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© 2003 APC corporation.. Improving Cooling efficiency in tomorrow's data centre Kevin Hughes, APC Senior Systems Engineer.

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Presentation on theme: "© 2003 APC corporation.. Improving Cooling efficiency in tomorrow's data centre Kevin Hughes, APC Senior Systems Engineer."— Presentation transcript:

1 © 2003 APC corporation.

2 Improving Cooling efficiency in tomorrow's data centre Kevin Hughes, APC Senior Systems Engineer

3 © 2003 APC corporation. Agenda  The Problem: High Density IT Equipment  Legacy Cooling System Limitations  The Solution: APC InfraStruXure In-Row Cooling Innovation  The Benefits of IR Cooling Methodology  Summary

4 © 2003 APC corporation. The Problem  Average rack in a typical data center is under 2 kW  Full deployment of high density servers (10-20 kW per rack) would greatly exceed the power and cooling ability of the typical data center  Providing 10-20kW of cooling per rack is technically impractical to infeasible using conventional methods

5 © 2003 APC corporation. What is the industry saying ? “You cannot keep it a secret, performance-per-watt will become critical over next decade. […] for every watt that goes into a processor you will use another watt to cool it“, Steve Prentice, research VP at Gartner June 2006 "There's no question that the issue of power and cooling is a growing concern. The assumptions used for building data centres have been blown away", John Humphreys, IDC Analyst

6 © 2003 APC corporation. Industry statistics Power & cooling #1 issue for CIOs  70% of respondents recently said power and/or cooling issues are now their single largest problem facing their datacenters  Projections are 48% of IT budget spent on energy, up from 8% Source: Gartner CIO Survey

7 © 2003 APC corporation. Sectional 5’-6” from Raised Floor Redundancy:  Any unit failure results in loss of cooling to an area  N+1 at room level does not provide adequate cooling in failure modes Legacy Architecture Legacy Limitation: Unpredictable Performance

8 © 2003 APC corporation. Grate tile Perf tile Blade Servers Standard IT Equipment With Effort Typical Capability Extreme Impractical [47.2] [94.4] [141.6] [188.8] [236.0] [283.2] [330.4] [377.6] [424.8] [471.9] Requires careful raised floor design, careful CRAC placement, and control of under- floor obstacles cfm Rack Power (kW) that can be cooled by one tile with this airflow Floor Tile Cooling Ability Cooling capability limitations of Legacy Architecture - Floor Tiles Tile Airflow (cfm) [L/s]

9 © 2003 APC corporation. Supplemental Solutions - Effective only in the short term - A new & different system to purchase, install, learn about, operate & maintain - More failure points - Increased Operator Error Risk - Relatively Inflexible - Redundancy is Questionable

10 The Solution: In-row rack-coupled CRAC

11 © 2003 APC corporation. CFD model of in-row system: Modeling failure of one CRAC

12 © 2003 APC corporation. Basic building block: rack form factor CRAC InfraStruXure Cooling Distribution Unit  ½ Rack form factor  N+1 hot-swap variable speed fans  Captures hot air exhaust from nearby IT racks  Overhead or under-floor piping  Works with any brand of IT cabinet  Add units for redundancy or density

13 © 2003 APC corporation. InRow RC Product Design Benefits Air Filter Removes airborne particles, protects coil Top or Bottom Piping Connections Variable Speed Hot Swappable Fans Rightsizes cooling capacity, energy savings Cooling Coil Removes heat using chilled water Condensate Management Detects and removes condensation Field Configurable 2-Way or 3-Way Valve Operation Casters Allows unit to move easily InfraStruXure ® InRow RC Dual A-B Power Inputs Power redundancy and protection Flow Meter Measures water flow to facilitate determining unit kW output

14 © 2003 APC corporation. In-row rack-coupled CRAC InfraStruXure Cooling Distribution Unit  Bayed to adjacent IT racks  Up to 60kW rating  N+1 hot-swap fans  Directly ducts hot air exhaust from connected IT rack  Front may be open or ducted  Mix into existing legacy data center  Add second unit for redundancy or capacity

15 © 2003 APC corporation. In-row with hot aisle containment

16 © 2003 APC corporation. CDU serving 12 x RC’s

17 © 2003 APC corporation. Isolation and balancing valve Allows isolation for servicing and provides coolant flow adjustment InfraStruXure ® Cooling Distribution Unit InfraStruXure ® Coolant Distribution Unit (CDU) Individual supply and return lines Supplies and returns coolant to and from CRAC units Main supply and return headers Supplies and returns coolant to and from the Chiller Top or bottom piping connections Allows the CDU to be top or bottom piped Condensate pan with drain connection Casters Allows the CDU to be installed easily Isolation valve Allows isolation for servicing

18 © 2003 APC corporation.

19 What about installation and piping? InfraStruXure ® InRow RC  Water in the data centre?  What about leaks and condensation?  Complicated installation?  Retrofittable to existing data centre?

20 © 2003 APC corporation. What is PEX?  “Cross-Linked Polyethylene”  Semi-flexible piping solution  Corrosion free, low head loss, highly reliable  Developed in 1960’s  EU, 1980’s  NAM  Applications  Plumbing, district heating / cooling, hydronic radiant heating, snow melt, ice rinks, refrigeration warehouses  Standardized product  ASTM F877 (tubing), ASTM F1807 (fittings)  Approved material in all national plumbing codes  UL Flame Ratings  Why use in APC InfrastruXure™ cooling?  ‘Pay as you grow’ compatibility  Increased Reliability

21 © 2003 APC corporation. Piping Piping Standardized Fitting  Decreased Human Error Connections & Supports for PEX-AL-PEX

22 Alternative In-row rack-coupled CRAC Solutions

23 © 2003 APC corporation. InfraStruXure ® InRow RP In-row precision air conditioning for medium to large data centers including high density applications. The predictable solution for an unpredictable environment

24 © 2003 APC corporation. InRow RP Product Design Benefits Top or Bottom Piping Connections Condensate Management Detects and removes condensation Cooling Coil Removes heat using chilled water or refrigerant Electric Reheat Controls temperature during dehumidification Steam Humidifier Maintains moisture level in room Casters Allows unit to moved easily InfraStruXure® InRow RP Air Filter Removes airborne particles, protects coil Variable Speed Compressor Only on DX Version

25 © 2003 APC corporation. InfraStruXure InRow SC Air from plenum space pulled into unit via condenser fans Cool air is supplied to row or room Condenser air absorbs heat from coil Heat transferred to condenser coil Heat rejected from condenser coil to plenum space Evaporator coil absorbs heat from air Hot exhaust air from IT equipment pulled into unit via evaporator fans

26 © 2003 APC corporation. High Density Case Study

27 © 2003 APC corporation. InfraStruXure ® Designer: Intelligent data centre design tool

28 © 2003 APC corporation. Summary  Your data centre’s Network Critical Physical Infrastructure (NCPI) must support dynamic business needs  High-density server deployment requires unique cooling and power solutions  In-row, close-coupled cooling maximises efficiency  NCPI Health Check increases availability and reduces TCO of existing systems  APC’s original In-Row Cooling is the most cost effective, agile solution to today’s cooling challenges  Complexity is not a necessity.  Do not tolerate unpredictable performance & inflexibility  Doing high density the right way costs less

29 © 2003 APC corporation. Thank you  white papers 


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