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RoHS – Wetgeving & praktijk RoHS from the Perspective of a Connector Manufacturer Jan Broeksteeg Engineering Manager CCCE EMEA Tyco Electronics Nederland.

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Presentation on theme: "RoHS – Wetgeving & praktijk RoHS from the Perspective of a Connector Manufacturer Jan Broeksteeg Engineering Manager CCCE EMEA Tyco Electronics Nederland."— Presentation transcript:

1 RoHS – Wetgeving & praktijk RoHS from the Perspective of a Connector Manufacturer Jan Broeksteeg Engineering Manager CCCE EMEA Tyco Electronics Nederland BV

2 RoHS – Wetgeving & praktijk Tyco Electronics ‘Worlds leading manufacturer of electro-mechanical and passive components 25 Strong technology product segments. Located in 53 countries. > 250 Production Locations > Employees > 5000 Sales people > 7000 people active in de fields of Engineering and Development.

3 RoHS – Wetgeving & praktijk Overview Tyco Electronics Brands

4 RoHS – Wetgeving & praktijk Table of Contents Legislation and Industry Drivers Tyco Electronics Lead Free/RoHS Roadmap –Customer Schedule –TE timing Product Implications –Hazardous materials –LF processing issues Logistics – Part Numbering/coding

5 RoHS – Wetgeving & praktijk Restriction on Hazardous Substances (RoHS) –EU Directive 2002/95/EC –By July 1, 2006, electronic products to be free of Lead, Cadmium, Hexavalent Chrome, Mercury, PBB’s and PBDE’s Recycling and disposal mandates in Europe (WEEE), Japan, and China. –EU Directive 2002/96/EC –China proposing RoHS for 2006 –Increasing activity in US - e.g. Prop 65 and SB20 in CA EU End-of-Life Vehicle (ELV) –EU Directive 2000/53/EC –Automotive products required Lead Free by July 1, 2003 –Exception was granted for lead in solder and plating on solderable interfaces Legislation / Industry Drivers

6 RoHS – Wetgeving & praktijk Key Driver - RoHS “Producer” of covered product when offered on market (EU) has to be in compliance –In Tyco Electronics' case – as we are generally a component supplier, it is our customer (OEM) that is “Producer” –OEM demanded and pushed compliance through-out supply chain –TE pushed through our supply chain as well

7 RoHS – Wetgeving & praktijk RoHS Definitions Concentration limits defined for RoHS substances –Allowable trace amounts: lead mercury 0.1% by weight (1000 ppm) hexavalent chrome PBB, PBDE cadmium 0.01% cadmium(100 ppm)

8 RoHS – Wetgeving & praktijk Exemptions EU directive 2000/95/EC RoHS –Lead in glass of cathode ray tubes, electronic components and fluorescent tubes. –Lead in steel 85 % lead) –Lead in solders for: servers, storage and storage array systems (until 2010); network infrastructure equipment for switching, signalling, transmission; network management for telecommunication –Lead used in compliant pin connector systems. –Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (1) amending Directive 76/769/EEC (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations –Lead in electronic ceramic parts (e.g. piezoelectronic devices) –Military and Aerospace applications excluded

9 RoHS – Wetgeving & praktijk Exemptions EU directive 2000/95/EC RoHS - Lead and cadmium in printing inks for the application of enamels on borosilicate glass - Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems - Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames - Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors - Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes

10 RoHS – Wetgeving & praktijk - Lead oxide in the glass envelope of Black Light Blue (BLB) lamps - Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers - Hexavalent chromium in corrosion preventative coatings of unpainted metal sheetings and fasteners used for corrosion protection and electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July Lead bound in crystal glass as defined in Annex 1 (Categories 1, 2, 3 and 4) of Council directive 69/493/EEC (*) *OJ L 326, , p. 36. Directive as last amended by 2003 Act of Accession Exemptions

11 RoHS – Wetgeving & praktijk Customer / Industry Timeline Automotive Products ELV Compliant Jul ’03 ELV Jan ‘06 Jan ‘05 Jul ’06 RoHS Japanese Leading Consumer Conversion Computer/Telecom rolling out On new Programs Jan ‘04 Industrials - latest conversion 1. Mid-2004 major conversion started 2. Extended transition (mixed use of leaded and lead-free components, solders etc.)

12 RoHS – Wetgeving & praktijk TE Timeline (components) Jan ‘06 Jan ‘05 Jul ’06 RoHS 10% RoHS Compliant Product Shipments 90% RoHS Inventory pull-down of non-compliant parts Jul ‘05 Oct ‘05 RoHS compatible Product availability (limited exceptions) Manage Customer Transition Conversion period – dual manufacturing requirements Engineering product assessment. New PNs, codes, x-ref in StarTEC, E-Catalog Last Build – Non- compliant parts (some exemptions) Apr ‘05 Customer Surveys

13 RoHS – Wetgeving & praktijk RoHS Compliance vs. Compatibility Tyco terminology: RoHS Compliant means elimination of all hazardous materials RoHS Compatible means resistant to higher solder temperatures (approx 30 °C higher)

14 RoHS – Wetgeving & praktijk Alternative for tin-lead plating:  Identify suitable alternatives  Assess performance characteristics of the plating layers  Solderability  Whiskers  Press-fit connections  Separable interfaces (Durability / Friction)  Contact Resistance Compliance

15 RoHS – Wetgeving & praktijk Implications: solderability (1) SnPb finishes converted to pure Sn –No impact to product performance or customer process plating is backward (SnPb) and forward (lead free) process compatible. –Sn plated product meets existing product specification

16 RoHS – Wetgeving & praktijk Performance Criteria Tin93/7 Tin- Lead 60/40 Tin- Lead SolderabilityMeets J- STD-002B Shelf Life/Oxidation  1 Year Solder Joint Reliability Meets IPC- A-9701 Tin Whisker Risk LowRare Implications: solderability (2)

17 RoHS – Wetgeving & praktijk Zero cross time Implications: solderability (3) Wetting balance test results time wetting force

18 RoHS – Wetgeving & praktijk Implications: whiskers (1)

19 RoHS – Wetgeving & praktijk Lead-free tin plating baths Several types commercially available  Pure Sn+ easier to produce (no composition check) - risk of whiskers  SnCu3 sometimes preferred in Far East - alloy, so composition to be controlled - some types showed high contact resistance - risk of whiskers  SnAg3.5 - composition of plated layer difficult to control - cost  SnBi - low melting phases with Pb, fillet lifting back

20 RoHS – Wetgeving & praktijk Implications: whiskers (2) Major concern with move to Sn plating is Sn Whiskers –No single root cause has been identified –Stresses on the Sn finish (internal or mechanical) are widely accepted as contributors Extensive testing/evaluation of Sn plating baths has occurred in Tyco/industry over past several years –Whisker tests have been developed and are used for bath qualification. –Ongoing audits of baths for whiskers is being implemented

21 RoHS – Wetgeving & praktijk cause: grain size thickness carbon content intermetallic compounds internal stress remedy: use min 0.5  m minimum Ni underlayer  m already standard on most products control crystal structure of layer - development of special tin baths avoid external stresses to the tin surface Implications: whiskers (3)

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25 Tyco has tested and selected several "whisker mitigating tin plating solutions“ Tyco reviewed and modified all products to avoid external stress on the tin surface Nickel underplate should be present in all cases Implications: whiskers (4)

26 RoHS – Wetgeving & praktijk Implications: press-fit connections (1) press-fit types, press-in force

27 RoHS – Wetgeving & praktijk Implications: press-fit connections (2) press-fit types, push-out force

28 RoHS – Wetgeving & praktijk Implications: press-fit connections (3) board finishes, press-in force, new data (recent)

29 RoHS – Wetgeving & praktijk Implications: press-fit connections (4) board finishes, push-out force

30 RoHS – Wetgeving & praktijk Separable interfaces Coefficient of friction was tested for like on like interfaces Room temperature and humidity 100 g normal force 6mm ball on flat geometry No significant difference between tin-lead and lead free finishes coatingfrictionwear 93/7 SnPb0.46control Sn0.52Same Sn/Cu0.55same

31 RoHS – Wetgeving & praktijk RoHS Compliance vs. Compatibility RoHS Compliant means elimination of all hazardous materials RoHS Compatible means resistant to higher solder temperatures (approx 30 °C higher)

32 RoHS – Wetgeving & praktijk Sn/3.8Ag/0.5Cu Sn/0.7Cu Sn/3.5Ag/0.7Cu Implications: resistance to soldering heat (1) solder types

33 RoHS – Wetgeving & praktijk Generally accepted for reflow and wave soldering: Tm T solderTmax "SAC" (SnAgCu )217 ºC ºC260 ºC Sometimes preferred for wave soldering: SnCu ºC ºC ºC Conventional (reference): Sn60Pb40183 ºC ºC 245 ºC “outsiders”: Sn96 Ag2.5 Bi1.0 1 ) Cu ºC 217 ºC 231 ºC Sn93.5 Ag3.8 Bi2.0 1 ) Cu ºC 217 ºC 231 ºC Sn93.5 Ag3.5 Bi3 1 ) ºC 217 ºC 231 ºC 1 ) Concerns about interaction of Bi and Pb during transition from conventional to LF Implications: resistance to soldering heat (2)

34 RoHS – Wetgeving & praktijk Implications: resistance to soldering heat (3) Coldest spot on assembly is determining factor. Depends on board design, which is out of our control. reflow soldering

35 RoHS – Wetgeving & praktijk Local exposure to soldering heat. T max mainly dependant product design. Much testing necessary due to great variation in connector design. Prediction is not trivial. Implications: resistance to soldering heat (4) wave soldering 265 C 240 C

36 RoHS – Wetgeving & praktijk Jointly developed by Tyco, FCI, Molex and Amphenol Download from: Implications: resistance to soldering heat (5)

37 RoHS – Wetgeving & praktijk T melt HDT (1.82 MPa) T max < HDT(1.82 MPa) OK T max > T melt NO HDT(1.82 MPa) < T max < T melt TEST T max Higher solder temperature means higher temperature load on plastic. Present criteria: maximum temperature part is exposed to, (T max ) relative to melting point (T melt) heat deflection temperature Implications: resistance to soldering heat (6)

38 RoHS – Wetgeving & praktijk Selected maximum temperature, for SMD: we prefer 260 degC for wave: can be 260 to 280 Generally accepted "danger temperature": 280 deg C back Implications: resistance to soldering heat (7)

39 RoHS – Wetgeving & praktijk Logistics Issues/Strategy – Connectors Conversions for ELV completed as “Running Change” –No part number change (mandated by our automotive customers) –Attempted FIFO inventory management and labeling to control Conversions for RoHS per Standard EC/PCN Process TE Strategy : new part numbers for all parts which need conversion to become RoHS compatible –Any material change must be coordinated w/ plating change –Updated product documentation & application specification will be provided as appropriate Key for TE is NOT to support 2 versions of product (Sn&SnPb) for extended time period –Intent will be to obsolete non-compliant part by 7/1/2006 in most cases

40 RoHS – Wetgeving & praktijk Part coding/X-referencing Codes/Systems/X-references have been developed to capture and maintain this information –RoHS/EVL Code – created/maintained in database –Processing capability code – created/maintained in database –X-reference (alternate part) created and maintained in database Above codes/information is disseminated to other systems –E-Catalog (accessible by customers) –Global part master (DMF) –SAP and other manufacturing systems (codes only)

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43 Product Labeling Marking individual products will be cost prohibitive as infrastructure does not exist today Compliant products manufactured will have RoHS compliant text/label at a minimum on shipping carton Can be an additional sticker or pre-printed in reverse print TE has no plans to implement JEDEC or IPC label spec for connector –No room on product/label –Information on label not useful for process setup, rework, or recycling Part number change precludes need to use labels for material control or process compatibility Directive 2002/95/EC (RoHS) Compliant

44 RoHS – Wetgeving & praktijk The End questions?


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