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PRAGUE 15 - 18 November 2002 Monolithic Silicon Pixel Detectors in SOI Technology J. Marczewski, K. Domanski, P. Grabiec, M. Grodner,

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Presentation on theme: "PRAGUE 15 - 18 November 2002 Monolithic Silicon Pixel Detectors in SOI Technology J. Marczewski, K. Domanski, P. Grabiec, M. Grodner,"— Presentation transcript:

1 PRAGUE November 2002 Monolithic Silicon Pixel Detectors in SOI Technology J. Marczewski, K. Domanski, P. Grabiec, M. Grodner, K. Kucharski, B. Jaroszewicz, A. Kociubinski, D. Tomaszewski Institute of Electron Technology, Warszawa W. Kucewicz, S. Kuta, H. Niemiec, M. Sapor University of Mining and Metallurgy, Krakow M. Caccia University of Insubria, Como Presented by Jacek Marczewski

2 PRAGUE November SUCIMA project 2.SOI imager – motivation and concept 3.SOI imager – technology development 4.Test structures and preliminary measurements 5.Future tasks Outline:

3 PRAGUE November 2002 The collaboration is made out of 9 Dept.’s or Research Centers and 2 companies from 5 EU countries. COMPETITIVE AND SUSTAINABLE GROWTH  SUCIMA is a project approved by the EC within GROWTH, one of the lines of the Fifth Framework Program  The project started off on November 1 st, 2001 and it is supposed to last for 36 months. SUCIMA Silicon Ultra fast Cameras for electron and gamma sources In Medical Applications

4 PRAGUE November 2002 Review of SUCIMA objectives The main goal of the project is the DEVELOPMENT OF AN ADVANCED IMAGING TECHNIQUE OF EXTENDED RADIOACTIVE SOURCES USED IN MEDICAL APPLICATIONS where “imaging” has be intended as the record of a dose map Development & boundary conditions are defined by the specific end- user requirements: Brachytherapy Real-time monitor of a proton beam for radiotherapic treatments

5 PRAGUE November 2002 The specific task of the SUCIMA project is the DEVELOPMENT OF A SOI IMAGER Why SOI? fast sensitive radiation hard

6 PRAGUE November 2002 SOI Monolithic Detector – Motivation Advantages of SOI monolithic detectors:  SOI imager as a monolithic device allows to reduce total sensor thickness  Performance and radiation tolerance of readout electronics may benefit from reduction of active silicon thickness  SOI solution allows the use of high resistive detector substrates

7 PRAGUE November 2002 SOI Imager – Main Concept Detector  handle wafer –High resistive –300  m thick Electronics  active layer –Low resistive –1.5  m thick Detector: conventional p + -n, DC-coupled Electronics: CMOS technology on the SOI substrate

8 PRAGUE November 2002 SOI Imager – Technology Development Technology of SOI detectors Integration of pixel manufacturing technique with typical CMOS poly-Si gate technology Challenges: Fabrication of circuits at both sides of BOX layer Cross-talk between read-out electronics and detector Reliable electrical connection through BOX Optimization of high temperature processing

9 PRAGUE November 2002 Technological sequence  over 100 processes SOI Imager – Technology Development

10 PRAGUE November 2002 SOI Imager – Technology Development

11 PRAGUE November 2002 Test Structures The test structures serve as a tool for SOI technology and layout design development. They will be fabricated by the IET, Warsaw by the end of the year

12 PRAGUE November 2002 An Example of Technological Test Structure The test structure for checking treshold voltage differences for close situated transistors

13 PRAGUE November 2002 An Example of Design Test Structure The test structure for F-E concept evaluation

14 PRAGUE November 2002 Preliminary measurements The bulk test structures has been used to produce SOI transistors on SOITEC wafers. The technology sequence was similar as it is provided for SOI detectors. The substrate parameters are exactly the same like for future SOI detectors except low resistivity of the handle wafers.

15 PRAGUE November 2002 The CMOS transistors on thin substrate (SOI) have different doping profiles than the bulk ones. Parameters of well implantation were changed to get V th =0.7+/-0.2V at reasonable V BR (  19 V) Preliminary measurements

16 PRAGUE November Production of test structures (next 2 months) 2.Extraction of device parameters (Jan/Feb 03) 3.Technology development (3 runs expected) 4.Preliminary verification of design (mid-year 2003) TASKS FOR THE NEAR FUTURE

17 PRAGUE November 2002 AL. Lotników 32/ Warszawa POLAND AL. Lotników 32/ Warszawa POLAND INSTITUTE of ELECTRON TECHNOLOGY


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