Presentation on theme: "Materials & Processes Technical Committee Meeting May 28, 2014, Wednesday 7:00 - 8:00 AM Europe 3, Swan & Dolphin Resort, Walt Disney World Attendees (in."— Presentation transcript:
Materials & Processes Technical Committee Meeting May 28, 2014, Wednesday 7:00 - 8:00 AM Europe 3, Swan & Dolphin Resort, Walt Disney World Attendees (in random order): Eric Perfecto, Diptarka Majumdar, Dong W. Kim, Bing Dang, Kwang-Lung Lin, M. J. Yim, Daniel Lu, Jim Morris, Bill Chen, Ning-Cheng Lee, Chin C. Lee (Chair), C. P. Wong, Yu-Hua Chen. Agenda Introduction: each member introduced him/herself. Report on Webniar in Oct. 2013Daniel Lu Report on Newsletters M J Yim Report of ECTC M&P Subcommittee Diptarka Majumdar IEEE CPMT Advanced Packaging Materials (APM) Symp., 2015: It was planed to be held in Shenzhen in Oct-Nov. 2015. At present, steering committee includes Tim Chen and Daniel Lu. Anything else: ITRS Assembly and Materials workgroups to organize a workshop as a part of APM 2015.
CPMT-M&P News Letter Status MJ Yim CPMT-M&P TC Web Administrator
2014 May 2014 News Letter- NEW! CPMT MP TC Newsletter May 2014 DW KIM – FinalCPMT MP TC Newsletter May 2014 DW KIM – Final (DW Kim @ Qualcomm) 2013 December 2013 News Letter Silver flip-chip technology posterSilver flip-chip technology poster (CC Lee @UC Irvine) November 2013 News Letter 2013_Saint-Venant_CPMT_Materials_TC_1206132013_Saint-Venant_CPMT_Materials_TC_120613 (E. Suhr @Portland State Univ.) October 2013 News Letter IEEE CPMT-TC5 Materials and Process-MJ Yim-Oct-Newsletter-2013IEEE CPMT-TC5 Materials and Process-MJ Yim-Oct-Newsletter-2013 (MJ Yim @Intel) August 2013 News Letter CMPT MP TC Newsletter Aug 2013 (Paik)CMPT MP TC Newsletter Aug 2013 (Paik) (KW Paik@KAIST) Need more contribution from M&P members on monthly newsletter to facilitate networking and sharing. Uploaded Newsletter and Contributors
2014 ECTC: M&P Subcommittee ChairDiptarka Majumdar Co-chair (outgoing)Stephanie Potisek Incoming co-chairBing Dang Number of abstract submissions receivedPrimary89 Secondary77 Number of abstracts accepted for presentationOral35 Poster17 SessionsChairDateTime Adhesives, Underfills, TIMsRobert KaoMay 288:00 AM Don Frye Novel Materials & ProcessesIvan ShubinMay 281:30 PM Bing Dang 3D Materials & ProcessingMyung Jin YimMay 291:30 PM Daniel Lu Solders & BondingMikel MillerMay 308:00 AM Grace Yi Li SubstratesDong Wook KimMay 301:30 PM Yu-Hua Chen
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