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MFLEX ranked #35 on Fortunes List of 100 Fastest Growing Companies MFLEX Overview January, 2011 MFLEX Confidential.

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Presentation on theme: "MFLEX ranked #35 on Fortunes List of 100 Fastest Growing Companies MFLEX Overview January, 2011 MFLEX Confidential."— Presentation transcript:

1 MFLEX ranked #35 on Fortunes List of 100 Fastest Growing Companies MFLEX Overview January, 2011 MFLEX Confidential

2 Table of Contents Company Overview MFLEX Value Proposition & Value Added Differentiation FPC Technology FPCA Technology Module Integration Conclusion Appendix Slide – 3 Slide – 7 Slide – 13 Slide – 27 Slide – 40 Slide – 50 Slide – 55 2MFLEX Confidential

3 3 Company Overview

4 Who is MFLEX ? – Flex Manufacturer with State of the Art Manufacturing Facility in Suzhou, China capable of 35um L/S CY 2009 Third largest FPC fabricator worldwide (Source: Japan Marketing Survey, Japan) – Global Leader in Flex Assembly Additional New Clean Room Assembly Facility in Chengdu, China, online Q – Global Leader in Module Assembly & Chassis Integration Dedicated Secure Assembly Facilities to protect Customer Intellectual Property (IP) Where does MFLEX Operate ? – Manufacturing Operations 150,000 m 2 of manufacturing space in Suzhou & Chengdu, China – R&D in USA, UK, & China for Process and Product Development – Center of Excellence in USA to Incubate Ideas for New Offerings – Multiple offices in USA, Europe and Asia for Local Sales and Applications Engineering Support – Approximately 17,000 employees globally How is MFLEX Performance ? – Revenue $791 Million (FY-2010), Cash & Cash Equivalents of $100 Million * – 2003 – 2010 CAGR of 30% – Ranked # 35 on FORTUNEs 2010 list of Fastest Growing Companies NASDAQ symbol: MFLX * November 4, MFLEX Confidential

5 Continued Investment in Capability & Capacity MFLEX has a history of investing nearly 10% in capital equipment each year Investing over $80 million in 2010, continue plant capability investments in 2011 Equipment and facility expansion for capacity increase – Bare Flex capacity & capability addition (MFC3) and upgrades to MFC2 in Suzhou, China – Dedicated assembly facilities to protect customer IP Technology, quality, and efficiency – Rigid Flex, fine pitch and automation including Roll to Roll – Automation Initiatives for FPC and FPCA – Strategic Initiative on Lean Manufacturing, Six Sigma Quality Systems – Ongoing training programs for line leaders, supervisors and managers Advanced Technology Group – Anaheim New Materials and Processes – China Process Development – CambridgeHID Development MFLEX Confidential5

6 MFLEX Evolution - Moving Up the Value Chain BARE FLEX Commodity Flex Early Design Involvement Through Global Application & Design Engineering FLEX ASSEMBLIES Integration of Flex & Components MODULE INTEGRATION Functional Modules, Chassis Integration TECHNOLOGY MANUFACTURING Enabling Technologies to help customers differentiate 6MFLEX Confidential

7 7 MFLEX Value Proposition & Value Add Differentiation to Meet Market Trends

8 Early Supplier Involvement (ESI) during Concept Phase – Advanced Technology with minimal design constraints – Early Supplier Involvement (ESI) at product concept stage to create a 3-D packaging solution to make products thinner, smaller, smarter & lighter New Product Introduction (NPI) – Quick ramp to volume capabilities Production – Cost effective & sustainable High Volume Production ConceptPre-ProductionDesignPrototypeProduction NPI ESI MFLEX Value Proposition – Concept to Production 8MFLEX Confidential

9 MFLEX Value Added Differentiation Expand use of core technology Upward Integration by adding functionality Applications Engineering Support to solve 3-Dimensional Electronic Packaging Needs FPC FPCA MFLEX Core Technology Product Chassis Assembly & Higher Level Integration 9MFLEX Confidential

10 MFLEX Approach to Meet Market Trends 10MFLEX Confidential MFLEX Strengths Enable Unique Industrial Designs with better Ergonomics Rapid Response Production Capacity Smaller & Smarter Electronics Packaging Solutions Higher Complexity Products

11 IP Protection Benefit For optimal IP protection MFLEX uses dedicated satellite assembly sites for Module Integration Secure facilities dedicated to a specific Customer or Program Customer/Program Specific Dedicated Operators & Project Teams IP is secured since only specific/related customer is allowed as an external visitor to the facility If demand needs adjustment, impact on other projects can be made visible Highly efficient and appreciated by current customer base MFLEX Confidential11

12 Electronics Assembly & Interconnect Levels Level 0 Level 1 Level 2 Level 3 Level 4 FPC Direct Chip Attachment to FPC FPCA Module Assembly & Chassis Integration End Product Flexible printed circuit fabrication Wire Bond or Flip Chip attachment to flexible printed circuit A fully assembled FPC containing ICs, resistors, capacitors, diodes, FPCA mounted on chassis with various types of hardware Functional System 12MFLEX Confidential

13 13 FPC Technology (Level 0)

14 FPC Capabilities Overview 3 FPC Fab Facilities in Suzhou including a state of the art new 56,680m² facility operational September 2010 with roll-to-roll capabilities Current FPC monthly production capacity: 120,000m² FPC monthly production capacity by April 2011: 150,000m² FPC monthly production capacity by July 2011: 175,000m² MFLEX Confidential14

15 New Advanced FPC Fab Capability and Capacity 1.Panel Process – Phase 1 (Sept-2010) – 15,000 m 2 – Phase 2 (Apr-2011) – 15,000 m 2 – 50µm line/space – FPC and Rigid-flex 2.Roll-to-Roll Process – Phase 1 (Oct-2010) – 10,000 m 2 – 35µm line/space – Single-sided and Double-sided FPC – Phase 2 (Feb-2011) : 25 um line/space MFLEX Confidential15 Copper Plating

16 MFLEX Confidential16 Trademarks and Logos are the property of their respective owners Roll-to-Roll Process Laser Drilling Copper Plating Dry Film Lamination Exposure

17 MFLEX Confidential17 Trademarks and Logos are the property of their respective owners AOI Lamination Roll-to-Roll Process (cont.)

18 FPC Technology Roadmap-Mass Production HDI Type:Staggered Blind/Buried HDI Laser Via Size:100µm HDI Type:Staggered Blind/Buried HDI Laser Via Size:75µm HDI Type:Stacked Blind/Buried HDI Laser Via Size:50µm 2010 (1H)2010 (2H)2011 Location: MFC1, MFC2Location: MFC3, MFC2, MFC1Location: MFC3, MFC Line/Space: 65 µm Line/Space: 25µm Line/Space: 35µm 18MFLEX Confidential Surface Copper 18 µm Surface Copper 12 µm Surface Copper 9 µm

19 Fine-line Capability Roadmap MFLEX Confidential19 Panel/Sheet (SS/DS and Multi-Layer FPC) Copper ThicknessDescriptionProcess Sep.'10Dec.'10May.'11Oct.'11 MPLPMPLPMPLPMPLP 9 um - Foil OnlyEL with BP, IL. NA50NA um - Foil OnlyEL with BP, IL um - Foil OnlyEL with BP, IL um - Plated FoilEL with PP(9-3) um - Plated FoilEL with PP(12-2) Roll To Roll (SS/DS FPC) Copper ThicknessDescriptionProcess Oct.'10Dec.'10Feb.'11Aug.'11 MPLPMPLPMPLPMPLP 9 um - Foil OnlyEL with BP, EL. NA um - Foil OnlyEL with BP, EL. NA um - Foil OnlyEL with BP, EL. NA35 18 um - Plated FoilEL with PP(9-3)+12NA um - Plated FoilEL with PP(12-2)+15NA EL= External LayerBP= Button PlatedMP= Mass ProductionAll values shown are in microns (µm) IL= Internal LayerPP= Panel PlatedLP= Limited Production

20 Development – Additional processes LDI – Available for dry film processing – November 2010 Registration tolerance better than +/- 25um Feature to holes, layer-to-layer – Available for solder mask processing – March 2011 Registration tolerance better than +/- 25um Openings for components 0.4mm pitch for BGA/LGA Electroless copper alternative to Shadow graphite chemistry – For Rigid-flex and complex ML FPC that require via fill – Development Pilot line available – December 2010 – Basis for FPC and Rigid-flex via-fill and stacked-via development; future fine line semi-additive processes Copper filled PTH & microvia – ± 7% panel Copper uniformity, high ductility Copper MFLEX Confidential20

21 Development – Surface Finish MFLEX Confidential21 Flexible (soft) ENIG process (mass production line) – Ready for production, pending customer approvals – Line fully configured for conversion to ENEPIG Mass Production ENEPIG Development pilot line – 200 panels/day capacity – Ready by November 2010 – For process chemistries evaluation and prototype support

22 Development – Rigid-Flex MFLEX Confidential22 Design and Process Concept – Target markets: mobile phone, automotive, medical – Typical 4-8 layers – Static bend and dynamic applications – Assembly design and process considerations – Ready to market March 2011 – Technical considerations Materials – for stability, dynamic applications Design Process Product reliability

23 Development – FPC Materials Q Flexible solder mask – Pending customer approval Black coverlay (multiple suppliers) Flexible photoimageable coverlay Q Thin copper < 9um for fine pitch display applications LCP for impedance control requirement – High temperature press installed by November 2010 Q Sputtered copper material on PI for < 25 micron L/S by semi-additive methods MFLEX Confidential23

24 Development - Automation Panel size Coverlay layup and pre-laminate Shielding cut, punch and apply Stiffener pick and place Automatic punch for singulation Roll to roll systems and Material handlers Multilayer Registration Systems -(2+n+2) to 12 layers Automated Plating Line Racking Systems for reduced handling damage MFLEX Confidential24

25 MFLEX Confidential25 FPCA Technology (Level 1 and 2) (Level 1) (Level 2)

26 FPCA Capabilities Overview 200 SMT lines and 24 Chassis Integration Assembly lines MFLEX Confidential26 SMT Lines Chassis Integration Lines

27 FPCA SMT Capabilities Overview SMT Lines include: – Solder Paste Inspection – AOI – 3D X-Ray – Conformal Coating and Underfill Encapsulation MFLEX Confidential27 Conformal Coating AOI Solder Paste Inspection Trademarks and Logos are the property of their respective owners

28 FPCA Chassis Integration Capabilities Overview Chassis Integration Assembly Lines include: – Heat Staking – Selective Laser Soldering – Laser Welding – Bending FPCA for 3D Packaging MFLEX Confidential28 Selective Laser Soldering Trademarks and Logos are the property of their respective owners Bending

29 FPCA Chassis Integration Capabilities Overview (cont.) Chassis Integration Assembly Lines include: – Spot Welding – ACF Bonding and Wire Bonding MFLEX Confidential29 Trademarks and Logos are the property of their respective owners Spot Welding ACF Bonding

30 FPCA Capabilities Overview New Clean Room SMT & Chassis Integration Assembly Facility in Chengdu currently under construction, operational by CY Q MFLEX Confidential30 Trademarks and Logos are the property of their respective owners

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