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Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Mechanical Test Assessment for Electronic Modules Able to Function in Harsh.

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Presentation on theme: "Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Mechanical Test Assessment for Electronic Modules Able to Function in Harsh."— Presentation transcript:

1 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Mechanical Test Assessment for Electronic Modules Able to Function in Harsh Conditions The 3 rd International Symposium on Electrical and Electronics Engineering, September, Galati, Romania I.Plotog, G.Varzaru, P. Svasta Vapor Phase Soldering Technology, a response for Innovative IMM Requests to Lead–Free Era Challenges I.Plotog, G.Varzaru, P. Svasta

2 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Contents Introduction Critical Mass outbreak of Innovation Process Lead-Free Soldering Challenge VPS technology Basics Equipments facilities Applications Conclusions Acknowledgment References

3 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Introduction: Introduction: Critical Mass outbreak of Innovation Process

4 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Critical Mass outbreak of Innovation Process Human Factors Knowledge Catalyst: Socio-Economic & Financial environment Economic development with broad social implications Competitiveness through competence

5 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Innovation Education Knowledge Practice Theory Industry Inventors & Innovative SME Critical Mass of people and SMEs by increasing the competence UPB CETTI-ITA Actions

6 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Assembling Workshop

7 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9,

8 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9,

9 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Introduction: Introduction: Lead-Free Soldering Challenge

10 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Solder Paste Pad NiAu, OSP, Ag- Im, HAL, Sn-Im Solder joints 4P Soldering Model = 4 terms involve P ASTE- P AD- P IN- P ROCESS Soldering Process Thermal profile Electronic components

11 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Lead-Free Soldering Process Lead/Lead-Free Thermal profile

12 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Large dispersion for temperatures at PCB surface with consequences over solder joints microstructure

13 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Thermal problems Temperatures exceeding 230°C drastically increase the risk of thermal damages of the board and the electronic components Popcorning Cold Solder Joint (L-leaded package) Cold or unsoldered solder joints Limited temperature induction increases the risk of insufficient heat transfer especially on hidden solder joints (Shadowing effect) Temperature Cold Solder Joint (BGA ball) Thermally overheated BGA ball 13

14 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Non Wetting of BGA ball Non Wetting of L-leaded package Wetting problems Reduced wetting properties of lead-free solders usually require a protective gas atmosphere during the soldering process Bad Wetting of rectangular component Bad Wetting of L-leaded package Higher process cost due to protective gas 14

15 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Increased overall machine length To avoid solder cracks by enabling a smooth temperature ramp up the overall soldering track is further increased Increased energy cost Higher temperatures, larger machines, along with increased requirement for protective gas increases the already high energy requirements even higher Increased Rework High temperatures increase the risk of severe damage to the board. Solder and wetting problems, popcorning and others increase the production cost. Hot Air Rework Process of BGA T >> 250°C ConvectionVapour Phase Power consumption Depending on system kWh 0,8 - 5,5kWh Max Power consumption Depending on system >>20kWh 1,8 - 10,4kWh Solder Crack in L-leaded package Solder Crack in J-leaded package 15

16 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Consequences: Increased temperature Poor wetting More voiding More oxidation Worse cosmetics Smaller process window Large temperature dispersion at PCB level with important modifications of the solder joints microstructure and in consequence over quality and reliability

17 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, VPS technology: Basics

18 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 The heat transfer rates are much higher in condensation (Vapour Phase) than in convection. Overview: Condensation (Vapour Phase) and Convection 18

19 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Vapour phase: A boiling fluid is creating a vapour blanket. The temperature is physically limited by the boiling point of the fluid. The electronic units are moved into the vapour, which is condensing at the (colder) electronic units. Convection: Heating elements in combination with blower motors are creating various hot air zones (forced convection). The electronic units are moved through the zones on a conveyor. Heating elements with different temperatures Conveyor Air at 175°C - 300°C Overview: Basic Vapour Phase 19

20 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Air Process fluid Vapour Water Cooled Housing Circular Water Cooling Condensing Fluid 50-80°C °C Standby 20

21 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Air Process fluid Vapour Water Cooled Housing Circular Water Cooling Condensing Fluid 50-80°C °C Cold Board Enters Vapour Phase System 21

22 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 Air Process fluid Vapour Water Cooled Housing Circular Water Cooling Condensing Fluid 50-80°C °C Board at Soldering Temperature 22

23 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Soft Vapour Phase movement Vapour Phase thermal profiling 23

24 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, VPS technology: VPS-Convection process comparison

25 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, VPS technology: Equipments facilities

26 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010 The VPS equipment and facilities The VPS equipment IBL company: SLC309 26

27 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Vacuum applications in VPS- IBL equipment Vacuum zone

28 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, VPS Technology and Applications Applications

29 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, PCB with Different Core Materials

30 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Pin-In-Paste (a.k.a. Alternative Assembly and Reflow Technology, AART, and reflow soldering of through-Hole, ROT)

31 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, High thermal resistance Lower thermal resistance Thermovizion analyzes

32 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, C ONCLUSIONS Electrical & thermal parameters depend by all P actors of the 4P Soldering Model; The Process influence significant the solder joints reliability; VPS soldering process contribute to the component thermal stress reduction (30°C maximum difference); VPS offer lower peak temperature & lowest ΔT; Vapour Phase soldering is an ideal solution for: Increased Quality Economical Production Energy Saving

33 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Acknowledgment This paper represents the result of work done for promoting innovative technologies in the frame of INOINDEX project (CNMP: /2007). The authors are very grateful to the leading staff of IBL- Löttechnik GmbH for continuous support and collaboration to fulfill experiments used in the presented paper. Many thanks from the authors to: -Cookson Electronics which offered the solder pastes for experiments, -FELA Leiterplattentechnik GmbH, the company that supplied the glass and metal core PCBs for experiments.

34 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, References [1] R. Strauss, SMT Soldering Handbook, Butterworth-Heinemann Linacre House, Oxford, 1998, ISBN , pp [2] P. Svasta, I. Plotog, T. Cucu, A. Vasile, A. Marin, 4 P Soldering Model for Solder Joints Quality Assessment, ISSE 2009,The 32nd International Spring Seminar on Electronics Technology, May, Brno, Czech Republic proceedings ISBN [3] I. Plotog, P. M. Svasta, N. D. Codreanu, T. C. Cucu, C. Turcu, G. Varzaru, VPS Solution for Lead-Free Soldering in EMS Industries, ESTC 2008: Vol. 1, 2, Proceedings Pages: , London 2008 [4] I. Plotog, P. M. Svasta, N. D. Codreanu, T. C. Cucu, G. Varzaru Investigations on Assembling of Electronic Packages onto Glass Substrates using Lead-free Technology, 31st International Spring Seminar on Electronics Technology, ISSE 2008, Budapest, Hungary, May, 2008, Conference proceedings, pp [5] H. Leicht, A Thumm, Today's Vapor Phase Soldering. An Optimized Reflow Technology for Lead Free Soldering, IBL-Löttechnik GmbH, Germanywww.ibl-loettechnik.de [6] FELAM Thermoline, Technical Documentation, FELA Leiterplattentechnik, 2007.

35 Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, Mechanical Test Assessment for Electronic Modules Able to Function in Harsh Conditions Ioan Plotog Senior researcher, Executive Director, Technological and Business Incubator, CETTI-ITA Center for Technological Electronics and Interconnection Techniques, UPB-CETTI Politehnica University of Bucharest, UPB Spl. Independentei 313, sector 6, Bucharest, Romania Tel: ; Fax: Do You Have Any Questions ? Bucharest International Technical Fair TIB 2010, 36 edition, October 6-9, 2010


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