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1 EuroSimE, 18-20.04.2011, Linz, Austria Trends of Micro- and Nanoelectronics in the European R&D Programme Vesselin Dontchev Nanoelectronics Components.

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Presentation on theme: "1 EuroSimE, 18-20.04.2011, Linz, Austria Trends of Micro- and Nanoelectronics in the European R&D Programme Vesselin Dontchev Nanoelectronics Components."— Presentation transcript:

1 1 EuroSimE, , Linz, Austria Trends of Micro- and Nanoelectronics in the European R&D Programme Vesselin Dontchev Nanoelectronics Components and Systems Information Society & Media Directorate-General European Commission Disclaimer: Views expressed in this presentation are not necessarily stating an official position of the European Commission

2 2 EuroSimE, , Linz, Austria Presentation outline  Europe 2020 – a new strategy for the EU  Current EC funding of EU Research (ICT in particular)  Nanoelectronics- Examples of research projects dealing with simulation  Today’s opportunities: ICT WP  Information on the future programme (2014+)  Summary

3 3 Smart Growth: knowledge and innovation economy Sustainable growth: greener and competitive economy Inclusive growth: high employment, knowledge people and social and territorial cohesion EUROPE 2020: A EU strategy for smart, sustainable and inclusive growth 5 EU Targets – translated into national ones 7 Flagship initiatives – EU & national action A new strategy - EUROPE 2020 EuroSimE, , Linz, Austria

4 4 Europe 2020: 5 EU Headline Targets (translated in national and regional ones) By 2020: 75 % (now 69) employment rate (% of population aged years) 3% (now 1,8 % only) investment in R&D (% of EU’s GDP) “20/20/20” 20% cut in greenhouse gas emissions (compared to 1990) 20% increase in use of renewable energy 20% cut in energy consumption through improved efficiency < 10% (now 15) early school leavers & min. 40% (now 31) hold tertiary degree 20 million less people (now 80) should be at risk of poverty EuroSimE, , Linz, Austria

5 5 Presentation outline  Europe 2020 – a new strategy for the EU  Current EC funding of EU Research (ICT in particular)  Nanoelectronics - Examples of research projects dealing with simulation  Today’s opportunities: ICT WP  Information on the future programme (2014+)  Summary

6 6 EUROSTARS PEOPLE Capacities (INFRASTRUCTURES) IDEAS - ERCSMEs and SME Associations ICT-FET (Flag Ships) COOPERATION Joint Programming Ageing (More Years Better Lives) Climate Knowledge (Clik-EU) Seas and Oceans Antimicrobial resistance Urban Europe Water challenges The EU’s research and innovation landscape Deployment Fundamental Applied InnovationDevelopment EC Funds National and Regional Funds Eureka! ERANET+ ERANET JTI Artemis, Eniac Clean Sky, IMI, FCH Art. 169 AAL Bonus EMRP PPP PPP (recovery packages) Energy Efficient Buildings Future of Factories Green cars Future Internet CIP competitiveness & innovation programme

7 7 FP7: total of 50 B€ ( ) FP7: Council/Parliament Co-decision EuroSimE, , Linz, Austria 5 major specific programmes:

8 8 FP7 Cooperation Specific Programme +700M€ for eInfrastructures from the Capacities programme EuroSimE, , Linz, Austria 10 key thematic areas:

9 9 9 Future & Emerging Technologies (FET) 1. Network and Service Infrastructures ICT for socio-economic challenges Basic ICT technologies & infrastructures ~10% ~9% ~11% International cooperation, Horizontal actions 3. Components and Systems 4. Digital Content and Languages 2. Cognitive Systems and Robotics 5. ICT for Health, Ageing, Inclusion & Gov. ~26% ~6% ~17% ~7% ~11% 6. ICT for Lower- Carbon Economy ~12% 7. ICT for Manufac. & Enterprise 8. ICT for Learning & Cultural Resources ~6%~4% +JTIs +AAL PPP 2 PPPs incl FI PPP Challenges in the ICT programme (What is the money spent on?)

10 10 M€ TOTAL FP7 ICT CIP Financial support –FP7: master & shape research & development –CIP: ensure wider uptake & better use of research –+ Regional and Structural Funds,… FP7-CIP/ICT Budget Profile: EuroSimE, , Linz, Austria 2 nd half of FP7 – significant increase of funding !

11 11 In 2011, the FP7 ICT Programme is in its 5 th year of implementation 7 main calls have been launched and evaluated –Total number of projects ~1200 Launch of two JTIs and AAL initiative –4 Calls launched for ENIAC with 130 M€ (EC contribution) 4 th call is ongoing WP done, WP 2013 (1.76 B€) is in preparation ICT in FP7: Where do we stand? EuroSimE, , Linz, Austria

12 12 ICT in the FP supports collaborative R&D projects –industry - academia from at least 3 MS or AS –Project size between 3M€ and 20 M€ of funding –4 to 20 partners per project Supports ~ researchers and engineers/year During –~ 5000 distinct organisations, ~14000 participations –~ 1250 projects running (FP6 + FP7) ICT in FP7 EuroSimE, , Linz, Austria

13 13 EuroSimE, , Linz, Austria Presentation outline  Europe 2020 – a new strategy for the EU  Current EC funding of EU Research (ICT in particular)  Nanoelectronics - Examples of research projects dealing with simulation  Today’s opportunities: ICT WP  Information on the future programme (2014+)  Summary

14 14 EuroSimE, , Linz, Austria Atomics Advanced Front-End Technology Modeling for Ultimate Integrated Circuits FP6 IST programme Consortium Budget Total Cost: 4.4M€ EC : 2.5 M€ OBJECTIVES Development of TCAD models suitable for a) materials (strained and unstrained SiGe alloys, strained Si, SOI, etc); b) processes (activation and diffusion of dopants, formation of extended defects, including low-temperature and millisecond annealing, point-defect engineering) employed at the 32 nm technology node and beyond. MOTIVATION TCAD can save 30% development time and costs (ITRS 2008) Example Dependence of dopant solubility on strain (Ahn et al. PRB 2009) The models are - implemented in simulation software Sentaurus (Synopsys) - validated with respect to industrial needs (STM)

15 15 EuroSimE, , Linz, Austria Atemox Advanced Technology Modeling for Extra-Functionality Devices Budget Total Cost: 4.1M€ EC Contribution: 2.85 M€ Consortium Objectives - extend the capabilities of TCAD to the prediction of - leakage currents in CMOS structures - the alternative doping processes considered for a reduction of leakage currents. Key Issues Full set of missing models for simulating leakage currents in CMOS derivatives → providing extra functionality to the basic NE technology with sizes  22 nm CMOS transistors. Implementation and integration of the models into the Sentaurus TCAD platform of Synopsys. Evaluation of the integrated models by STMicroelectronics. Expected impact Predictive simulations of CMOS derivatives in industrial environments at an early stage of development. Significant reduction of development time and costs. Extending the EU knowledge and skills in NE Competitiveness of EU industry in CMOS derivatives

16 16 EuroSimE, , Linz, Austria Presentation outline  Europe 2020 – a new strategy for the EU  Current EC funding of EU Research (ICT in particular)  Nanoelectronics - Examples of research projects dealing with simulation  Today’s opportunities: ICT WP  Information on the future programme (2014+)  Summary

17 17 ICT Work Programme Challenge 3: Alternative Paths to Components and Systems Objectives: 3.1. Nanoelectronics 3.2 Smart components and smart systems 3.3 Embedded systems 3.4 Computing Systems 3.5 Photonics 3.6 Organic Electronics and Photonics

18 18 Objective 3.1: Very Advanced Nano-electronics Components Target outcomes: Beyond CMOS technology Circuit - technology solutions Nano-manufacturing and Joint Equipment Assessment Coordination and Support Actions Call 8 60M€ ICT Work Programme EuroSimE, , Linz, Austria

19 19 Two complementary funding schemes FET Proactive Top-down approach Set of novel pre-defined themes FET Open Bottom-up approach Open to any research idea Nano-electronics related topics with EU funding ~ 30M€/year: Molecular-scale systems, Tera-scale computing, Quantum-ICT, Bio-Chemistry-based ICT and Towards zero power ICT Future & Emerging Technologies – FET Supporting high-risk transformative research in ICT EuroSimE, , Linz, Austria ICT Work Programme

20 20 European vision of the More Moore and More than Moore domains More than Moore: Diversification Moore’s Law: Miniaturization Baseline CMOS: CPU, Memory, Logic 130nm 90nm 65nm 45nm 32nm 22nm Extended CMOS Analog/RFPassivesHV Power Sensors Actuators Biochips Information Processing Digital content System-on-Chip (SoC) Interacting with people and environment Non-digital content SoC & System-in- Package (SiP) Combining SoC and SiP: Higher Value Systems Beyond & Extended CMOS technologies need to meet the criteria of systemability, integratability and manufacturability Nanoelectronics ”Small, smaller, smarter” - Advanced components in advanced systems enabling pervasive applications - Beyond CMOS

21 21 To ensure interaction between system competences and device technology to better incorporate the device in a system to perform a given function. To address energy efficiency needs (e.g. for mobile applications). Nanoelectronics devices as system enablers should provide solutions for global challenges To prepare for “beyond” traditional shrinking (ITRS roadmap) 35 nm Gate Length Objective 3.1: Advanced Nanoelectronics Technology S y s t e m a b i l i t y EuroSimE, , Linz, Austria

22 22 ITRS-ERD vision of the role of Beyond CMOS and More than Moore elements to form future extended CMOS platforms. Future developments in Beyond CMOS and More than Moore as an extended- CMOS vision. No disconnection from the advanced silicon CMOS in order to keep the impact of its results on the applications and markets. Needs of hybridizing silicon with molecular switches, ferromagnetic logic, spin devices and sensors in order to enable heterogeneous and morphic system architectures. Integrateability of novel technology with CMOS and their reliability become key factors. Objective 3.1: Advanced Nanoelectronics Technology I n t e g r a t a b i l i t y EuroSimE, , Linz, Austria

23 23 European equipment and material companies i) Access to nano-manufacturing and to advanced technologies  positive feedback ii) Joint assessment and demonstration platform  Evidence of reproducible equipment parameters  Stimulate the access to world wide equipment market (especially important for SMEs) Semiconductor Equipment for Wafer Bonding with Plasma Activation EV Group, CEA-LETI, Soitec 3D Integration of Bulk Si Wafers EV Group, CEA-LETI, STMicroelectronics Crolles II Low Energy and Dose Implant Test SEMILAB, Fraunhofer IISB, ST Microelectronics Crolles II, NXP Crolles R&D Ruthenium Atomic Vapor Deposition Competitiveness in Nanoelectronic Device Generations AIXTRON, Fraunhofer IISB, Infineon Munich Metrology Using X-Ray Techniques Jordan Valley, CEA-LETI, STMicroelectronics Crolles II, NXP Crolles R&D Objective 3.1: Manufacturing and Equipment assessment EuroSimE, , Linz, Austria M a n u f a c t u r a b i l i t y Concept to be taken into account at early stages of research From prototype to a reliable manufacturing of devices with predefined reproducible parameters.

24 24 1. Phenomena and Effects * Quantum and atomic scale ; * Electro-thermo-mechanical * Transport (drift, diffusion ); * System integration at the nanoscale 2. New materials * Graphene; Gemanene; * CNT; * Nanowires; * Complex magneto-electric lattices. 3. Devices * New switches (+molecular) and interconnects; * Emerging memories; * Ferromagnetic logics; * Spin devices; * Nano-photonics devices and interconnects; * Carbon based; * MEMs, NEMs 4. Models for cross technology and cross IP level simulation 5. Multi-physics and multi-scale models, which can predict devices and circuits up to non-equilibrium systems. Objective 3.1 Modelling and simulation Modeling & Simulation – increasing importance (save costs !) models  measurements (challenging due to the miniaturization)

25 25 Dates  Open: 26 July 2011  Close: 17 January 2012 (at 17:00 Brussels local time) Funding schemes: a)Beyond CMOS technology: STREPs b)Circuit-technology solutions: STREPs and at least 1 IP c)Nano-manufacturing and joint equipment assessment: STREPs and at least 1 IP d)Support measures: CSAs Indicative budget distribution - 60 M€:  IP/STREP 55 M€  CSA 5 M€ Objective 3.1 Information about call 8

26 26 ICT Proposers’ Day May, Budapest Networking for European ICT R&D Aim of the event: to prepare for Calls 8 and 9 (together >1 B€) –by networking and partnerships building –by first-hand information from >100 EC officials Structure: –thematic sessions with presentations of proposal ideas –information stands & meeting points Registration: free of charge, open from January EuroSimE, , Linz, Austria

27 27 EuroSimE, , Linz, Austria Presentation outline  Europe 2020 – a new strategy for the EU ?  Current EC funding of EU Research (ICT in particular)  Nanoelectronics - Examples of research projects dealing with simulation  Today’s opportunities: WP  Information on the future Common Strategic Framework (CSF) for R&I funding (2014+)  Summary

28 28 What is next? FP7 ICT WP ICT WP 2013 FP8 + CIPII  CSF (Common Strategic Framework) Preparatory work Strengthen, focus & simplify EIPs KETs Light and fast MAFF Externalisation 9 Feb Green Paper Feb-May Consultation based on Green Paper 10/6 Consultation ‘wrap-up’ event in Brussels June Proposal for next MAFF Dec Legislative proposal(s) for CSF

29 29 Common Strategic Framework (CSF) for EU R & I funding ( ) Three key messages More clarity of goals and strategy, - Higher impact on competitiveness / society, - More EU added value Simplification Procedures but also of programmes/instruments → To attract wider constituency, smaller entities Work across silos –research-innovation-policy priorities –between themes and disciplines –EU-MSs, public-private EuroSimE, , Linz, Austria Limited set of funding schemes - common across all activities Unique Rules for Participation Simplified cost-reimbursement approach with enhanced use of lump sums and flat rates.

30 30 3 sets of challenges, 4 types of activities, (funding schemes)” Draft Some first and preliminary thinking (from ICT theme) EuroSimE, , Linz, Austria Common Strategic Framework for EU R&I funding (2014+) A challenge oriented R&I framework A shift in the drive: From means/instruments to goals Societal challenges Industrial leadership Excellence in science Roadmap based partn. ( Focus ) Open, light (be flexible) Infrastr., skills (attract) Piloting (test, duffuse) e.g. Living labs e.g. Clean rooms, Innovation clusters E-Infrastruct. Pilots

31 31 Summary EUROPE renewed emphasis on R&D&I as a basis for smart, sustainable and inclusive growth. MAFF 2014+, CSF is key for the preparation: New opportunities for improvements and for holistic integrated views to face grand challenges (EU and global) Nanoelectronics has a major input to these processes Modeling & Simulation – increasing importance Participate in Call 8 !!! « Time is ready. Let us profit from these exciting times and take action ---- together -----” EuroSimE, , Linz, Austria

32 32 THANK YOU Information Society and Media: European research on the web: !!!! Take part in the consultation processes !!!! !!!! 2011 is a year of change, you can influence the future !!!! EuroSimE, , Linz, Austria

33 33 EuroSimE, , Linz, Austria

34 34 Systemability, integratability, manufacturability Transversal Research Projects Multi-disciplinary cooperation -System-technology interaction -Nanofabrication -Energy efficiency -Next switch -Universal memory -3D integration -Novel architectures - Advanced component technology + advanced system design - Beyond CMOS, Extended CMOS For systems 2020 and beyond Work Programme General concepts

35 35 Target outcomes Beyond CMOS technology New switches and interconnects with energy efficiency gain; Emerging memories; Nano-photonics devices and interconnects; Carbon based electronic devices Circuit-technology solutions Architectures including energy efficiency, spin devices ferromagnetic logics, Si with molecular switches Circuit design, methodology and tools addressing e.g. D-A-C Technology addressing 3D integration, MtM, photon-electron integration, power dissipation, etc. Modelling and simulation Nano-manufacturing and Joint Equipment Assessment Manufacturing approaches to Beyond CMOS and MtM and their integration with nanoCMOS including 3D Metrology/inspection analysis concepts; assembly and packaging Joint assessment of equipment/metrology, process solutions Coordination and Support Actions Access to training CAD tools, advanced technologies, design kits, education blocks, prototyping Roadmap, benchmark and strategy papers Stimulation of young people towards electronics careers, training, education International cooperation – Japan, USA, Taiwan, Korea Support coordination and standartisation actions, preparatory work for 450 mm Objective 3.1: Very Advanced Nano-electronics Components

36 36 ICT Work Programme 2013 continuity with WP effective bridge to the next CSF for R&I. Budget: 1.53B € Timing - three main phases: Options and orientations: Sept.- Dec Drafting: Jan. - March/April 2012 Decision: April/May-July 2012

37 37 Common Strategic Framework for EU R&I funding (2014+) 3 sets of challenges Societal Challenges Health and wellbeing; Safe food and sustainable agriculture; Secure, clean and efficient energy; Green transport; less congestion; Efficient use of resources & materials; Inclusive and safe society Creating Industrial Leadership & Competitive Frameworks Leadership in enabling technologies & FET; Access to risk finance; Integrating research, education and innovation; High potential SMEs Excellence in the Research Base Frontier research (ERC & FET), Skills and career development (Marie Curie); Research infrastructures incl. eInfrastructures A challenge oriented R&I framework A shift in the drive: From means/instruments to goals

38 38 Four simplified funding schemes addressing: Roadmap-based partnerships (focus !) Open, light and fast scheme (be agile, flexible! ) R&I infrastructures, innovation clusters, skills (attract!) Pilot actions in real-life settings (test and diffuse!) Common Strategic Framework for EU R&I funding (2014+)

39 39 Limited set of funding schemes - common across all activities Unique Rules for Participation of the CSF that will provide a set of common principles applicable to all actions Radically simplified cost-reimbursement approach with enhanced use of lump sums and flat rates Common Strategic Framework for EU R&I funding (2014+) Simplification

40 40 Timeline FebruaryGreen Paper European Council devoted to research & innovation Feb-MayConsultation based on Green Paper Consultation ‘wrap-up’ event in Brussels JuneProposal for next MАFF DecemberLegislative Proposal(s) for CSF and impact assessment EuroSimE, , Linz, Austria


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