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Hi-P INTERNATIONAL LTD 赫比国际集团

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Presentation on theme: "Hi-P INTERNATIONAL LTD 赫比国际集团"— Presentation transcript:

1 Hi-P INTERNATIONAL LTD 赫比国际集团
Introduction

2 Corporate Overview Incorporated in Singapore on 26 Dec 1980
HI-P INTERNATIONAL LIMITED Incorporated in Singapore on 26 Dec 1980 Listed 17 Dec 2003 on Mainboard of Singapore Stock Exchange Chairman cum CEO, Mr. CT Yao owns 58% 15 manufacturing plants globally 20,000 employees worldwide

3 Chairman Introduction
Mr. Yao Hsiao Tung is our Executive Chairman and Chief Executive Officer of the Group. He is responsible for formulating the strategic directions of the Group as well as overall management of the operations. Mr. Yao has more than 40 years of experience in the precision tooling and plastic injection molding industry. Mr. Yao was conferred Honorary Doctorate by his Alma Mater, National Kaohsiung University of Applied Sciences, on 25 October 2009.

4 History & Milestones Mr. Yao invested his S$50,000 saving and managed the company 1983 Incorporation in Singapore Hi-P Tool & Die 1980 Molex invested and became its customer 1987 2010 Acquisition of Motorola’s R&D Center Hi-P Dongguan 2006 Hi-P Shanghai Optical Lens 2004 Hi-P Poland, first in Europe Hi-P Thailand Hi-P Shanghai Tech 2005 2009 Hi-P acquires G-Flex Revenue crossed US$10mil 1995 First overseas expansion, Hi-P Shanghai Electronics 1993 Hi-P Xiamen Hi-P Mold Base Chengdu Haier Hi-P JV Qingdao 2001 Hi-P Industries Hi-P Tianjin 2002 IPO on Singapore Stock Exchange Revenue >US$100mil Hi-P Suzhou Tech Hi-P Suzhou Electronics 2003 Renamed Hi-P International Hi-P Camera Products Hi-P Spray Painting 2000 Hi-P Precision Chengdu 1998 Hi-P Mexico, first in N.America Changed name to Hi-P Singapore 1997

5 Global Presence 中国 China 美国 USA 总部 Corp 工厂 Plant
业务拓展及办事处 ESI & Offices 天津 Tianjin 成都 Chengdu 上海 Shanghai 苏州 Suzhou 台湾 Taiwan 厦门 Xiamen 泰国 Thailand 波兰 Wroclaw 芝加哥 Chicago 墨西哥 Guadalajara 匈牙利 Hungary 新加坡 Singapore 东京 Tokyo

6 成为垂直整合机电一体化的行业领导者,透过创新来增加客户的价值并超过客户的期望
Our Vision Our Vision “Recognized leader as an integrated electro-mechanical solution provider focusing on value creation and exceeding customer expectations through innovation” 我们的愿景 成为垂直整合机电一体化的行业领导者,透过创新来增加客户的价值并超过客户的期望

7 作为客户的合作伙伴为客户增加价值并取得双向的成功
Our Mission & Goal Our Mission “Partner with customers to add value and contribute to mutual success” 我们的使命 作为客户的合作伙伴为客户增加价值并取得双向的成功 Our Goal Continue with the 8 measures as we strive towards our Vision 10, 2020 我们的目标 持续贯彻开源节流 ,成就十年百亿大业

8 Key Customers Wireless Consumer Electronics Computing Peripherals

9 Revenue Growth S$’Mil Integrated E-Mech Solutions Provider Module
Tooling House Component Manufacturer Module Assemblies Integrated E-Mech Solutions Provider

10 Vertical Integration Integrated Electro-Mechanics Solutions
PCBA In-house Test Development Electro-Mechanics Assembly Module Assembly FPC Integrated Electro-Mechanics Solutions ODM Tool Fabrication Tool Design Plastic Injection 2Colors/3Colors NCVM IML Surface Decoration Cosmetic Metal Precision Stamping

11 Plastics & Decoration Capabilities
Tooling NPI Molding Painting Pad Printing NCVM IML CNC IMD Design DFM/ESI with Customer Laser Etching

12 Metals & Decoration Capabilities
Laser Marking Chemical Etching Control Env Assy Polishing Sandblasting Tempo Print ED Color Anodizing Laser Welding PVD Spot Welding De-greasing

13 FPC & Rigid Flex Capabilities
Items Standard Customized Material Used Polyimide / PET 0.5mil / 1mil Maximum Panel Size 19.7” X 24” (500mm X 610mm) Line Width and Spacing 3mil (0.07mm) 2mil (0.05mm) Copper Thickness 1/3 oz min 1/4 oz min via / Drill Size Min Drill Hole Diameter 6mil (0.15mm) 4mil (0.1mm) Min via Size After Plating 3mil (0.075mm) Micro via (Laser) Hole to Thickness Ratio Thru Hole Via 1:6 Blind Via 1:1 Surface Finished Hard and soft Gold / ENIG / OSP / Tin Lead Plating /HASL Cover Layer Polyimide / Flexible Solder Mask / PET Stiffener Material Polyimide / FR4 /Metal / PET Shielding Material Copper / Silver Ink / Tatsuta Tooling Tolerance +/-2mil (0.05mm) +/-1mil (0.025mm) ZIF Tolerance +/-4mil (0.1mm) 8 Layer Rigid Flex Multi Layer FPC 5 Layer Rigid Flex 6 Layer Rigid Flex 10 Layer Rigid Flex

14 SMT Capabilities 20 mil Pitch BGA Assembly, Rework and Repair, Re-balling SMT with 0201 Chip & 16 mil Fine Pitch QFP Dome Force Measure & Dome Force Test Double Sided Reflow ICT Testing Lead Free Technology FPC Punch EL Dome Module Solder Paste Printer Placement Equipment Reflow Oven Router

15 Hi-P Singapore Design Center
Located at Motorola Singapore facility ~100 experienced R&D & support staff Comprehensive mobile phone lab facilities Capable to design mobile phones, tablets and related products & accessories SDC established Center of Excellence was formed Received Singapore Design Award Received Singapore Quality Award Changed to iDen Design Center 2011- Acquired by Hi-P Core Competences

16 Hi-P Culture Our Core Pillars
People Oriented: Respect, Care and Support Results Oriented: Performance Based Rewards, Bonuses and Promotion Our Attitudes - Contribution : One for all and all for one - Ownership How we Conduct Ourselves Manners,Spirit,Integrity,Discipline Results Expected We seek to create a united and highly productive team that will contribute to our families, our company, society and the world.

17 Awards Ranked in 2007 as 658 in Global Chinese Enterprise Listing with a revenue of US$6.48M Group Chairman Mr. Yao was awarded the “2009 Asia-Pacific Region Entrepreneur of the Year” Top 50 Singapore Companies for five consecutive years Excellent Supplier Award from Motorola, Braun, Gillette Forbes ranking of 31 for Singapore companies RIM "best supplier“ Award

18 Summary Recognized leader in Integrated Electro-Mechnical Solution arena Seamless design to manufacturing solution Uncompromised quality Competitive overall cost Time-to-volume; time-to-market Simplified supply chain Strong Employee Value Proposition

19 Work Together, Success Together...
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