Presentation on theme: "Dry Etch and Thin films & Process Integration August 26, 2014 NNfC monthly admin committee meeting."— Presentation transcript:
Dry Etch and Thin films & Process Integration August 26, 2014 NNfC monthly admin committee meeting
Tool issues 2 eBeam deposition: Down time due to e-gun arching and single operational gun. Two new electron guns installed on August 13 th. Most commonly used materials qualified on 15cc crucibles to more efficiently use target. Previously all depositions, including Gold was being done on 25cc crucibles. Sputter tools: Sputter2 down for mid-July to early August due to WindowsXP boot-up and PC system. Issue resolved with help from Smart Systems. New deposition requests denied: Special targets such as TaN and TiW not available. Thick Al2O3 (100nm) requiring long deposition times.
Tool issues 3 DRIE: SPTS local support has been discontinued, causing longer down times and slow recovery. System not fully operational after conversion to 4-inch chuck. System is now working with limited capability – only HF bias (13.56MHz) recipes qualified. Seeing excessive polymer deposition on LF (350KHz) bias recipes. Troubleshooting on-going with phone and support from Singapore. Need to accelerate PM schedule – parts being ordered for first major PM in two years … Target Nov ‘14.
PECVD DRIE Anelva Sputter
Unit process development started in Aug. –Key challenges in eChannel RIE, Au-seed layer, gold plating, wafer bonding and dicing. Prasiddhi mask ordered to start structural learning. MTRDC project progress 6Sadanand Deshpande, NNFC