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A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek.

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Presentation on theme: "A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek."— Presentation transcript:

1 A Survey on Dual Interface and Multi Technology Cards ICMA – EXPO 2004 Prague, 17th – 20th October Presented by: Thies Janczek

2 COCASO1 October, 19th 2004 ICMA Expo, Prague Content Introduction DIC Dual Interface Cards Application, Technology, Challenges Multi Technology Cards Status on Components and Applications Technology and Development Driving factors Summary

3 COCASO2 October, 19th 2004 ICMA Expo, Prague Introduction Early 60sPlastic Cards started Early 80sChip Cards with Memory Chip Mid 80sProcessor Cards Early 90sGSM SIM Cards Late 90sOpen Platform OS TodayRapidly increasing Memory Various Open Platform OS Cryptographic Means Dual Interface Cards Increasing complexity

4 COCASO3 October, 19th 2004 ICMA Expo, Prague Introduction Increasing Employment of Dual Interface Cards Dedicated Contactless and Contact Usage Integration of Electrical Functional Components Battery, Display, Solar Power Unit, Switch, Sensors (e.g. Biometric) etc. Project driven Customizing, Non Standard Low Volume and High Costs Increasing complexity

5 COCASO4 October, 19th 2004 ICMA Expo, Prague Dual Interface Card - Application Wireless Interface for Identification Access Low security ID Contact Interface for Security/Signature PKI for Transaction Data Exchange with High Rates/Volume High Security ID (e.g. Biometric) Local and National ID Documents Banking, Internet, E-commerce

6 COCASO5 October, 19th 2004 ICMA Expo, Prague Dual Interface Card - Technology Module – Contacts – Antenna Electrical Connection by Isotropic conductive adhesive (ICA) Welding Technologies (Solder) Mechanical Connection (Crimping) Anisotropic conductive adhesive (ACA)

7 COCASO6 October, 19th 2004 ICMA Expo, Prague adhesive matrix connection particals adhesive matrix micro connections micro contacts Dual Interface Card - Technology *Anisotropic Conductive Adhesive ACA* Technique Adhesive conducting the electricity just in one direction Module adhesion and contact to the antenna in one step

8 COCASO7 October, 19th 2004 ICMA Expo, Prague Dual Interface Card - Challenges Connection Module – Antenna Mechanical and Environmental stress Lifetime up to 10 years Bridging technology from contact to contactless

9 COCASO8 October, 19th 2004 ICMA Expo, Prague Multi Technology Cards - Status of Components DISPLAY KEYPAD SWITCH BATTERY RELOADABLE B. ANTENNA DIODES SENSORS BIOMETRIC SENSOR SOLAR POWER UNIT DATA STORAGE COMPUTING

10 COCASO9 October, 19th 2004 ICMA Expo, Prague Multi Technology Cards - Status of Applications Display Cards Sensor Cards Fingerprint means Analog sensor

11 COCASO10 October, 19th 2004 ICMA Expo, Prague External interface (ISO) Button MCM- Module Internal interface External Power source Sensor Array Microcontroller Internal power source Sensorcard – presented by ORGA at Cartes 2000 Multi Technology Cards - Status of Applications

12 COCASO11 October, 19th 2004 ICMA Expo, Prague Multi Technology Cards - Status of Applications Display Cards Sensor Cards Fingerprint means Analog sensor Audio Cards Active RFID Label Combinations

13 COCASO12 October, 19th 2004 ICMA Expo, Prague Multi Technology Cards - Technology Challenges Communication and Network Protocol Systems and Software Smart Card Accepting Devices, Interfaces Embedded Peripherals, Subsystems and Microsystems High-End Cryptography, Tamper-Proof and Security Technologies Micro-Electronics RESET - Roadmap for European Research on Smartcard rElated Technologies

14 COCASO13 October, 19th 2004 ICMA Expo, Prague Multi Technology Cards - Development Few development activities specific to smart cards High development activity for certain components Driving factor are electronic devices (e.g. PDA, Mobile, electronic paper) DISPLAY - BIOMETRIC SENSOR - KEYPAD - SWITCH - DIODES - BATTERY - ANTENNA - SENSORS - AKKUMULATOR - SOLAR POWER UNIT - DATA STORAGE - COMPUTING

15 COCASO14 October, 19th 2004 ICMA Expo, Prague Multi Technology Cards - Driving factors Business opportunities and market requirements E-Business Services Protection and Management of Digital Content Contactless Access Consumer requirements Direct Interactivity Fraud Reduction Multi Application

16 COCASO15 October, 19th 2004 ICMA Expo, Prague Summary Increasing DIC demand will lead to a reliable Module/Antenna connection Products with Complex Electronic Circuits have been Proposed High R&D Activity will Lead to New Components and Technologies for Smart Cards Industrial High Volume Production not until 2006 High Potential for Lucrative Business Cases

17 COCASO16 October, 19th 2004 ICMA Expo, Prague THANK YOU FOR YOUR ATTENTION A Survey on Dual Interface and Multi Technology Cards More Information: COCASO – Thies Janczek – Moewenstrasse 5a – Molfsee – Germany Phone: +49-(0) –

18 COCASO17 October, 19th 2004 ICMA Expo, Prague


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