Presentation is loading. Please wait.

Presentation is loading. Please wait.

New book, Win IC Designs Principles of Field Applications and Sales Engineering.

Similar presentations

Presentation on theme: "New book, Win IC Designs Principles of Field Applications and Sales Engineering."— Presentation transcript:

1 new book, Win IC Designs Principles of Field Applications and Sales Engineering

2 Outline 1. Purpose of the book 2. Chapters of the book 3. Diagram examples 4. Excerpts 5. Topic examples 6. Writer 7. Ordering information

3 This book is based on two decades of diverse experience in the IC (Integrated Circuit) industry. Its purpose is to describe an integrated approach to the practice of field applications and sales engineering. The IC is more than half a century old. Since the invention of the IC, numerous books have been written about IC design engineering, but no book has been written about IC field applications engineering. This is surprising because deciding what ICs to design (IC definition) depends largely on input from field applications. This is the first book that describes: 1.How field applications engineering could best contribute to defining ICs. 2.How to create strategy for design win of ICs. 3.How to execute the tactics. Purpose

4 1. The role of the field applications and the sales engineer 2. The six stages of design win 3. Determining the IC requirements of a system 4. Win ASIC designs 5. Win memory designs 6. Win microprocessor and MCU designs 7. Using quality and reliability engineering to win designs 8. Price negotiation 9. Supporting distributors and sales representatives 10. Making customer visits effective Chapters of the Book

5 Much of the information in the book is hierarchical, thus you can select the level of detail. Please see the following three slides. Example of Diagrams Hierarchical Information

6 opportunity identified THINGS TO DO THINGS TO PROVIDE Establish FAE, Rep, & PME team Identify customer decision makers and send invitation email Email promotional agenda Sales makes corporate presentation FAE makes engineering presentation Show samples & starter kits Get commitment for follow up visit for a firm reason. E.g., demo tools MCU/MPU selection guide PowerPoint Presentations General product catalogue (non- MCU products customer could use in this or other applications) 1 st visit 2nd visit 3rd visit FAE writes engineering customer visit report Rep writes business visit report & provides pricing info. Email “thank you” & list of action items Set up internal meeting to establish strategy & assign action items FAE creates comparison table vs. Competitions Additional literature w/ more detail More promotional info such as press release & articles to keep visibility high Email promotional agenda FAE demos tools Bring high-level people if sticky business or technical issues Discuss software development issues Offer MCU & tools training Tools & documentation Evaluation kit Comparison table & benchmarks generated by CAE (Central App. Eng.) Application notes More MPU promotional material. E.g., info on existing systems using same processor FAE & rep write visit report & raise red flags Marketing & CAE write business & engineering proposal Update & adapt design–win strategy Invite corporate executives if needed More promotional items. E.g., gifts Component engineering information such as die & packaging info Implement vertical sales by having high- level people from both sides Standard engineering & business proposal vendor selection FAE & rep to be present for any questions or concerns when vendor selection is being made Have NDA signed Q/A Submit microprocessor support proposal Take customer to lunch & get info on competition & further understand motivating factors Email promotional agenda Confirm final decision date Get commitment that you will have the last look between visits Microprocessor Design Win Checklist Specific engineering & business proposal

7 2. Development 3. Production 1. Selection 4. New Designs HW comparison Tools demo Code benchmarking Evaluation kit Reference design Business & engineering support proposal Assign HW, SW, & tools team Tools set up and training HW & SW application notes Application expertise Pre-written code Code conversion Code debugging Roadmap alignment Technology enhancements Migration to SoC Custom microprocessor High quality & reliability Fast Q&R corrective action Global manufacturing Cost reduction Customized test/screening Buffer inventory Flash programming JIT Delivery Microprocessor Support Proposal (Level 2 Detail)

8 Explain to your customers that if they would like the proposed embedded microprocessor benchmarked, you would provide this service to them. The benchmark could be for large parts of the customer’s code or for a critical part of their code that needs to be processed within a specific time. The code could be in either C (or any high level language) or assembly. If in C, customer can also evaluate the C compiler’s efficiency. (C compiler efficiency is the size of the assembly code the compiler generates compared to the size of the assembly code if it was hand-written by an expert assembly language programmer). If the customer’s application is highly interrupt driven, you could also benchmark multiple interrupts, nested or not nested, from various sources, to benchmark interrupt latency times. It is said that there are lies, damn lies, and benchmarks. In order for the benchmarks to be credible and meaningful, your company should ideally belong to a third party consortium that does independent, objective, and unbiased benchmarking. One such organization is The Embedded Microprocessor Benchmark Consortium* ( EEMBC’s benchmarks are for commonly used algorithms in consumer, automotive, and networking applications. If there are benchmarks you can provide to your customer that were performed by EEMBC, provide it. (*Similar independent benchmarking organizations exist for ASICs. Instead of running code, they design circuits using various ASIC suppliers’ library and then benchmark / simulate the speed and power consumption of these circuits.) Code Benchmarking (Level 3 Detail)

9 12 areas of FAE expertise 16 entities FAEs interact with 15 ways to find opportunities 6 stages of the design win 5 ways to use quality and reliability engineering to win designs 12 types of IC prices 16 ways to obtain a lower price from IC marketing 5 ways to convince a customer to accept a higher price Topic Examples

10 Responsibilities IC test and qualification engineer, FAE, PME Types of ICs MCUs, ASICs, and memories Types of Companies IC manufacturer, seller, and user Companies Hitachi, Xerox, Siemens, Mitsubishi, Toshiba, Impact/Memec (distributor)*, NEC Most professionals in IC sales learned about ICs and the IC business while working for an IC company. Sasan Khajavi, however, learned about ICs while working for a systems company. He was an IC test and qualification engineer at Xerox, where he selected and qualified ICs from dozens of IC vendors. Being on the other side of the fence, he learned firsthand how system companies make complex IC and IC vendor selection decisions. Sasan has written about embedded (non-pc) microprocessors in Electronic News and NASA Tech Briefs. Writer *Microchip Inc. dedicated FAE

11 Thank you Suggestions are highly appreciated. Please email to © Ordering Information Please click below for more information:

Download ppt "New book, Win IC Designs Principles of Field Applications and Sales Engineering."

Similar presentations

Ads by Google