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Underpinning Power Electronics Component Integration Theme WP 4: Design Tools and Modelling Dr Hua Lu Department of Mathematical Science University of.

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Presentation on theme: "Underpinning Power Electronics Component Integration Theme WP 4: Design Tools and Modelling Dr Hua Lu Department of Mathematical Science University of."— Presentation transcript:

1 Underpinning Power Electronics Component Integration Theme WP 4: Design Tools and Modelling Dr Hua Lu Department of Mathematical Science University of Greenwich Research Interests: Computational Science, Reliability analysis and optimization, Design tools for power electronics

2 Project Plans & Objectives Design for Electro-Thermal Management Develop a methodology for generating dynamic electro-thermal compact models that can be used in a high fidelity thermal analysis Develop a methodology to embed these models within a multi-objective optimisation framework Design for Reliability and Robustness Develop high fidelity finite element models for relevant component structures in this theme Develop reduced order model equivalents of the above for fast analysis Develop physics-of-failure lifetime models for failures relevant to structures developed in this WP Identify a methodology to include design/manufacturing variation within the reliability predictions Identify approach to embed the above within a multi-objective optimisation framework such as PowerLife

3 Potential Outcomes & Exploitation Plans Methods and models for the development of mathematical models for electric, thermal, and mechanical analysis developed for power electronics design The implementation of the above in design tools at the component Use the design tools for co-design of power electronics components and systems

4 Input from the PE Community Other UPE themes: Device, Converters and Drives UPE design tools and models (DTM) Cross Theme (pending) Other power electronics projects in the UK and abroad. HiCo, CleanSky etc Power Electronics industry Power electronics centres and organizations such as ECPE


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