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DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 ITRS Factory Integration TWG1 ITRS Factory Integration Presentation Mani Janakiram & Junji.

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Presentation on theme: "DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 ITRS Factory Integration TWG1 ITRS Factory Integration Presentation Mani Janakiram & Junji."— Presentation transcript:

1 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 ITRS Factory Integration TWG1 ITRS Factory Integration Presentation Mani Janakiram & Junji Iwasaki July 2005 Global Co-Chairs: Europe: Arieh Greenberg Japan: Shige Kobayashi, Michio Honma Korea: TBD Taiwan: Thomas Chen US: Mani Janakiram

2 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 ITRS Factory Integration TWG2 Agenda 1.Scope and Difficult Challenges 2.FI Current Status 3.Technology Requirements 4.Manufacturing Strategy Evolution 5.Top Factory Integration Focus Areas 6.Summary

3 Factory Integration Scope and Drivers Wafer Mfg Chip Mfg Product Mfg Distribution FEOL BEOL Probe/Test Singulation Packaging Test Si Substrate Mfg Reticle Mfg Increasing cost & Cycle time implications Factory is driven by Cost, Quality, Productivity, and Speed:  Reduce factory capital and operating costs per function  Faster delivery of new and volume products to the end customer  Efficient/Effective high volume production, high reliability, & high equipment reuse  Enable rapid process technology shrinks and wafer size changes Factory Operations Production Equipment AMHS Factory Information & Control Systems Facilities UI DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

4 ITRS Factory Integration TWG4 Key Technologies that will Impact Factory Design  2005 and future years are targeted to meet productivity and capture technology requirements  Key process and device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho (EUVL), New Device Structures, new materials and the next wafer size conversion Year20052006200720082009 Technology trend (nm)8070655550 Wafer Size (mm)300 Near Term Years Long Term Years Year201020112012201320142015201620172018 Technology trend (nm)454035322825222018 Wafer Size (mm)300 450 Next Wafer Size in Production? New Device Structures? Start Planning for 450mm Started discussions EUVL in Production?

5 Difficult Challenges Summary Near Term: 2005 to 2009 >45nm 1.Responding to rapidly changing and complex business requirements [E] 2.Meeting growth targets while margins are declining [E] 3.Managing ever increasing factory complexity [M] 4.Meeting factory and equipment reliability, capability or productivity requirements per the roadmap [M] 5.Meeting the Flexibility, Extendibility, and Scalability needs of a cost effective, leading edge factory [M] 6.Meeting process requirements at 65nm and 45nm nodes running production volumes [P] 7.Increasing global restrictions on environmental issues [E] Long Term: 2012 to 2018 <45nm 1.Post conventional CMOS manufacturing uncertainty [P] 2.Next Wafer Size and Emerging factory paradigm changes [M] [E] Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth for both efficiency and effectiveness E=Economic/Business P=Process Technology M=Manufacturing DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

6 6 Some Projected Attributes of a 300mm < 45nm Fab SECS Control Line Equipment Data Acquisition (EDA) Standards to get Rich Equipment Data Manufacturing Execution Systems Factory Scheduler And Material Control Full Wafer Level Tracking & Recipe/Parameter Changes 100% Direct Tool Delivery AMHS Ubiquitous APC; Rapid Process Matching & New Product Qualification Standard, Detailed Equipment Performance Tracking (EPT) Data Systems Scaled for > 50k wspm Data standards and Systems for Rapid Mask Set Creation Aggressive NPW Reduction & Efficient Spares Mgmt Very Fast Cycle time Fabs for Hot & Normal lots Wafer Data Standard For Packaging Offline tools to test schedule rules and rapidly put in Mfg Pervasive E-Diagnostics SPCAPCFDC YieldPCSEPT Equipment Engineering Capabilities Recipes E-Diag Equipment Control Systems Partner, Customer Or Supplier Equipment & Systems designed for High Mix operation Equipment & Process Data

7 FI Sub team – July 2005 Status SubteamJuly 2005 1Factory Operations (FO) Focus: 1) Reduce mfg cycle time, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix Completed Technology Requirements table and potential solutions tables. No major changes to the technology table anticipated. Working on the summary. 2Production Equipment (PE) Focus: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement Completed Technology Requirements table and potential solutions tables. Few changes to the technology table is made. Completed rev0 write-up and impact of focus area on PE 3Automated Matl Handling Systems (AMHS) Focus: 1) Increase throughput, 2) Reduce Average Delivery times, 3) Improve Reliability Completed Technology Requirements table and potential solutions tables. Updating the values for peak MPH specific to high thr’put bay. Working on the summary. 4Factory Information & Control Systems (FICS) Focus: 1) Increase Reliability, 2) Increase Factory Throughput, 3) Handle data explosion, 4) Reduce or Maintain Mask Shop Cycle Time Completed Technology Requirements table and potential solutions tables. Small changes to the technology table are made. Working on the summary. 5Facilities Focus: 1) Reduce Costs 2) Utility 3) Footprint 4) Reduce equipment installation time Completed Technology Requirements table and potential solutions tables. Few changes to the technology requirements table are made. Working on the summary. 6Other – Focus area & Cross-cut items2005 FI chapter will include sections on 1) Focus areas 2) Text on AMC, EMI, ESD and cross-TWG issues. Completed technology requirements, potential solutions, focus area and cross-cut challenges DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

8 8 Factory Operations Technical Requirements Key Objectives: 1) Reduce mfg cycle times, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix Solution existsSolution being developedSolution required

9 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 9 Production Equipment Technical Requirements Key Objectives: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement Solution existsSolution being developedSolution required

10 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 10 Key Objectives: 1) Increase throughput for Traditional and Unified Transport, 2) Reduce Average Delivery times, 3) Improve Reliability Material Handling Technical Requirements Solution existsSolution being developedSolution required

11 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 11 FICS Technical Requirements Key Objectives: 1) Increase Reliability, 2) Increase Factory Throughput, 3) Reduce or Maintain Mask Shop Cycle Time, 4) Reduce Costs Solution existsSolution being developedSolution required

12 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 12 Facilities Technical Requirements Key Objectives: 1) Factory Extendibility, 2) AMC, 3) Rapid Install/Qualification, 4) Reduce Costs Solution existsSolution being developedSolution required

13 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 13 2005 FI Focus Area Focus AreasJuly 2005 Status 1Airborne Molecular Contamination (AMC) Implications at 2006) AMC tables will be in YE and the reference text will be in PE and Facilities. 2Rapid Equipment Install and Qualification (Now ->) Rapid equipment install and adaptor plate ideas being formed by Facilities. Adaptor plate per tool type. Need a standard among the suppliers. 3“Proactive Visual” manufacturing (Now ->)Need more clarity; Minifab versus Megafab; STRJ needs help to promote visualization; This can be treated as a solution. 4Next Wafer Size (NWS) Transition (2005 -> 2012) FI will work with International Sematech and will continue to define technology requirements for NWS FI Factory Integration focus areas: AMC, NWS, and Proactive Visualization

14 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 14 AMC Requirements - Current status  AMC limits are currently addressed in the Yield Enhancement YE TWG, and the Wafer Environmental Contamination Control WECC subTWG  Fab environment requirements have not been defined yet in the FI TWG Wafer Wafer/Tool environment Fab environment Factory Integration Roadmap Yield Enhancement Roadmap Technology Requirements

15 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 15 Rapid Tool Install - Adapter Plate Concept Facility Utilities Into Adapter Plate (water, gasses, etc.) Supplier Utilities Into Process Tool Exhaust From Tool Exhaust To Facility Facility Power Into Adapter Plate

16 Proactive Visualization  Comprehensive structured P/V matrix be developed for SoC manufacturing  Strategic issues be broken down and mapped into P/V matrix  Solutions and needs bilaterally be traceable through P/V matrix LMHV New Production Methods Design & Manufacturing Integration Small order size Short product cycle Varying product volume New Foundry Business Combinations of Solutions solutions New IDM CostDeliveryQualityEnergy Products Factory Operation Factory Resource Metrics Development and Proper Targeting Needed Proactive Visualization Proactive Visualization HMLV Strategic Issues DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

17 ITRS Factory Integration TWG17 Cycle Time as a function of Lot Size 251262 25 Current R/M (Non Hot Lot) Current R/M (Super Hot Lot) 12Next R/M 6 2 Objective Lot Size Nominal Lot Size 20052018 Cycle time per mask layer (days) Short cycle time will be driven by smaller lot size and more single wafer processing Setup time reduction

18 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 ITRS Factory Integration TWG18 We started discussions for next wafer size transition 9 yrs + 2 yrs delay*9 yrs? + 2 yrs delay?9 yrs + ?yrs delay 675mm/2021? 450mm/2012?300mm/2001 200mm/1990 (125/150mm - 1981) We are here When does this happen?

19 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 ITRS Factory Integration TWG19 Examples of next wafer size (NWS) technology decisions that are needed AttributeKey Technology Decisions WaferMaterial, Size, Thickness, ID, Registration, Edge Exclusion Wafer Carrier Number of Wafers, Size, Door Type, AMHS Strategy, ID Production Equipment Single wafer vs. mini-batch, cleanliness, interface standards, productivity targets relative to 300mm (NPW usage, etc.) FactoryFactory Size, Egress, Cleanliness, Sub-Fab attributes, Clean-room height Automated Material Handling Systems Direct transport concepts, carrier/wafer delivery time, overall throughput, efficient storage concepts Manufacturing Systems Process Control & Yield Data Standards, Carrier delivery time, Decision Making Time, Data Flow

20 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 ITRS Factory Integration TWG20 200420052006200720082009201020112012 200420052006200720082009201020112012 Carrier & lot-size determination Direct Transport Standards Production Equipment Standards Factory Control System Standards Interoperability Testing & Reliability Verification 450mm wafer Standards Proposed next wafer size (NWS) transition timeline Not final. Need Further discussions Many technology issues in NWS need to be addressed! FI has started to work on NWS technology challenges

21 DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 ITRS Factory Integration TWG21 Key Messages 1.Business strategies, market demands, and process technology changes continue to make factories difficult to integrate 2.Factory’s speed and flexibility are vital to accommodate various production technologies High Mix, Cycle time improvement, equipment utilization, direct transport AMHS, etc. 3.Gaps in Production Equipment performance, Setup time, AMHS, Facilities and Factory operations must be improved Metrics needed to cover versatility, productivity, agility, quality, environment compatibility 4.Key cross-TWG issues need to be addressed Abatement, Energy requirement, 5.New technology demands tighter AMC control 6.Proactive visualization/usage of factory data is required Delivery time, Quality, and Reliability 7.Next wafer size technical requirements need to addressed


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