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MARAN MA YUAN FANG RAMNEET SINGH HP Thermal Bubble Jet Printer.

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Presentation on theme: "MARAN MA YUAN FANG RAMNEET SINGH HP Thermal Bubble Jet Printer."— Presentation transcript:

1 MARAN MA YUAN FANG RAMNEET SINGH HP Thermal Bubble Jet Printer

2 Outline History of Printer Technologies HP Bubble Jet Printer HP Print Head Fabrication Print Head Packaging & Circuitry Performance Analysis Conclusions

3 History 1878 – Lord Rayleigh – droplet breakup 1960 – Continuous ink-jet - stream broken into droplets via pressure wave pattern

4 History (contd) 1979 – Canon develops drop-on-demand thermal bubble-jet 1984 – HP produces first commercial bubble- jet called ThinkJet

5 HPs print head is disposable – doesnt sacrifice quality Better quality due to frequent replacement Allows for up to 4800x ppm Allows the use of pigmented ink for increased precision and superior fade performance HPs Bubble-jet Advantage

6 Video clip on HP Cartridge

7 Print Head Functional Requirements Store ink for each nozzle Heat ink drop via heater resistor Release ink at desired quantity & position

8 HP Print Head Fabrication Reusable substrate: silicon or glass, with photoresist islands Orifice plate: nickel, via electroforming Photoresist island Reusable substrate Orifice plate Integrated fabrication process, facilitates critical alignment of: –Ink reservoir –Heater resistor –Orifice plate

9 HP Print Head Fabrication (contd) First insulating barrier: prevent shorting of resistor/conductor with orifice plate Heater resistors: narrow region of conductor R = Rs (L/A) Heater resistors – plan view C-shaped heater resistor Lead-in conductor Insulating barrier layer Heater resistor Lead-in conductor

10 HP Print Head Fabrication (contd) Second insulating barrier: prevent corrosion of resistor/conductor by ink Seed layer: sputtered metal, etched to C shape Ink reservoir wall: nickel, via electroplating Substrate removal: peeling to unplug orifices Seed pad Wall hole Second insulating layer Insulating layer

11 HP Print Head Fabrication (contd) LayerSuitable MaterialDeposition ProcessThickness [um] SubstrateOxidized Silicon/ Glass Orifice PlateNickelElectroforming20-75 Insulating Layer 1 Silicon Dioxide /Silicon Nitride /Silicon Oxynitride PECVD /LPCVD 1-3 Resistor & Conductor Polysilicon /Tantalum Silicide /Gold Sputtering /PECVD /LPCVD Insulating Layer 2 Silicon Nitride & Silicon Carbide LPCVD Seed Layer Nickel /Titanium /Chromium Sputtering BarrierNickelElectroplating10-75 Table 1. HP Bubble Jet print head fabrication procedure summary [8]

12 HP Print Head Fabrication (contd) Lead-in conductor C-shaped heater resistor C-shaped reservoir wall Orifice (nozzle) Hole Ink reservoir Wall Second insulating barrier layer First Insulating barrier layer Heater resistor Lead-in conductor Orifice plate Seed pad Print head structure – plan view: ink flow channels along A MEMS fabricated print head structure prior to assembly with cartridge

13 Print Head Packaging & Circuitry Packaging Electrical contact with lead-in conductor Dome of C-shaped ink reservoir wall Ink supply chamber Ink supply chamber wall Electrical lead for circuit interfacing Lead-in conductor Print head soldered to ink supply chamber wall Electrical contact bonded to exposed conductors

14 Print Head Packaging & Circuitry (contd) Circuitry

15 Print Head Packaging & Circuitry (contd)

16 TIJ vs Piezoelectric dots Piezoelectric vs TIJ vs Laser print on plain paper Performance Analysis Piezoelectric printers are susceptible to nozzle-clogging TIJ use pigmented ink and pressure nozzle ejection

17 Epson PM dpi, 65microns HP 2000C 600 dpi, 45microns Colour Printing dpi is not the best measure of performance Rapid ejection of small dots is the key to quality printing (dps) HPs TIJ has a higher throughput Smaller drop fluid chamber – more nozzles and higher firing frequency

18 Piezoelectric versus TIJ drops-per-second comparison Colour Printing (contd)

19 Conclusions The Bubble jet print head is fabricated using MEMS technology Fabrication processes include: PECVD, LPCVD, photolithography, etching and sputtering Integrated design of the print head can increase reliability and reduce cost

20 References [1]Progress and Trends in Ink-jet Printing Technology, Journal of Imaging Science and Technology, volume 42, Number 1, Janurary/Feburary 1998 [2] Vince Cabill, Introduction to Digital Printing Technology: [March ] [3] HP Business Inkjet 2800 Printer Series, Technical Specifications, Hewlett-Packard Development Company [August 2005] [4] Piezoelectric Process, PDS Consulting: [May 8, 2006]. [5] David B. Wallace, Donald J. Hayes and Christopher J. Fredrickson, "Ink-Jet Based Fluid Microdispensing for High Throughput Drug Discovery," March 2008, [6] Inkjet Workshop, Tutorials – Definitions, March 2008, [7] Stephen D. Senturia, Microsystem Design. New York: Springer, [8] Eldurkar V. Bhaskar and Marzio A. Leban, Integrated Thermal Ink Jet Printhead and Method of Manufacture US Patent , July 11, 1989 [9] C. S. Chan and Robert R. Hay, Barrier Layer and Orifice Plate for Thermal Ink Jet Printhead Assembly US Patent , September 15, 1987 [10] Richard A. Murray, Printer Ink Cartridge with Drive Logic Integrated Circuit US Patent , July 8, 1997

21 Questions?


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