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Dicing of APV Readout Chips for FGT & IST Gerrit van Nieuwenhuizen FGT meeting BNL, February 27, 2009.

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Presentation on theme: "Dicing of APV Readout Chips for FGT & IST Gerrit van Nieuwenhuizen FGT meeting BNL, February 27, 2009."— Presentation transcript:

1 Dicing of APV Readout Chips for FGT & IST Gerrit van Nieuwenhuizen FGT meeting BNL, February 27, 2009

2 Number of chips needed February 27, 2009 Gerrit van Nieuwenhuizen 2 FGT: 600 chips (50% spares, 40% cont.) IST: 1800 chips (10% spares, 40% cont.) 2400 APV25-S1 chips to procure 2400 APV25-S1 chips to procure

3 8 APV Wafers at MIT Gerrit van Nieuwenhuizen 3 February 27, 2009

4 How many good chips? Gerrit van Nieuwenhuizen 4 Each wafer has its ID etched in All chips on the wafers were probed for functionality Good chip maps are available for all wafers February 27, 2009

5 Known Good Die (KGD) maps Gerrit van Nieuwenhuizen 5 And the final tally is February 27, 2009

6 Number of good APV25-S1 chips Gerrit van Nieuwenhuizen 6 February 27, 2009

7 Dicing options Gerrit van Nieuwenhuizen 7 San Jose, CA based Used with success by LBNL San Jose, CA based Used with success by LBNL Upton, NY based Laser dicing machine February 27, 2009

8 Dicing information Gerrit van Nieuwenhuizen 8 We have the 8 wafers We have the reticle drawing Minimize the dicing cuts Get quotation February 27, 2009

9 Dicing quotation Gerrit van Nieuwenhuizen 9 February 27, 2009

10 Dicing first wafer Gerrit van Nieuwenhuizen 10 ← Shipped to APV Arrived yesterday Arrived yesterday Back diced to MIT on tape Back diced to MIT on tape next week next week Take off tape and store chips in Gel-Paks Take off tape and store chips in Gel-Paks Test some chips Test some chips February 27, 2009

11 Concluding remarks Gerrit van Nieuwenhuizen 11 We have 8 APV25-S1 wafers These wafers should provide plenty of readout chips for both FGT and IST First wafer out for dicing, back next week Test some chips, if OK then dice remaining 7 wafers February 27, 2009


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