issue. Meeting organized to collect all the available data and trouble-shoot the problem. Problem seen since mid-Nov. Sputter tools: Sputter2 down since early-Dec due to a faulty controller on the Throttle valve. Problem identified as the Norcal-valve controller— Quote received from Singapore~US$2.5k Need a strong push to Tecport for providing the part as part of the remaining spares money ~ US$38k. Sputter one is up – Need to purchase Al/Cr targets. Quotations received. P.O. requested.
Tool issues 4 DRIE: TOOL DOWN due to Arching in the Busbar area near the ICP Coil. Same problem seen in June SPTS had serviced the machine and cleaned the “blackened” contacts Tool was operating under reduced power conditions to avoid such arching Busbar parts were ordered in October, but the process has been slow due to strike and holidays/ICEE conference. Need to accelerate the Annual maintenance schedule and change the “damaged” busbar parts. Plan to get operational again in the next couple of weeks … provided all the “ducks” line up and the planets are aligned
PECVD DRIE Anelva Sputter
Unit process development started in Aug. –Key challenges in eChannel RIE, Au-seed layer, gold plating, wafer bonding and dicing. Prasiddhi mask ordered to start structural learning. MTRDC project progress 7Sadanand Deshpande, NNFC