2SUPERIOR FLUX & MFG. ELECTRONICS PRODUCTS Superior Flux & Mfg. Co. founded in 1932.A complete line of primary assembly, touch-up, and maintenance products for electronics.1949 Superior Supersafe® No. 30, first Battelle formula flux, introduced.1995 SyberGelTM and SyberLiquidTM introduced for repair/rework and hand-soldering.
3SUPERIOR PRODUCT LINE Solder Pastes Tacky Fluxes Wave Solder Fluxes Component Tinning FluxesWire Tinning FluxesHand Solder FluxesCopper and Nickel Pre-CleanersDetergent/SaponifierDescalerDross Reduction PowderOmega Meter Test Solution
4SOLDER PASTE 3000 Series Conventional No-Clean 4000 Series Synthetic, Low-Residue No-Clean8000 Series Water-Soluble9000 Series Rosin Mildly Activated (RMA)Solders: Tin/Lead, Lead-Free
53000 SERIES NO-CLEAN SOLDER PASTE Classification: IPC ANSI-J-STD 004, Type ROL0Meets and exceeds Bellcore standards.Pin-testable post-solder joints.Translucent residue.Capable of printing 12 mil pitch.
64000 SERIES SYNTHETIC NO-CLEAN SOLDER PASTE Classification: IPC ANSI J-STD-004, Type REL0.Meets and exceeds Bellcore standards.Translucent, protective post-solder residue.Pin-testable post-solder joints. General residue levels of 2.5 – 3.3%. In proper conditions, can be as low as 1.1%.Capable of printing 12 mil pitch.
78000 SERIES WATER-SOLUBLE SOLDER PASTE Passes BellcorePasses IPCResidues are truly water-soluble.Post-reflow residues can be left on boards for extended time and NOT reduce SIR values.Post-solder residues do not foam in aqueous cleaning systems.Capable of printing 12 mil pitch.
89000 SERIES RMA SOLDER PASTE Exceptional reflow profiling characteristics.Capable of printing 16 mil pitch.Superior wetting characteristics.Residues can be aqueous cleaned using SyberKleen 2000 Saponifier.
9RECOMMENDED REFLOW PROFILE: 63Sn/37Pb and 62Sn/36Pb/2Ag
12WHAT SETS SUPERIOR SOLDER PASTES APART? All are non-halide.All have a minimum 12 hour open-time between printing, placement, and reflow.All are formulated for high-speed dispensing.All No-Clean and RMA pastes can be aqueous cleaned in Superior SyberKleen 2000 Saponifier .NO slumping.NO tomb-stoning when stencil and reflow profile are properly set.NO white residues on PCBs.All Paste should be frozen or refrigerated for storage.
13WHAT SETS SUPERIOR SOLDER PASTES APART? (cont.) Consistent rheology, thixotropy, and viscosity from lot-to-lot.Consistent, clear, pin-testable residues with all No-Cleans.Consistent metal-load due to no pre-thinning or post-thinning manufacturing process.4000 Series Synthetic No-Clean residues act as protective barrier against humidity and outside elements.8000 Series Water-Soluble residues can be washed any time after reflow. SIR values remain the same when PCBs are cleaned three (3) minutes or three (3) days after reflow.
14SOLDER PASTE STORAGE Shelf life for all solder pastes extended with freezer-storage first formulations.Freezer Storage (0ºC and below): months.Refrigerator Storage (1-12ºC): months.Room temperature storage (18-23ºC): 3 months.
15TACKY FLUXES 4000 Synthetic No-Clean 3000 Conventional No-Clean 8000 Water-Soluble9500 High TemperatureApplications:BGA Attachment and RepairCustom manufacturing applicationsDispensable applicationsPreform soldering
16WAVE SOLDERING FLUXES Flux-types No-Clean Water-Soluble RMA Flux-base VOC-FREEAlcohol-basedApplications63Sn/37Pb, 96.5Sn/3.5Ag, 99.3Sn/0.7Cu and other alloys.
20ROSIN FLUXES Type R: No. 97 Type RMA: No. 99 Type RA: No.100 Solids content variations are availablefor all fluxes.
21ADDITIONAL PCB ASSEMBLY PROCESS PRODUCTS SyberGelTM and SyberLiquidTMHand solder, repair and rework gel or liquid that act as flux and cleaner.Superior SyberKleen 2000 SaponifierDetergent/saponification solution for aqueous cleaning systems.Superior DescalerA descaling solution for removing scale residual build-up in batch and in-line aqueous cleaners.Superior OMTSA test solution of IPA and DI water for PCB testing in Omega Meters.Superior Dross ReducerPowder for dross and oxidation removal from solder bath to extend solder life.
22COMPONENT TINNING PRECLEANERS & FLUXES Lead tinning for semiconductor, component, and fuse leads.Fluxes formulated for Tin/Lead, Lead-Free, and fusible alloys.Base Metals:CopperNickelAlloy 42Alloy 51KovarOther specialty alloys
23SEMICONDUCTOR AND COMPONENT LEAD PRE-CLEANERS Copper Pre-CleanerVOC-Free, non-hazardous, OA formulation.Light, pink color that changes if pH exceeds a 3.5 reading.Nickel Pre-CleanerA high activity nickel cleaner that contains no sulfuric acid.
24DIFFERENT FLUXES FOR DIFFERENT APPLICATIONS VOC-FREE, HALIDENo. 30, No. 30DS, No. 40MM4, No. 43ALCOHOL-BASED HALIDENo. 45, No. 48, No. 48SVOC-FREE, NON-HALIDE430 SeriesALCOHOL-BASED, NON-HALIDENo. 435, No :1, No. 91
25WIRE TINNING FLUXESNo-Clean: Small gage (14-22) automatic or manual cut/strip/tin operations.VOC-Free: No. 425Alcohol-based: No. 325, No. 334.Water-soluble: Large gage (2-12) wires; Copper and brass crimped terminal wires.VOC-Free: No. 30Alcohol-based: No. 45Applications:Automotive, Industrial, and Appliances.
26SUPERIOR MANUFACTURES QUALITY SOLDER PASTESAND FLUXES.OUR BUSINESS ISSOLVING PROBLEMS