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BRUNO MURARI MILANO 19/11/09 Radical Innovation and Lateral Thinking: the role of silicon technologies
© STMicroelectronics 2009 BRUNO MURARI 2 Semiconductor Market Cycles – Long Term Trend Source : WSTS, ST Main Frame C.T.V. VCR Defense Office PC Convergence Home PC Communication
© STMicroelectronics 2009 BRUNO MURARI Moores Law and more 3 3 EVOLUTION/ROADMAP (*) NO ROADMAP–CLUSTERS OF INVENTIONS (*) Room for Nobel Prize (*) – Modified by Bruno Murari
© STMicroelectronics 2009 BRUNO MURARI 4 System-in-a-Box: a digital brain with analog muscles and interfaces
© STMicroelectronics 2009 BRUNO MURARI Chip Size Trends – 2007 ITRS Functions/ Chip Model 5
© STMicroelectronics 2009 BRUNO MURARI Intelligent Power 6 High Voltage BCD Voltage Capability up to 800V (off-line applications) Fully dielectric isolation (SOI) up to 200V SOI solution for Low Voltage (LV) high efficiency application High Voltage BCD Voltage Capability up to 800V (off-line applications) Fully dielectric isolation (SOI) up to 200V SOI solution for Low Voltage (LV) high efficiency application BCD (Bipolar + CMOS + DMOS) Solid know-how and proprietary technology background High Voltage CMOS: High Voltage (up to 40V) & Logic CMOS integration Display Driver & Sensor Interface Applications Main stream BCD Voltage capability up to 100V Wide Application Variety in many fields
© STMicroelectronics 2009 BRUNO MURARI A long lasting success 7 M$
© STMicroelectronics 2009 BRUNO MURARI 8 SIP Need to bring More Moore & More than Moore at work! Digital Analog DFM Programming Model SW More Moore More than Moore Mechanical Organics Bio Optical Fluidics
© STMicroelectronics 2009 BRUNO MURARI Silicon is not only a semiconductor 9 9
© STMicroelectronics 2009 BRUNO MURARI Digital technologies, and much more 10 passive integration fluidics lighting GSM radioRF-ID tag rotationimage LED lampbio-sampler Xray pressure inkjet head sensors
© STMicroelectronics 2009 BRUNO MURARI 11 Ink Jet Cartridge
© STMicroelectronics 2009 BRUNO MURARI Lab-on-Chip12
© STMicroelectronics 2009 BRUNO MURARI MEMS 13 MEMS: Micro Electro Mechanical System – three dimensional device embedded in silicon – multifunction system consisting of sensors, actuators, electronics.
© STMicroelectronics 2009 BRUNO MURARI Probe storage 14 Scientific American – January 2003 High Doped Silicon Cantilever Heater
© STMicroelectronics 2009 BRUNO MURARI 15 Microactuator Concept
© STMicroelectronics 2009 BRUNO MURARI Accelerometers 16
© STMicroelectronics 2009 BRUNO MURARI Accelerometers in cars 17 Vehicle control Front light inclination Assisted GPS navigation Roll over detection Collision detection (air bag) Antitheft Collision reconstruction (black box)
Bruno Murari STMicroelectronics Universita’ di Pavia 24 Marzo, 2004 Microelettronica e MEMS Oggi.
© STMicroelectronics 2009 BRUNO MURARI 1 Game Controllers Mobile Phones/PMP Input Devices/ Remote Controllers ST sells to major OEMs in all these market.
ITRS Design ITWG ITRS Roadmap Design + System Drivers Makuhari, December 2007 Worldwide Design ITWG.
Addition 1’s to
Test B, 100 Subtraction Facts
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ITRS Design ITWG Design and System Drivers Worldwide Design ITWG Key messages: 1.- Software is now part of semiconductor technology roadmap 2.-
WEEK 1 You have 10 seconds to name…
ITRS Winter Conference 2006 The Ambassador Hotel Hsin Chu Taiwan 1 International Technology Roadmap for Semiconductors Assembly and Packaging 2006.
More than Moore ITRS Summer Meeting 2008 July 14, 2008 San Francisco, CA.
July 12, 2012ITRS public conference – San Francisco1 More-than-Moore Roadmapping Update.
Past Tense Probe Past Tense Probe – Practice 1 Past Tense Probe – Practice 2.
1 First EMRAS II Technical Meeting IAEA Headquarters, Vienna, 19–23 January 2009.
MULT. INTEGERS 1. IF THE SIGNS ARE THE SAME THE ANSWER IS POSITIVE 2. IF THE SIGNS ARE DIFFERENT THE ANSWER IS NEGATIVE.
The Road to Skilled Driving M April 2006 Modern Vehicle Technology.
Basic Bearer & Joists Calculations The following two slides will help you understand the calculation process for Bearer & Joist Calculations First look.
1 Unit 1 Kinematics Chapter 1 Day
TWO STEP EQUATIONS 1. SOLVE FOR X 3. DIVIDE BY THE NUMBER IN FRONT OF THE VARIABLE 2. DO THE ADDITION STEP FIRST.
SUBTRACTING INTEGERS 1. CHANGE THE SUBTRACTION SIGN TO ADDITION 2. TAKE THE INVERSE OF THE SECOND NUMBER 3. FOLLOW THE RULES FOR ADDITION 4. ADD THE OPPOSITE.
Growing Galileo 2009 Brussels Dr Philip G Mattos Dr. Philip G Mattos Chief Engineer, GNSS. Technology Advisory Panel, ST APG CRMM. Responsible for architectural.
STMicroelectronics PARALLEL ARCHITECTURE PROCESSES FOR MEMS, MEMORIES, IMAGE SENSORS AND OTHERS 3D SYSTEMS Ubaldo Mastromatteo* STMicroelectronics, Via.
1 DG INFSO Directorate G: Components and Systems.
1 Signals, Circuits, and Computers John Athanasiou Part B Spring 2010.
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Transducers PHYS3360/AEP3630 Lecture Terminology Transducers convert one form of energy into another Sensors/Actuators are input/output transducers.
DIVIDING INTEGERS 1. IF THE SIGNS ARE THE SAME THE ANSWER IS POSITIVE 2. IF THE SIGNS ARE DIFFERENT THE ANSWER IS NEGATIVE.
1 PIDS 7/1/01 18 July 2001 Work In Progress – Not for Publication P. Zeitzoff Contributors: J. Hutchby, P. Fang, G. Bourianoff, J. Chung, Y. Hokari, J.
11 CHAPTER INFORMATION TECHNOLOGY, THE INTERNET, AND YOU.
Linear Dimensions Semiconductor Analog & Mixed Signal Integrated Circuit Design & Manufacturing.
Dr Piotr Grabiec, prof. ITE Dept. of Silicon Microsystem and Nanostructure Technol. Instytut Technologii Elektronowej (ITE) Warsaw, Poland ITE is a major.
DRAFT - NOT FOR PUBLICATION 14 July 2004 – ITRS Summer Conference ITRS FEP Challenges Continued scaling will require the introduction of new materials.
1 Chapter 40 - Physiology and Pathophysiology of Diuretic Action Copyright © 2013 Elsevier Inc. All rights reserved.
Year 6 mental test 10 second questions Numbers and number system Numbers and the number system, fractions, decimals, proportion & probability.
Assembly and Packaging TWG What has changed in the last 12 months? 1.
RF and AMS Technologies for Wireless Communications Working Group International Technology Roadmap for Semiconductors Radio Frequency and Analog/Mixed-Signal.
Beyond CMOS CTSG Dec. 15, 2009 Work in Progress: Not for Distribution Beyond CMOS CTSG IRC Meeting December 15, 2009 DRAFT.
July 13, 2010ITRS public conference – San Francisco1 More-than-Moore Roadmapping Update.
DRAFT – Do Not Publish Assembly and Packaging July 18, 2007.
S Ahmad Central Electronics Engineering Research Institute, Pilani Workshop on Embedded System in Automobile Industry Indian Institute of Technology, Mumbai.
New developments of Silicon Photomultipliers (for PET systems) Claudio Piemonte FBK – Fondazione Bruno Kessler, Trento, Italy.
ITRS Design ITWG ITRS Design + System Drivers July, 2010 Design ITWG Juan-Antonio Carballo Tamotsu Hiwatashi William Joyner Andrew Kahng Noel Menezes.
30 nm © 2005 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice Atomic Switch ITRS Emerging.
PRESENTED BY : NATA RAJU G GESTURE BASED GLOVE FOR MULTIPLE APPLICATIONS 1.
1 Ken Gilleo PhD ET-Trends LLC 1 Introduction & Overview “What are the possibilities of small but movable machines?” - R. Feynman 1959 Feynman described.
EE42/100, Spring 2006Week 15, R. White1 Micro- and Nanotechnology.
1 Current Date Standards Document Path..ppt SWITCHGEAR BIG GRAY BOXES SWITCHBOARD.
MULTIPLICATION EQUATIONS 1. SOLVE FOR X 3. WHAT EVER YOU DO TO ONE SIDE YOU HAVE TO DO TO THE OTHER 2. DIVIDE BY THE NUMBER IN FRONT OF THE VARIABLE.
Silicon Solutions for the Real WorldTU Sofia 2006 – Slide 2 2 A Skilled Global Company Manufacturing Design Engineers Sales/Design Worldwide Headquarters*
ADDING INTEGERS 1. POS. + POS. = POS. 2. NEG. + NEG. = NEG. 3. POS. + NEG. OR NEG. + POS. SUBTRACT TAKE SIGN OF BIGGER ABSOLUTE VALUE.
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