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© Mircea Stan, Kevin Skadron, David Brooks, 2002 1 Thermal Issues References Thermal considerations in cooling large scale high compute density data centers.

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Presentation on theme: "© Mircea Stan, Kevin Skadron, David Brooks, 2002 1 Thermal Issues References Thermal considerations in cooling large scale high compute density data centers."— Presentation transcript:

1 © Mircea Stan, Kevin Skadron, David Brooks, 2002 1 Thermal Issues References Thermal considerations in cooling large scale high compute density data centers Patel, C.D.; Sharma, R.; Bash, C.E.; Beitelmal, A. Termal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on, 2002, Page(s): 767 -776 A system design approach to liquid-cooled microprocessors, Dickinson, R.D.; Novotny, S.; Vogel, M.; Dunn, J. Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on, 2002, Page(s): 413 -420 Packaging the Itanium microprocessor Hong Xie; Watwe, A.; Yusuf, I.; Cherukuri, N.; Brandenburger, P.; Kay, A.; Chandran, B. Electronic Components and Technology Conference, 2002. Proceedings. 52nd, 2002, Page(s): 583 – 589 High performance package designs for a 1 GHz microprocessor, Hasan, A.; Sarangi, A.; Baldwin, C.S.; Sankman, R.L.; Taylor, G.F. Advanced Packaging, IEEE Transactions on, Volume: 24 Issue: 2, Nov. 2001, Page(s): 470 -476

2 © Mircea Stan, Kevin Skadron, David Brooks, 2002 2 Thermal Issues References The IA-64 Itanium processor cartridge, Samaras, W.A.; Cherukuri, N.; Venkataraman, S. IEEE Micro, Volume: 21 Issue: 1, Jan.-Feb. 2001, Page(s): 82 -89 Novel thermal validation metrology based on non-uniform power distribution for Pentium(R) III Xeon cartridge processor design with integrated level two cache Teck Joo Goh; Amir, A.N.; Chia-Pin Chiu; Torresola, J. Electronic Components and Technology Conference, 2001 Proceedings., 51st, 2001, Page(s): 1181 -1186 An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications Chia-Pin Chiu; Biju Chandran; Mello, K.; Kelley, K. Electronic Components and Technology Conference, 2001. Proceedings., 51st, 2001, Page(s): 91 -97 Characterization of laminar jet impingement cooling in portable computer application Guarino, J.R.; Manno, V.P. Semiconductor Thermal Measurement and Management, 2001. Seventeenth Annual IEEE Symposium, 2001 Page(s): 1 -11

3 © Mircea Stan, Kevin Skadron, David Brooks, 2002 3 Thermal Issues References Study of heatsink grounding schemes for GHz microprocessors Radhakrishnan, K.; Wittwer, D.; Yuan-Liang Li Electrical Performance of Electronic Packaging, 2000, IEEE Conference on., 2000 Page(s): 189 -192 Reliability of commercial plastic encapsulated microelectronics at temperatures from 125C to 300C McCluskey, P.; Mensah, K.; O'Connor, C.; Lilie, F.; Gallo, A.; Fink, J. Aerospace Conference Proceedings, 2000 IEEE, Volume: 5, 2000 Page(s): 445 -450 vol.5 Packaging technology for high performance CMOS server Fujitsu GS8900 Fujisaki, A.; Suzuki, M.; Yamamoto, H. Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th, 2000 Page(s): 920 -924 High performance package designs for a 1 GHz microprocessor Hasan, A.; Sarangi, A.; Baldwin, C.S.; Sankman, R.L.; Taylor, G.F. Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th, 2000 Page(s): 1178 -1184 Application of phase-change materials in Pentium (R) III and Pentium (R) III Xeon processor cartridges Chia-Pin Chiu; Solbrekken, G.L.; LeBonheur, V.; Xu, Y.E. Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on, 2000 Page(s): 265 - 270

4 © Mircea Stan, Kevin Skadron, David Brooks, 2002 4 Thermal Issues references Cartridge thermal design of Pentium/sup (R)/ III processor for workstation: giga hertz technology envelope extension challenges Teck Joo Goh; Amir, A.N.; Chia-Pin Chiu; Torresola, J. Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd, 2000 Page(s): 65 -71 Integrated heat sink-heat pipe thermal cooling device Yusuf, I.; Watwe, A.; Ekhlassi, H. Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on, 2000 Page(s): 27 -30 vol. 2 Refrigeration technologies for sub-ambient temperature operation of computing systems Ghoshal, U.; Schmidt, R. Solid-State Circuits Conference, 2000. Digest of Technical Papers. ISSCC. 2000 IEEE International, 2000 Page(s): 216 -217, 458 Low temperature CMOS experience at IBM Schmidt, R. Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE, 2000 Page(s): 112 - 113 Heat spreader attach: a microprocessor thermal solution Starr, O.; Master, R.N.; Khan, M.Z.; Tain, A.; Ding, D.H.; Juwanda, A. Electronic Components and Technology Conference, 1999. 1999 Proceedings. 49th, 1999 Page(s): 238 -242

5 © Mircea Stan, Kevin Skadron, David Brooks, 2002 5 Thermal Issues references The development of component-level thermal compact models: the Motorola PowerPC 603 and PowerPC 604 RISC microprocessors Parry, J.; Rosten, H.; Kromann, G.B. Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on, Volume: 21 Issue: 1, March 1998 Page(s): 104 -112 Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach ISBN: 0849394503, 1997 Pradeep Lall; Michael Pecht; Edward B HakimInfluence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach Temperature Measurement ISBN: 080198385 1993Bela G LintakTemperature Measurement Air Cooling Technology for Electronic Equipment ISBN: 0849394473 1996 Sung Jin Kim; Sang Woo LeeThe Electronic Packaging Handbook ISBN: 0849385919 1999 Glenn R BlackwellAir Cooling Technology for Electronic EquipmentThe Electronic Packaging Handbook Thermal Design of Electronic Equipment ISBN: 0849300827 2000 Ralph RemsburgThermal Design of Electronic Equipment Thermal Measurements in Electronics Cooling ISBN: 0849332796 1997 Kaveh AzarThermal Measurements in Electronics Cooling

6 © Mircea Stan, Kevin Skadron, David Brooks, 2002 6 TEC references D.M. Rowe. CRC Handbook of Thermoelectronics CRC Press, 1995. B.J. Huang et al. A design method of thermoelectric cooler International Journal of Refrigeration, 2000. J.A. Chavez et al. SPICE Model of Thermoelectric Elements Including Thermal Effects IEEE, 2000. Piotr Dziurdzia and Andrzej Kos. Tool for Fast Modeling Active Heat Sink, Seventeenth SEMI-THERM Symposium, 2001. Piotr Dziurdzia and Andrzej Kos. High Efficiency Active Cooling Systems, Sixteenth SEMI-THERM Symposium, 2000.

7 © Mircea Stan, Kevin Skadron, David Brooks, 2002 7 Power modeling references Brooks, et al. Wattch: a framework for architectural-level power analysis and optimizations Proceedings of the 27th International Symposium on Computer Architecture, June, 2000 Brooks, D, et al. New methodology for early-stage, microarchitecture-level power-performance analysis of microprocessors, IBM Journal of R&D, Vol 47, No. 5/6, 2003. Gunther, et al. Managing the Impact of Increasing Microprocessor Power Consumption, Intel Technology Journal, Q1, 2001 Ponomarev, et al., AccuPower: An Accurate Power Estimation Tool for Superscalar Microprocessors", DATE'02, March 2002. Ye, et al., The Design and Use of SimplePower: A Cycle-Accurate Energy Estimation Tool, DAC2000. Dhodapkar, et al., TEMPEST: A thermal enabled multi-model power/performance estimator, In Proceedings of the Workshop on Power-Aware Computer Systems, 2000.

8 © Mircea Stan, Kevin Skadron, David Brooks, 2002 8 Thermal management references A thermal-aware superscalar microprocessor Chee How Lim; Daasch, W.R.; Cai, G. Quality Electronic Design, 2002. Proceedings. International Symposium on, 2002 Page(s): 517 -522 Kevin Skadron et al. Control-Theoretic Techniques and Thermal-RC Modeling for Accurate and Localized Dynamic Thermal Management Proceedings of the Eighth International Symposium on High-Performance Computer Architecture, Feb. 2-6, 2002. Dynamic thermal management for high-performance microprocessors Brooks, D.; Martonosi, M. High- Performance Computer Architecture, 2001. HPCA. The Seventh International Symposium on, 2001 Page(s): 171 - 182

9 © Mircea Stan, Kevin Skadron, David Brooks, 2002 9 Clustering References R.I. Bahar S. Manne, Power and Energy Reduction Via Pipeline Balancing in Proceedings. 28th Annual International Symposium on Computer Architecture, 2001 A. Baniasadi, and A. Moshovos, Instruction Distribution Heuristics for Quad-Cluster, Dynamically-Scheduled, Superscalar Processors, Proc. 33rd. Intl. Symp. on Microarchitecture (MICRO-33) R. Canal, J.M. Parcerisa, A. Gonzalez. A Cost-Effective Clustered Architecture. In Proc. of the Int. Conf. on Parallel Architectures and Compilation Techniques, 1999 R. Canal, J.M. Parcerisa, A. González Dynamic Cluster Assignment Mechanisms in Proc. of the Sixth International Symposium on High-Performance Computer Architecture, 2000. HPCA-6) P. Chaparro, J. González, A. González Thermal-Effective Clustered Microarchitectures First Workshop on Thermal Aware Computer Systems (TACS-2004), 2004 K.I. Farkas, P. Chow, N.P. Jouppi, Z. Vranesic, The Multicluster Architecture: Reducing Cycle Time Through Partitioning, in Proc. of the 30th. Ann. Symp. on Microarchitecture, December 1997, pp149-159

10 © Mircea Stan, Kevin Skadron, David Brooks, 2002 10 Clustering References J. González, A. González Dynamic Cluster Resizing Computer Design, 2003. Proceedings. 21st International Conference on, ICCD 03 J. González, F. Latorre, A. González Cache Organizations for Clustered Microarchitectures 3rd Workshop on Memory Performance Issues (WMPI-2004), 2004 S. Heo, K. Barr, K. Asanovic Reducing Power Density Through Activity Migration Proceedings of the 2003 International Symposium on Low Power Electronics and Design, 2003 (ISLPED '03) G.A. Kemp, M. Franklin, PEWs: A Decentralized Dynamic Scheduler for ILP Processing, in Proc. of the Int. Conf. on Parallel Processing. 1996, v.1, pp 239-246 S. Palacharla, N.P. Jouppi, and J.E. Smith, Complexity-Effective Superscalar Processors, in Proc of the 24th. Int. Symp. on Comp. Architecture, 1997, pp 1-13 J.M. Parcerisa, A. González, J.E. Smith, A Clustered Front-End for Superscalar Processors Technical Report UPC-DAC-2002-29, 2002 J.M. Parcerisa, J. Sahuquillo, A. González, J. Duato Efficient Interconnects for Clustered Microarchitectures, Proc. of the International Conference on Parallel Architectures and Compilation Techniques, 2002.

11 © Mircea Stan, Kevin Skadron, David Brooks, 2002 11 Clustering References S.S. Sastry, S. Palacharla, J.E. Smith, Exploiting Idle Floating- Point Resources For Integer Execution, in Proc. of the Int.Conf. on Programming Lang. Design and Implementation. Montreal, 1998. V.V. Zyuban, Kogge, P. M. Inherently Lower-Power High- Performance Superscalar Architectures, IEEE Transactions on Computers 2001

12 © Mircea Stan, Kevin Skadron, David Brooks, 2002 12 Power Distribution References D.J. Herrell and B. Beker. Modeling of power distribution systems for high-performance microprocessors, IEEE Transactions on Advanced Packaging, vol. 22, no. 3, pp. 240-248, Aug. 1999. M.D. Pant, P. Pant, D.S. Wills, V. Tiwari. Inductive Noise reduction at the architectural level, Proceedings of the 13th Int'l Conference on VLSI Design, Jan. 2000. E. Grochowski, D. Ayers, and V. Tiwari. Microarchitectural simulation and control of di/dt-induced power supply voltage variation, HPCA8, Feb. 2002. R. Joseph, D. Brooks, M. Martonosi. Control techniques to EliminateVoltage Emergencies in High Performance Processors, HPCA9, Feb. 2003. M. Powell and T. N. Vijaykumar, Pipeline Damping: A Microarchitectural Technique to Reduce Inductive Noise in Supply Voltage, ISCA30, June 2003 R. Joseph, Z. Hu, and M. Martonosi, "Wavelet Analysis for Microprocessor Design: Experiences with Wavelet-Based dI/dt Characterization" HPCA, February 2004. M. Powell and T. N. Vijaykumar. Exploiting Resonant Behavior to Reduce Inductive Noise, ISCA2004. K. Hazelwood and D. Brooks. Eliminating Voltage Emergencies via Microarchitectural Voltage Control Feedback and Dynamic Optimization, ISLPED2004.


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