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HP Thermal Bubble Jet Printer

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Presentation on theme: "HP Thermal Bubble Jet Printer"— Presentation transcript:

1 HP Thermal Bubble Jet Printer
Maran Ma Yuan Fang Ramneet Singh

2 Outline History of Printer Technologies HP Bubble Jet Printer
HP Print Head Fabrication Print Head Packaging & Circuitry Performance Analysis Conclusions

3 History 1878 – Lord Rayleigh – droplet breakup
1960 – Continuous ink-jet - stream broken into droplets via pressure wave pattern

4 History (cont’d) 1979 – Canon develops drop-on-demand thermal bubble-jet 1984 – HP produces first commercial bubble-jet called ThinkJet

5 HP’s Bubble-jet Advantage
HP’s print head is disposable – doesn’t sacrifice quality Better quality due to frequent replacement Allows for up to 4800x ppm Allows the use of pigmented ink for increased precision and superior fade performance

6 Video clip on HP Cartridge

7 Print Head Functional Requirements
Store ink for each nozzle Heat ink drop via heater resistor Release ink at desired quantity & position

8 HP Print Head Fabrication
Integrated fabrication process, facilitates critical alignment of: Ink reservoir Heater resistor Orifice plate Reusable substrate: silicon or glass, with photoresist islands Orifice plate: nickel, via electroforming Photoresist island Reusable substrate Orifice plate

9 HP Print Head Fabrication (cont’d)
First insulating barrier: prevent shorting of resistor/conductor with orifice plate Heater resistors: narrow region of conductor R = Rs (L/A) Heater resistors – plan view Insulating barrier layer Heater resistor Lead-in conductor C-shaped heater resistor Lead-in conductor

10 HP Print Head Fabrication (cont’d)
Second insulating barrier: prevent corrosion of resistor/conductor by ink Seed layer: sputtered metal, etched to C shape Ink reservoir wall: nickel, via electroplating Substrate removal: peeling to unplug orifices Second insulating layer Insulating layer Seed pad Wall hole

11 HP Print Head Fabrication (cont’d)
Table 1. HP Bubble Jet print head fabrication procedure summary [8] Layer Suitable Material Deposition Process Thickness [um] Substrate Oxidized Silicon/ Glass Orifice Plate Nickel Electroforming 20-75 Insulating Layer 1 Silicon Dioxide /Silicon Nitride /Silicon Oxynitride PECVD /LPCVD 1-3 Resistor & Conductor Polysilicon /Tantalum Silicide /Gold Sputtering /PECVD Insulating Layer 2 Silicon Nitride & Silicon Carbide LPCVD 0.5-2 Seed Layer /Titanium /Chromium Barrier Electroplating 10-75

12 HP Print Head Fabrication (cont’d)
Print head structure – plan view: ink flow channels along A MEMS fabricated print head structure prior to assembly with cartridge Lead-in conductor C-shaped heater resistor C-shaped reservoir wall Orifice (nozzle) Hole Ink reservoir Wall Second insulating barrier layer First Insulating barrier layer Heater resistor Lead-in conductor Orifice plate Seed pad

13 Print Head Packaging & Circuitry
Print head soldered to ink supply chamber wall Electrical contact bonded to exposed conductors Electrical contact with lead-in conductor Dome of C-shaped ink reservoir wall Ink supply chamber Ink supply chamber wall Electrical lead for circuit interfacing Lead-in conductor

14 Print Head Packaging & Circuitry (cont’d)

15 Print Head Packaging & Circuitry (cont’d)

16 Performance Analysis Piezoelectric printers are susceptible to nozzle-clogging TIJ use pigmented ink and pressure nozzle ejection Piezoelectric vs TIJ vs Laser print on plain paper TIJ vs Piezoelectric dots

17 Colour Printing dpi is not the best measure of performance
Rapid ejection of small dots is the key to quality printing (dps) HP’s TIJ has a higher throughput Smaller drop fluid chamber – more nozzles and higher firing frequency Epson PM dpi, 65microns HP 2000C 600 dpi, 45microns

18 Colour Printing (cont’d)
Piezoelectric versus TIJ drops-per-second comparison

19 Conclusions The Bubble jet print head is fabricated using MEMS technology Fabrication processes include: PECVD, LPCVD, photolithography, etching and sputtering Integrated design of the print head can increase reliability and reduce cost

20 References [1] “Progress and Trends in Ink-jet Printing Technology”, Journal of Imaging Science and Technology, volume 42, Number 1, Janurary/Feburary 1998 [2] Vince Cabill, “Introduction to Digital Printing Technology”: [March ] [3] “HP Business Inkjet 2800 Printer Series, Technical Specifications”, Hewlett-Packard Development Company [August 2005] [4] “Piezoelectric Process”, PDS Consulting: [May 8, 2006]. [5] David B. Wallace, Donald J. Hayes and Christopher J. Fredrickson, "Ink-Jet Based Fluid Microdispensing for High Throughput Drug Discovery," March 2008, [6] Inkjet Workshop, “Tutorials – Definitions,” March 2008, [7] Stephen D. Senturia, Microsystem Design. New York: Springer, [8] Eldurkar V. Bhaskar and Marzio A. Leban, “Integrated Thermal Ink Jet Printhead and Method of Manufacture” US Patent , July 11, 1989 [9] C. S. Chan and Robert R. Hay, “Barrier Layer and Orifice Plate for Thermal Ink Jet Printhead Assembly” US Patent , September 15, 1987 [10] Richard A. Murray, “Printer Ink Cartridge with Drive Logic Integrated Circuit” US Patent , July 8, 1997

21 Questions?

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