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© ET-Trends LLC 1 Ken Gilleo – ET-Trends – Nathan Kerrick, Cookson Electronics IBM MicroDrive: 351 MB MEMS & GMR Technology IMAPS 200.

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Presentation on theme: "© ET-Trends LLC 1 Ken Gilleo – ET-Trends – Nathan Kerrick, Cookson Electronics IBM MicroDrive: 351 MB MEMS & GMR Technology IMAPS 200."— Presentation transcript:

1 © ET-Trends LLC 1 Ken Gilleo – ET-Trends – Nathan Kerrick, Cookson Electronics IBM MicroDrive: 351 MB MEMS & GMR Technology IMAPS 200 Denver

2 © ET-Trends LLC 2 OUTLINE Hard Disk Drive overview GR and GMR technology Processing of hi-density heads The role of temporary adhesives HDD assembly

3 © ET-Trends LLC 3 The HDD (Hard Drive Disk) Magnetic Disk Slider Flex Courtesy of 3M Co Mag. Head Assembly Positioner Assembly

4 © ET-Trends LLC 4 The HDD Head is key to Ultra-High Density

5 © ET-Trends LLC 5 HDD Technology Density increases surpass Moores Law. MR and GMR are true breakthroughs. Density records: –30 million bits/in 2 December 1999 (commercial) –56 Gbits/in 2 on April 2000 (lab) Density limits have not been reached. The technology is in the complex head.

6 © ET-Trends LLC 6 MR Head Technology Contact MR Sensing Layer (changes resistivity) Insulator Spacer Soft Adjacent Layer Shield bias MR Effect: changes in electrical resistance by certain magnetically-soft when a magnetic field is turned on and off. Magneto-Resistive Measure as read signal

7 © ET-Trends LLC 7 GMR Head Technology Shield Contact Sensing Layer Conducting Layer Exchange Layer Pinned Layer (magnetically oriented) Shield GMR is a quantum effect and relies on electron spin states; >2X more sensitive than GR Giant Magneto-Resistive bias

8 © ET-Trends LLC 8 Write Head COIL Write Current SLIDER Coil WRITE HEAD Magnetic medium Writing Current Magnetic coil creates field thatwrites by orienting disk domain medium ON

9 © ET-Trends LLC 9 Merged Read/Write Head N SS NN SS NN SS N WRITE READ Shield 1 Rotating Disk Shield 2 Inductive Writing Element MR or GMR Sensor READWRITE

10 © ET-Trends LLC 10 Building MR/GMR Head Elements Semiconductor wafer fab Wafer thinning Wafer sawing Element planing/polishing Head assembly

11 © ET-Trends LLC 11 First, some adhesive basics. Mixing Casting Adhesive film Wafer-applied adhesive for die attach

12 © ET-Trends LLC 12 Long-chained typically organic macromolecules made up of small repeating segments of monomers. Properties such as strength, flexibility, melting point and electrical characteristics can be ENGINEERED into the polymer. - Engineered molecules - Highly compatible -Tailored properties

13 © ET-Trends LLC 13 A polymer that is cross-linked so that melting does not occur under heating. SOLID A polymer that is capable of softening to a flowable "liquid" when heated and hardened again when cooled. SOLIDLIQUID (flowable)

14 © ET-Trends LLC 14 Polymer Types

15 © ET-Trends LLC 15 Thermoplastic as a temporary adhesive Independent chain motion allows melting; debonding.

16 © ET-Trends LLC 16 Thermoplastics can be dissolved or debonded without dissolving; swelling Thermoplastics can be dissolved or debonded without dissolving; swelling Solvent Molecules

17 © ET-Trends LLC 17 Thermoplastic Adhesive FORMS Film –sheets –rolls Preform –any shape from disk to complex Paste –for needle dispense –spin coat for wafer-level

18 © ET-Trends LLC 18 Resin & Filler Choices Fillers –Silver - Electrical & thermal conductivity –AlN, BeO - Thermal, but good dielectric –Unfilled - Insulating Resin bond ranges (thermoplastics): –Low : 100 o C –High :400 o C –Typical: o C For Most HDD Processes Sometimes used to control static.

19 © ET-Trends LLC 19 Thermoset Adhesives Thermoplastic DispenseOven Cure DRY Heat & PressurePlace Part Place Preform Place No Pressure Needed Dispense or Print Place PartDry/Fuse No Pressure Needed Coat Wafer: spin, print Place PartHeat & Pressure Paste to Substrate Paste to Substrate Paste to Wafer Paste to Wafer FILM Paste to Substrate Not Temporary

20 © ET-Trends LLC 20 Application Processes Liquid (paste) –Coat on wafer; spin, stencil, print; dry –Needle dispense on substrate or holder Film –Laminate to wafer, then run processes Preform (cut to wafer of row shape) –Bond to wafer –Bond to substrate

21 © ET-Trends LLC 21 Bonding Thermoplastics Glassy State Process Window Decomposition T max T min TgTg Temperature

22 © ET-Trends LLC 22 Thermoplastic Properties FILLERS TgTg Rework Die Shear Thermal Modulus Bond Temp CCC min. 25C WmCPSI none K Ag, AlN none K Ag, AlN none K Ag, AlN none K Ag, AlN none K None K None K Each row is a different polymer Which ones for HDD?

23 © ET-Trends LLC 23 SUBSTRATECONDITIONINGINITIAL BONDFINAL BOND Ceramic150 o C, 1000 hrs.2500 PSI4800 PSI Au-plated Ceramic 150 o C, 1000 hrs.3100PSI4900 PSI Al150 o C, 1000 hrs.4100 PSI4500 PSI Ceramic 85%RH, 85 o C, 1000 Hrs PSI1800 PSI Au-plated Ceramic 85%RH, 85 o C, 1000 Hrs PSI2600 PSI Al 85%RH, 85 o C, 1000 Hrs PSI3600 PSI Ceramic -65 o C to 150 o C, 500 cycles 2500 PSI4000 PSI Au-plated Ceramic -65 o C to 150 o C, 500 cycles 3100 PSI3700 PSI Al -65 o C to 150 o C, 500 cycles 4100 PSI4800 PSI Bond Strength of Die Attach Adhes. Bonding: 180C/ 10sec, 135g;.080" x.080" Ni/Au Kovar

24 © ET-Trends LLC 24 Removal Options Heat element area Peel off parts Immerse assembly in solvent Remove parts Rinse in solvent HEAT SOLVENT Preferred for HDD work

25 © ET-Trends LLC 25 Wafer Lapping (thinning & polishing) Attach wafer to lava stone with temporary adhesive. HDD Wafer

26 © ET-Trends LLC 26 Wafer Lapping Process Wafer Rotation Holder Lava Rock Temporary Adhesive Grinding Media

27 © ET-Trends LLC 27 Slicing 1. Heat Bond Wafer 2. Slice into Rows 3. Debond with Solvent Temporary adhesive (sawing into rows) ROW of Heads before singulating Rows formed after slicing

28 © ET-Trends LLC 28 Adhesive Paste Lapping & Edge Polishing 1. Dispense Adhesive 2. Mount Rows 3. Bond by heating Automatic Dispenser - Speedline

29 © ET-Trends LLC 29 Temporary Adhesive Row Bonding Step Rotate 90 o with cut, or rough side facing up. (part of lapping & polishing)

30 © ET-Trends LLC 30 Debond in solvent Rows are planarized/leveled/lapped

31 © ET-Trends LLC 31 Finished rows are sliced into head elements Use temporary adhesive

32 © ET-Trends LLC 32 HDD Assembly

33 © ET-Trends LLC 33 Conclusions HDD Beats Moores Law and IC industry The breakthrough was GMR MEMS is playing a role Density limits have not been reached Photonics is being added Expect continuous density increases 73 GB IBM


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