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© 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. HP ProLiant SL6000 G6 Technology.

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Presentation on theme: "© 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. HP ProLiant SL6000 G6 Technology."— Presentation transcript:

1 © 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. HP ProLiant SL6000 G6 Technology for better business outcomes Doug Tucker June 2009

2 2 June 2009 – HP Restricted. For HP and channel partner internal use. 2 HP ProLiant SL6000 Scalable System Product Overview The HP ProLiant SL6000 Scalable System uses a highly efficient and modular power & cooling infrastructure that enables a suite of pluggable server modules optimized around a standard 19” rack Key Benefits More affordable compute power Double the compute density over traditional rack servers Greater levels of efficiency with shared power and thermals Highly configurable for different application requirements

3 3 June 2009 – HP Restricted. For HP and channel partner internal use. SL Product Line Naming SystemHP ProLiant SL6000 Scalable System Chassis HP ProLiant z6000 G6 Chassis Servers HP ProLiant SL160z G6 Server HP ProLiant SL170z G6 Server HP ProLiant SL2x170z G6 Server 3

4 4 June 2009 – HP Restricted. For HP and channel partner internal use. Modular – Designed for Max Efficiency Multi-node, Shared Power & Cooling Architecture Higher ROI Power efficiency Density Lower TCO Acquisition cost Pwr/cooling cost Energy efficient fans (2U), optional N+1 Variety of optimized Node Modules Reduced weight (shipping cost) Unrestricted airflow (no mid-plane or I/O connectors) Shared Power & Fans Optional Hot-Plug Redundant PSU 1 or 2 HP Standard PSUs 3 PSU options Standard 19” racks, with front I/O cabling

5 5 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant SL6000 Components 10U bulk rail optimized for HP Racks Pluggable Server Tray (up to 2 x 2S Servers) 2U Chassis DL100 series Rail for HP & 3 rd Party Racks HP or 3 rd Party Rack

6 6 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant z6000 Chassis Features: Support for (2) 2P (socket) server trays Shared Fans, High Efficiency, N+1 Redundancy 2U Shared Power −Support for 460W, 750W, or 1200W AC configurations −Full Hot Plug RPS, or ebrake RPS support Multi-node Efficiency −Shared fan control −Power capping & measurement −Optional interface to Rack Control Module HP 10k G2 rack optimization −Bulk 10U rail system for lowest cost 3 rd Party rack support −Supports common DL100 rail Front I/O Cabling −Easy serviceability High efficiency (92%) common slot power supplies High efficiency N+1 Redundant Fans Server Trays

7 7 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant SL160zHP ProLiant SL170zHP ProLiant SL2x170z Maximum expansion with 18 DIMM slots and up to 2 PCIe slots Maximum storage capacity with up to 6 LFF SATA or SAS hard drives Maximum compute density with two servers per tray (1U) Ideal Application HPC database tier Web memory-cache Web Search Web database HPC compute intensive Web front end Target Markets −Scale-out: Web Farms, ISPs, ASPs, Etc… −Web 2.0: Social networking, Shared Content, Blogs, Etc … −HPC: Oil & Gas, Financial, Entertainment, Scientific, Government, Etc... HP ProLiant SL6000 Ideal Environment

8 8 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant SL160z Processor Chipset 2P Intel 5500 series Intel® 5520 Chipset Memory 18 DDR3 DIMM Sockets Storage HP Embedded SATA controller w/sw RAID Up to 2 NHP LFF HDDs Networking Embedded Dual Port 1GbE NICs I/O Expansion 1 x16 FH PCIe Gen 2 slot Management Standards based DCMI & IPMI Basic Functionality, node-level power on/off Additional Features High 50%+ load Hot Plug, N+1 PSU (optional) Density 2 server nodes in 2U 1 EATX nodes in 1U tray

9 9 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant SL160z – Front View in z6000 Chassis 9 Video Port (2) USB Ports Serial Port UID Power Button Low Profile PCI Slot (2) 1Gbit NIC Health LED

10 10 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant SL160z – Inside View 10 Low Profile x16PCIe Slot 18 DIMM Slots Up to 2 Intel 5500 series processors Optional X4 internal PCIe slot 2 LFF SATA or SAS Hard Drives using quick release drive carrier

11 11 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant SL170z Processor Chipset 2P Intel 5500 series Intel® 5520 Chipset Memory 16 DDR3 DIMM Sockets Storage HP Embedded SATA controller w/sw RAID Up to 6 NHP LFF HDDs Networking Embedded Dual Port 1GbE NICs I/O Expansion 1 x16 LP PCIe Gen 2 slot Management Standards based DCMI & IPMI Basic Functionality, node-level power on/off Additional Features High 50%+ load Hot Plug, N+1 PSU (optional) Density 2 server nodes in 2U chassis 1 ea, EATX PCAs in 1U module

12 12 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant SL170z - Front View in z6000 Chassis 12 Video Port (2) USB Ports Serial Port UID Low Profile PCI Slot (2) 1Gbit NIC Health LED Optional LO100 dedicated Management Port Power Button

13 13 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant SL170z – Inside view 13 Low Profile x16PCIe Slot 16 DIMM Slots Up to 2 Intel 5500 series processors 6 LFF SATA or SAS Hard Drives using Quick Release drive carrier

14 14 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant SL2x170z HP ProLiant SL2x170z (per each SL170 system board) Processor Chipset 2P Intel 5500 series Intel® 5520 Chipset Memory 16 DDR3 DIMM Sockets Storage HP Embedded SATA controller w/sw RAID 1 NHP LFF HDDs (2 in tray, 1 per node) Networking Embedded Dual Port 1GbE NICs I/O Expansion 1 x16 LP PCIe Gen 2 slot Management Standards based DCMI & IPMI Basic Functionality, node-level power on/off Additional Features High 50%+ load Hot Plug, N+1 PSU (optional) Density 4 server nodes in 2U 2 half-EATX nodes in 1U tray

15 15 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant SL2x170z - Front View in z6000 Chassis 15 Video Port (2) USB Ports Serial Port UID Low Profile PCI Slot (2) 1Gbit NIC Health LED Optional LO100 dedicated Management Port Power Button

16 16 June 2009 – HP Restricted. For HP and channel partner internal use. HP ProLiant SL2x170z – Inside view 16 Low Profile x16PCIe Slot 16 DIMM Slots per system board Up to 2 Intel 5500 series processors per SL170z system board 2 LFF (1 per server) SATA or SAS Hard Drives using Quick Release drive carrier Low Profile x16PCIe Slot (2) SL170z system boards

17 Power Strategy

18 18 June 2009 – HP Restricted. For HP and channel partner internal use. 18 Power Redundancy Supports Common Slot power supply −Common slot – 1200W, 750W, 460W options −Allows you to choose right sized power supply for your configuration and run higher up the efficiency curve. Three implementations available for shared power supplies: −No Redundancy Run entire z6000 chassis with 1 power supply Combination of both trays need to fit in the power envelop of the power supply −Full AC/DC redundancy Using 2 power supplies to run z6000 chassis If one power supply fails and the servers fit in the remaining power supply’s power envelop, servers will continue to run with no interruption −AC redundancy w/ throttling Using 2 Power supplies to run z6000 chassis If one power supply fails and the total power used by the server trays is greater than the remaining power supply, the servers will throttle down to fit in the remaining power supply’s power envelop

19 Full Rack Pictures

20 20 June 2009 – HP Restricted. For HP and channel partner internal use. 20 Front View

21 Technology for better business outcomes

22 HP Datacenter Environmental Edge Brandon Fears June 2009

23 On The Road to Energy Efficiency… Why the concern about energy? How Energy Efficiency can affect your business? Today’s Power and Cooling Challenges

24 24 June 2009 – HP Restricted. For HP and channel partner internal use. How energy efficiency can affect your business Business impact related to power and cooling issues Server or system downtime Increased operational costs Datacenter outage Inability to add capacity Increased operational costs Fail to support business growth Loss of revenue Increased operational costs Lowered customer satisfaction

25 Portfolio HP Insight Environmental Observer visualization HP Datacenter Environmental Edge Benefits Standard recommended configuration HP Datacenter Environmental Edge FAQ HP Datacenter Environmental Edge Solution Portfolio

26 26 June 2009 – HP Restricted. For HP and channel partner internal use. HP Environmental Edge HP Insight Environmental Observer 26 Monitoring Points Racks: Temp Humidity Subfloor: Pressure Differential CRAH: Temp Humidity Power Chilled Water: Flow Temp PDU: KWH Usage Visualization Real-time Insight from rack level data center environmental sensors Energy Avg. data center savings 12% to 18% Cooling Up to 30% increase in cooling capacity, delays additional cooling infrastructure purchases / build new datacenter Increase subfloor differential pressure up to 40% Installation Simplicity No data center pre-requisites, non-invasive installation HP Technical Services Installed in 1 day per 500 m 2 /5000 ft. 2 Notification Real-time notification / Alarming Cost Typical break even 9 to 14 months Insight Environmental Observer

27 27 June 2009 – HP Restricted. For HP and channel partner internal use. HP Insight Environmental Observer S/W Datacenter Visualization HP Confidential

28 28 June 2009 – HP Restricted. For HP and channel partner internal use. HP Environmental Edge Benefits: Air / Cooling Management Based on Solid Data not Intuition 28 * See “Edge ROI” slide for more details. Remediation Notification Change Management Fix inefficiencies: air flow / mgmt, CRAH over provisioning, humidity control optimization, rack overcooling, floor tile placement Reduce power consumption up to18%* Track environmental trends up to 180 days Reduce downtime Visualize how datacenter changes impact air flow, temperature, etc. Optimize rack air mixing / bypass Benchmark key datacenter infrastructure metrics Every 60 seconds on critical changes based on user defined parameters Alerts via text, , SNMP Communicate alerts to other systems via SNMP Reduce Fan Energy / Improve AC Efficiency / Increase Cooling Capacity

29 29 June 2009 – HP Restricted. For HP and channel partner internal use. HP Datacenter Environmental Edge Continuous Improvement Process Analyze Detailed data: Rack and CRAC/CRAH view Air pressure, humidity, temp, power Historical trending/graphing 1. Visualize Temp & Humidity 2. Visualize Air Pressure 4. Implement Changes 5. Visualize Change Results

30 30 June 2009 – HP Restricted. For HP and channel partner internal use. HP CONFIDENTIAL - DO NOT DISTRIBUTE 3012 October 2014 Edge ROI: Energy Savings and Increased Cooling Capacity CompanyUtilityFortune 100 technologyFinancial services PUEInitial 1.7, projected 1.5Initial 1.9, projected 1.7Initial 1.7, projected 1.5 Energy savings13%18%12% Carbon savings59 metric tons2032 metric tons513 metric tons Datacenter Size2,900 ft 2 / 290 m 2 25,900 ft 2 / 260 m 2 13,000 ft 2 / 130 m 2 Capacity increase 22%33%8% ObjectivesVisibility and alarms ID risks Optimize DC ops  Energy  Capacity 24 x 7 visibility, alerts, and so on ID risks Baseline & optional DC ops  Energy  Capacity 24 x 7 visibility, alerts, and so on ID risks Baseline & optional DC ops  Energy  Capacity FindingsIdentified: Poor tile placement Benefits of blanks Remediation will result in the ability to turn off 2 CRACs Identified: Low sub-floor pressure Bad tile placement Remediation: Resulted in 2–3 times pressure increase Allowed for 13 of 28 CRACs to be turned off Goal: Reduce bypass and recirculated air 104 racks over-cooled 76% of the time Improved airflow management and enabled manual VFD control

31 31 June 2009 – HP Restricted. For HP and channel partner internal use. HP Datacenter Environmental Edge Components Core solution − Wireless rack temperature and humidity sensors − Air pressure sensors every 500 ft 2 /50 m 2 − Insight Environmental Observer S/W − Hardware and Software installation Additional sensors and services − KWH Meters − Chilled water flow − Rack door position − Water leak detection

32 32 June 2009 – HP Restricted. For HP and channel partner internal use. Why HP Datacenter Environmental Edge? Fast and simple to deploy − Approx. 20 hours per 5K ft. 2 − Wireless battery powered base stations Wireless network security features − Wireless gateway isolated from LAN via serial interface − 128 bit AES encryption Can be deployed in any data center − Rack and CRAH vendor agnostic Cost-effective solution Enable rapid decision-making based on 2-D visualization Easy reconfiguration as data center layout or infrastructure changes − Customer self-repair and maintenance − 24X7X365 WW HP Support − Global availability − Available direct from HP or from channel partner

33 33 June 2009 – HP Restricted. For HP and channel partner internal use. Contacts US EMEA APJ

34 34 June 2009 – HP Restricted. For HP and channel partner internal use. Thank you!


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