Presentation is loading. Please wait.

Presentation is loading. Please wait.

Abab DiPamat Direct Patterning Materials Etch / Plating Resist.

Similar presentations


Presentation on theme: "Abab DiPamat Direct Patterning Materials Etch / Plating Resist."— Presentation transcript:

1 abab DiPamat Direct Patterning Materials Etch / Plating Resist

2 Agfa Materials: for the PCB Industry abab Slide 2 Eric Janssens May 2013 What is resist A photo resist is a chemical product that, under the influence of UV light, changes its chemical nature. Resist without UV: is washed away during resist development Resist with UV: is NOT washed away during resist development protects the copper in the etch batch is stripped away after etching Remark: 1 Etch resist: print & etch of inner layers 2 Plating resist: print, plate & etch of outer layers

3 Agfa Materials: for the PCB Industry abab Slide 3 Eric Janssens May 2013 What is resist Liquid photo resist (20%) Curtain, roller- or spray coated Thickness: 5 - 20µm Pro: high resolution Contra: dust inclusions and chemical sensitivity Dry photo resist (80%) Cold, hot or wet laminated Thickness: 25 - 75µm Pro: high yield and good tenting Contra: line width Tenting: Vias must be tented to avoid resist getting in the via

4 Agfa Materials: for the PCB Industry abab Slide 4 Eric Janssens May 2013 Traditional resist printing Workflow: Design Image and develop film, check Coat, laminate resist Image resist If laminated: peel cover layer Develop resist Etch Strip Working with resist is: A time consuming process step Expensive Fixed data Ecological unfriendly

5 Agfa Materials: for the PCB Industry abab Slide 5 Eric Janssens May 2013 Inkjet resist printing Principle: apply etch / plating resist directly on the panel using a set of Inkjet nozzles mounted on a XY table ie without the use of a phototool or screen Workflow: Design Print (with pin curing) Curing (thermal and/or UV) Etch Strip

6 Agfa Materials: for the PCB Industry abab Slide 6 Eric Janssens May 2013 Inkjet resit printing Advantages: Reduce cost -no phototool, less production steps -shorter production cycle, higher yields Registration panel per panel / distortion compensation -front-to-back -outer layer to inner layer Design changes & variable data per board Fast (no set up) Ecology

7 Agfa Materials: for the PCB Industry abab Slide 7 Eric Janssens May 2013 Quid May 2013 R&D project is in progress Jetability and etch resistance: OK Stripability: concepts are tested Planning One ER fieldtest in operation by end 2013 Proliferation of ER in 2014 Concept study PR

8 Agfa Materials: for the PCB Industry abab Slide 8 Eric Janssens May 2013 Quid May 2013

9 Agfa Materials: for the PCB Industry abab Slide 9 Eric Janssens May 2013 Quid May 2013

10 Agfa Materials: for the PCB Industry abab Slide 10 Eric Janssens May 2013 Quid May 2013

11 Agfa Materials: for the PCB Industry abab Slide 11 Eric Janssens May 2013 Competition: Dow (Rohm and Haas) www.dowelectronicmaterials.com Phase shift ink

12 Agfa Materials: for the PCB Industry abab Slide 12 Eric Janssens May 2013 Competition: MacDermid www.macdermid.com

13 Agfa Materials: for the PCB Industry abab Slide 13 Eric Janssens May 2013 Competition: MuTracx Spin-off from OCE Technologies (Canon) Announces Lunaris: print system and etch resist for IL Phase shift inkl Uses Predict Fieldtest summer 2010 in EU Commercially available by mid 2011 www.mutracx.com

14 Agfa Materials: for the PCB Industry abab Slide 14 Eric Janssens May 2013 Competition: MuTracx

15 Agfa Materials: for the PCB Industry abab Slide 15 Eric Janssens May 2013 System supplier: MuTracx lunaris animation.avi

16 Agfa Materials: for the PCB Industry abab Slide 16 Eric Janssens May 2013 Conclusion Inform your customers and prospects on our plans Gather as much information as possible


Download ppt "Abab DiPamat Direct Patterning Materials Etch / Plating Resist."

Similar presentations


Ads by Google