Presentation on theme: "Principles of Field Applications and Sales Engineering"— Presentation transcript:
1 Principles of Field Applications and Sales Engineering new book,Win IC DesignsPrinciples of Field Applications and Sales Engineering
2 Outline1. Purpose of the book 2. Chapters of the book 3. Diagram examples 4. Excerpts 5. Topic examples 6. Writer 7. Ordering information
3 PurposeThis book is based on two decades of diverse experience in the IC (Integrated Circuit) industry. Its purpose is to describe an integrated approach to the practice of field applications and sales engineering.The IC is more than half a century old. Since the invention of the IC, numerous books have been written about IC design engineering, but no book has been written about IC field applications engineering. This is surprising because deciding what ICs to design (IC definition) depends largely on input from field applications.This is the first book that describes:How field applications engineering could best contribute to defining ICs.How to create strategy for design win of ICs.How to execute the tactics.
4 Chapters of the Book1. The role of the field applications and the sales engineer 2. The six stages of design win 3. Determining the IC requirements of a system 4. Win ASIC designs 5. Win memory designs 6. Win microprocessor and MCU designs 7. Using quality and reliability engineering to win designs 8. Price negotiation 9. Supporting distributors and sales representatives 10. Making customer visits effective
5 Hierarchical Information Example of DiagramsHierarchical InformationMuch of the information in the book is hierarchical,thus you can select the level of detail.Please see the following three slides.
6 opportunity identified Microprocessor Design Win ChecklistEstablish FAE,Rep, & PME teamSales makes corporate presentationFAE writes engineering customer visit reportFAE demos toolsFAE & rep write visit report & raise red flagsImplement vertical sales by having high-level people from both sidesFAE & rep to be present for any questions or concerns when vendor selection is being madeIdentify customer decision makers and send invitationRep writes business visit report & provides pricing info.Bring high-level people if sticky business or technical issuesFAE makes engineering presentationMarketing & CAE write business & engineering proposalConfirm final decision dateTHINGS TO DOShow samples & starter kitsSubmit microprocessor support proposal“thank you” & list of action itemsHave NDA signedUpdate & adapt design–win strategyGet commitment that you will have the last lookQ/ASet up internal meeting to establish strategy & assign action itemsOffer MCU & tools trainingInvite corporate executives if neededGet commitment for follow up visit for a firm reason. E.g., demo toolsTake customer to lunch & get info on competition & further understand motivating factorsFAE creates comparison table vs. CompetitionsDiscuss software development issuesopportunity identifiedvendor selection1st visitbetween visits2nd visit3rd visitpromotional agendaMCU/MPU selection guideAdditionalliterature w/more detailTools & documentationMore promotional items. E.g., giftsStandard engineering & business proposalEvaluation kitComponent engineering information such as die & packaging infoSpecific engineering & business proposalPowerPoint PresentationsMore promotional info such as press release & articles to keep visibility highTHINGS TO PROVIDEComparison table & benchmarks generated by CAE (Central App. Eng.)promotional agendaGeneral product catalogue (non-MCU products customer could use in this or other applications)promotional agendaApplication notesMore MPU promotional material. E.g., info on existing systems using same processor
7 Microprocessor Support Proposal (Level 2 Detail) 4. New DesignsHW comparisonTools demoCode benchmarkingEvaluation kitReference designBusiness & engineering support proposal1. SelectionRoadmap alignmentTechnology enhancementsMigration to SoCCustom microprocessorHigh quality & reliabilityFast Q&R corrective actionGlobal manufacturingCost reductionCustomized test/screeningBuffer inventoryFlash programmingJIT DeliveryAssign HW, SW, & tools teamTools set up and trainingHW & SW application notesApplication expertisePre-written codeCode conversionCode debugging2. Development3. Production
8 Code Benchmarking (Level 3 Detail) Explain to your customers that if they would like the proposed embedded microprocessor benchmarked, you would provide this service to them. The benchmark could be for large parts of the customer’s code or for a critical part of their code that needs to be processed within a specific time. The code could be in either C (or any high level language) or assembly. If in C, customer can also evaluate the C compiler’s efficiency. (C compiler efficiency is the size of the assembly code the compiler generates compared to the size of the assembly code if it was hand-written by an expert assembly language programmer).If the customer’s application is highly interrupt driven, you could also benchmark multiple interrupts, nested or not nested, from various sources, to benchmark interrupt latency times.It is said that there are lies, damn lies, and benchmarks. In order for the benchmarks to be credible and meaningful, your company should ideally belong to a third party consortium that does independent, objective, and unbiased benchmarking. One such organization is The Embedded Microprocessor Benchmark Consortium* (eembc.org). EEMBC’s benchmarks are for commonly used algorithms in consumer, automotive, and networking applications.If there are benchmarks you can provide to your customer that were performed by EEMBC, provide it.(*Similar independent benchmarking organizations exist for ASICs. Instead of running code, they design circuits using various ASIC suppliers’ library and then benchmark / simulate the speed and power consumption of these circuits.)
9 Topic Examples 12 areas of FAE expertise 16 entities FAEs interact with15 ways to find opportunities6 stages of the design win5 ways to use quality and reliability engineering to win designs12 types of IC prices16 ways to obtain a lower price from IC marketing5 ways to convince a customer to accept a higher price
10 Writer Responsibilities IC test and qualification engineer, FAE, PME Types of ICsMCUs, ASICs, and memoriesTypes of CompaniesIC manufacturer, seller, and userCompaniesHitachi, Xerox, Siemens, Mitsubishi, Toshiba, Impact/Memec (distributor)*, NECMost professionals in IC sales learned about ICs and the IC business while working for an IC company. Sasan Khajavi, however, learned about ICs while working for a systems company. He was an IC test and qualification engineer at Xerox, where he selected and qualified ICs from dozens of IC vendors. Being on the other side of the fence, he learned firsthand how system companies make complex IC and IC vendor selection decisions.Sasan has written about embedded (non-pc) microprocessors in Electronic News and NASA Tech Briefs.*Microchip Inc. dedicated FAE