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Ultra Thin HDI Multi-purpose Test Vehicle Definition Stage Project C.B. Katzko, TTM Technologies HDPUG Member Meeting, 2014 June 04 Düren, Germany Hosted.

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Presentation on theme: "Ultra Thin HDI Multi-purpose Test Vehicle Definition Stage Project C.B. Katzko, TTM Technologies HDPUG Member Meeting, 2014 June 04 Düren, Germany Hosted."— Presentation transcript:

1 Ultra Thin HDI Multi-purpose Test Vehicle Definition Stage Project C.B. Katzko, TTM Technologies HDPUG Member Meeting, 2014 June 04 Düren, Germany Hosted by Isola © High Density Packaging Users Group, Inc.

2 Background - IT Market Disruption Our “Post PC Era” : Sales of desktop & laptops declining Smartphones & tablets becoming dominant internet user devices Cloud Computing and SAAS eroding the packaged software model Ultrabooks, hybrids and “modular” PCs replacing traditional PCs Commodity servers rivaling OEM brand systems for internet enterprises “Internets of Things” = explosion of embedded system modules © High Density Packaging Users Group, Inc. Source : Gartner Research

3 Background - User Device Trends Source: Internet Trends 2014 – Code Conference, Mary Meeker, KPCB PDF Link: Wealthy nations near saturation, global market lead by emerging nations has room for growth Tablets on a high growth curve as lower cost “minis” & “phablets” surpass notebook PCs

4 Background – End Use Trends Source: Internet Trends 2014 – Code Conference, Mary Meeker, KPCB PDF Link: Outrank USA on total time, Smartphone & Tablet usage USA “Café” not “Internet Café”? Highest smartphone internet use, e-banking/e-commerce leader in Africa Age demographics – JP is a poster child of the global trend

5 Background - Modular Computing Intel ® NUC Next Unit of Computing Ars Technica – 2014 Jan 06 Remaking the desktop: DIY - add your own DDR3, wireless, SSD or HDD Open Compute Project “vanity-free” processor sled – OEM/ODMs joining these projects PCBs - conventional MLB & HDI trending to stacked via BGA

6 Background – Handhelds © High Density Packaging Users Group, Inc. ALV-HDI logic board populated 2 sides Li-ion Battery flex PCB camera flex PCB camera/sensors flex PCB home button integrated display panel flex PCBs switches & sensors flex PCB video driver shield HDI PCB audio/speaker PoP SoC PCBs – leading edge HDI/ALV Flex & Rigid Flex Source : iFixit

7 Background – HDI/ALV Design Handheld/wearable electronic packaging: Design envelope dominated by batteries & displays Miniaturized & modularized PCBA design with high flex content Extensive use of SoC & MEMs, with SiP, PoP & WCSP packaging Low profile CSP, WCSP & microQFN devices, 0.40~0.30mm pitch Ultra-thin 8-14 Layer HDI PCB design, current and near term: Via in Pad/stacked via ICT with decreasing pad diameter Conductor line/space design rules approaching 40/60um 2 track routing in 0.40umm pitch devices up to 36x36 BGA 25~40um dielectrics 250~800um thickness Flex & coreless HDI © High Density Packaging Users Group, Inc. How does the performance & reliability stack- up?

8 Background – HDI/ALV Roadmap BGA Design Rules (microns) BGA Pitch Signal Routing Inner LineInner SpaceLaser ViaInner PadOuter PadSM OpeningRemarks 0.40mm1 Track JISSO Roadmap 0.40mm1 Track Current Practice 0.40mm2 Track Next Gen High I/O SoC, requires mSAP 0.30mm1 Track JISSO Roadmap 0.30mm1 Track Current Practice 0.30mm2 Track Forecast, requires mSAP 0.25mm1 Track JISSO Roadmap, requires mSAP 0.15mm1 Track JISSO Roadmap, requires coreless & SAP Dielectric Thickness (microns) Min BGA Signal Routing Core Layer Build-up Layer Total LayersRemarks 0.40mm1 Track60 10Current Practice STD HDI 0.30mm1 Track ~ 12Current Practice ADV HDI 0.30mm2 Track40 10 ~ 12Next Generation ADV HDI 0.25mm1 Track4030 ~ 3510 ~ 12Forecast At limit or beyond subtractive process

9 Project – Purpose & Objectives Problem Test vehicles for BGA & HDI technology lag by a decade Do not reflect current design practice & materials Falling into dis-use by practitioners in favor of EOL product testing Creating a void in up-stream device and materials development Objective Create/validate an open source ALV-HDI test vehicle based on current & near term Smartphone design practice General purpose test patterns for ALV PCB and assembly level tests Reference drop test vehicle for JESD-B (existing design) Smartphone forma factor for JESD-B validation (new design) Run validation tests for proof or concept/design & standardization © High Density Packaging Users Group, Inc.

10 Project – Goals & Deliverables Goals Build a collaborative working group handheld product technology within HDP for this and future projects Stakeholders from Materials, PCB, Packaging and Assembly Establish a suite of basic methods and tools suitable for the general assessment of the technology Build & test first generation TV designs for validation Deliverables: Generic, modular, Test Vehicle form factor spec & DFM guidelines General purpose test vehicle & drop test vehicle designs in Gerber Demonstrator samples for future reference Test data and reports for proof of concept build

11 Project – TV Design Goals The TV form factor should have the capability to: Scale to smartphone or handheld device form factors, materials sets and production formats typical of the art Include as a design technology baseline: Modularized, based on 50mm x 50mm increments for various mixes of bare board & assembly TVs 0.40mm pitch BGA & 0.30mm pitch WCSP test devices chip passives (low value or zero ohm resistors) 40/60um nominal line/space design rules All Layer Via interconnect with stacked vias, Via in Pad 12 layer build-up in plane/signal pattern configuration and pattern density typical of the art for Smartphone logic boards PCB materials typical of the art with FR4.1 with 1037 & 1067 reinforcement incorporated in the design © High Density Packaging Users Group, Inc.

12 General Project Work Flow Data Analysis & Failure Analysis Data Analysis & Failure Analysis PCBA Assembly & ICT PCB Fabrication & SOT PCB Fabrication & SOT PCB TV PoC Build & Test ( reflow, MSA ) PCB TV PoC Build & Test ( reflow, MSA ) PCB TV Redesign ( if required) PCB TV Redesign ( if required) PCBA Assembly Tooling Design & Preparation PCB Materials Components & Assembly Materials Components & Assembly Materials AATS Drop Tests Test Report Paper & Poster Short Term Tests Long Term Tests End Start PCB TV Design & Tooling PCB TV Design & Tooling Idea Stage Implementation Stage current status

13 Test Work Flow PCB & AATS TV Start PCB TV Test Kit PCB TV Test Kit Without Conditioning Reflow Simulation 6x, 12x Reflow Simulation 6x, 12x 0.40mm BGA 0.25mm BGA passive 0.25mm BGA passive PCBA TV Assembly & Kit PCBA TV Assembly & Kit - Mechanical - Thermal - IST - Mechanical - Thermal - IST IST Pass triggers ASSY -CAF 1000 hrs -AATS 2000 x -CAF 1000 hrs -AATS 2000 x Data Analysis, Failure Analysis & Reporting Data Analysis, Failure Analysis & Reporting End AATS 2000x or beyond (to fail)

14 Test Work Flow Drop Test Vehicles Start Drop Test TV PCB couppns Without Conditioning Reflow Simulation 6x, 12x Reflow Simulation 6x, 12x 0.40mm BGA 0.30mm WCSP PCBA TV Assembly & Kit PCBA TV Assembly & Kit -4 Point Bend -JEDEC Drop -4 Point Bend -JEDEC Drop IST Pass triggers ASSY Data Analysis, Failure Analysis & Reporting Data Analysis, Failure Analysis & Reporting End - Mechanical - Thermal - IST - Mechanical - Thermal - IST

15 Project Task List

16 Work Progress – PCB TV Prototype peel strength strips thermal analysis (w/ copper) thermal analysis (w/o copper) High-Pot layer/layer line/line 4 point bend BGA ball shear/pull multi-pattern delamination stacked via hole/hole CAF 0.30/0.40mm layer/layer CAF PTH hole/hole CAF 0.60/0.50mm pitch PTH daisy-chain 0.60/0.50mm pitch stacked via daisy-chain 0.30/0.40mm stacked via IST coupons 0.30/0.40mm line/line CAF 75/50um spacing

17 Active Participants EngentFei Xie KyzenMike Bixenmann PanasonicTony Senese TTMTommy Huang Angela Lee Summer Xiao C.B. KatzkoProject Leader HDPUGRuben Bergman Robert SmithProject Facilitator

18 Supporters & Friends Alcatel-Lucent Joseph SmetanaITEQRobert Hung Boeing Kenneth C. NoddingsKyzenMike Bixenmann Curtiss-Wright Ivan StraznickyNihon SuperiorKeith Howell Engent Dan BaldwinPanasonicAbe Tomoyuki Paul HoustonPark ElectroSilvio Bertling Flextronics Jennifer NguyenPoltronicPaul Collander HDPUG Jack FisherSekisuiHiroya Ishida Lawrence SchultzShengyi SytechKevin Zhang Marshall AndrewsTTM TechnologiesZaron Huang Hitachi Chemical Ken HikidaMarika Immonen Takahiro TanabeTarja Rapala Isola Fred HickmanTexas InstrumentsLuu Nguyen TUCAlan Cochrane

19 Thank You Q&A © High Density Packaging Users Group, Inc.


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