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Reiner John Infineon Technologies AG, Germany Ovidiu Vermesan SINTEF, Norway E 3 Car - Energy Efficient Electrical Car E 3 Car Results EUROPEAN NANOELECTRONICS.

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Presentation on theme: "Reiner John Infineon Technologies AG, Germany Ovidiu Vermesan SINTEF, Norway E 3 Car - Energy Efficient Electrical Car E 3 Car Results EUROPEAN NANOELECTRONICS."— Presentation transcript:

1 Reiner John Infineon Technologies AG, Germany Ovidiu Vermesan SINTEF, Norway E 3 Car - Energy Efficient Electrical Car E 3 Car Results EUROPEAN NANOELECTRONICS FORUM November 2011 Dublin, Ireland Copyright 2011Confidential Association for European NanoElectronics ActivitieS

2 Outline ENIAC E 3 Car Objectives / Key facts E 3 Car: Components for competitive EV´s Projects and European Funding Platforms E 3 Car: Vertical/Horizontal project management E 3 Car Highlights

3 ENIAC E 3 Car Objectives / Key facts Key facts: 11 European countries 22 Demonstrators 33 Project partners 44 M Budget -> 3500 PM -> 147 reports Objectives: Build a solid nanoelectronics technology base for Europe. Establish reference designs and platforms for electrical vehicles. Develop efficient semiconductor components for the first industrial generation of electrical vehicles. Target + 35% efficiency

4 E 3 Car: Components for competitive EV´s E3CAR R&D Pilot Mass- Manufacturing Funding 2 Mrd E3Car (44M) 7 EV projects (180M) MARKET 2010 EC Industrial R&D Investment Scoreboard. Five of the top 10 R&D companies in the EU are German, each having substantial R&D-tosales ratios [Volkswagen (5.7%), Siemens (5.6%), Daimler (5.3%), Robert Bosch (9.4%),

5 Projects and European Funding Platforms National Clusters IoE, POLLUX Batman LIB2015 CASTOR, SmarTop E 3 Car, MotorBrain

6 E 3 Car: Vertical/Horizontal project management E 3 Car 8 Work Packages E 3 Car 8 Work Packages 28 Supply Chains OEM, TIER1 driven 28 Supply Chains OEM, TIER1 driven Innovations 22 Demonstrators 22 Demonstrators 3 Electrical Vehicle Domains covered Energy Batteries, super capacitors, range extenders, energy harvesting, grid connections Propulsion Power converters for motor-generators Auxiliary Power supplies only 3500 PMs Innovations in 4 Application areas Power Conversion Efficiency Temperature Power Management Mileage Efficiency Power Distribution Efficiency Temperature Flexibility Dynamic Monitoring Harsh environment Sensors Functionality Efficiency Temperature Electrical understanding Automotive understanding

7 E 3 Car Highlights Power conversion E 3 Car Inverter Roadmap Power conversion domain: IGBT 400V Semiconductor Technology, IGBT 400 Module and Vehicle Class Micro Scalable Inverter IGBT 650V Module and Vehicle Class A Scalable Inverter Smart dynamic monitoring domain: Zero insertion loss current sensor Power distribution domain: Solar panel integration Power management domain: Starter battery Battery management domain: Battery Management Systems matching world wide competition

8 1.Efficiency 2. Mileage 3. Temperature 4. Flexibility 5. Functionality 6. Harsh Environment electronics 6. Sensors +9% +15% %, 10% 400V IGBT inverter 650V IGBT inverter Starter battery Solar panel Current-Sensor Integration Energy efficiency and range of operation E 3 Car: Achievements in 4 Application areas

9 Build a solid nanoelectronics technology base for Europe. Establish standard designs and platforms for electrical vehicles. Develop efficient semiconductor components for the first industrial generation of electrical vehicles. Nanoelectronics Technology mapped to EV functional units Match strenghts and limitations of High Voltage (HV) technologies High Voltage CMOS (< 700V) IGBT (400V, 650V, 1200V) BCD (Bipolar/CMOS/DMOS) SOI (Silicon on Insulator) SiC (Silicon Carbide) GaN (Gallium Nitride) Package technologies for high temperature devices Submicron lithography needed to combine complex logic with high voltage driver devices E 3 Car: Match of HV technologies and EV 1.IGBT400V devices based on 2.40 m thin technology

10 mCar Car Class A, B, C Truck, Bus High Efficiency, High Temperature Inverter Efficiency + Cost IGBT Technologies SiC GaN Wide Band Gap CEA Leti ATL III-V Lab Inverter Basis SiC Infineon ValeoSiemens Inverter V BT =400V 650V 1200V Module IGBT 400 G2+ G2 G1 Inverter Power Modul GaN HEMT GaN HEMT: Driver, Switch, Diode >400V, 250°, switching losses 1200V,270°, 150° Automotive reliability +9% Module Valeo Power technology Powermodul + Driver + Control Module E 3 Car Inverter Roadmap: Power Conversion

11 E 3 Car: IGBT 400V Inverter 62% 46% 65u -> 40u IGBT Modul Inverter -15% size Pickup 40u Size, parasitics Reduced switching losses -11,7% Reduced conduction losses - 10% reduced thickness and reduced size Inverter Costs, performance, power density improved Eff. +9%

12 E 3 Car: 400V IGBT - 40 m thin wafer

13 E 3 Car Highlight: IGBT 650V inverter IBGT Modul Improved Size and Cost (IML) Costs, performance, power density improved 650V IGBT & Diodes dice IGBT3/Emcon3 from INFINEON Trench + Field Stop Technology but with a dice thickness of 110µm (650V) IML Package from VALEO Compact solution Thick copper traces for reduced conduction losses Conduction losses reduction Module Mounting with springs for good thermal contact over life time All functions in small volume Real time IGBT junction temperature monitoring IGBT State Of Health test at each power up Eff. full load Inverter

14 low voltage medium volt. high volt. Advanced Sensor Integration Efficiency + Cost Driver ICs Task 1 & 2 & Sensors Task 7 SC20 ST SC20 Sensor materials CNR ATMEL AMS ST Sensor integration high integration medium integr. low integr. SC11 G2 G1 SC6 SC10 SC17 SC18 SC21 SC19 E 3 Car Roadmap of Driver IC-Technologies

15 E 3 Car: Zero insertion loss current sensor IBGT Size, parasitics High measured Fluxgate sensitivity (13V/T) HIMC Sensitivity improvement 4x-10x, due to the magnetic concentrator (measured) with respect to a single Hall cell Sensor linear range up to 2mT (measured) / 30A (expected) current B 3mm B B Feedback to the control system Thin (~1um) integrated ferromagnetic material Low cost standard sputtering deposition Target magnetic properties obtained Hall with Integrated Magnetic Concentrator (HIMC)/up to 30A Fluxgate /up to 2A Characterization vs. magnetic field DONE NEXT STEP: current sensor demonstrator

16 Assumptions: No shade shading footprint - 30% No curvature Module curvature -16% Grid operation The solution: MPPT on cell level to increase module efficiency E 3 Car: Smart control Solar Panel Mileage increase with Solar MAX driving range, 6m 2 solar area Graz, Austria3419 km/yr Madrid, Spain4813 km/yr Oslo, Norway2469 km/yr Interior Isolated CAN Input EMI-filter Input inverse-polarity protection JATAG interface 3,3V 1,2V Output fuse Xilinx FPGA Oscillator Output inverse-polarity protection Output power measurement Flash SRAM Output terminals CAN terminals Vin 3 to 10V Input terminals 3 phase DC/DC converter 2 GaN Power Fets Main inductance 5V 3,3V Peripherals Controller DC/DC power stage Power Supply

17 Development of a near-series starter accumulator (Li-Ion) Operation strategies for complete system Innovation and Optimization Conductor rails (weight - form - heat build-up) SOC/SOH algorithms Strategies for charging and charge balance Thermo management µElectronic devices, sensors and power electronic Communication between accumulator and automobile E 3 Car: Li-Ion Starter battery

18 E 3 Car: Battery Management Systems Battery based one.g 2 modules (block) each 12 cells ATMEL: The battery management device (Li- ion Battery Monitoring System Basic Chip) is realized on a MPW (Multi-Project Wafer). AMS: First samples AS8505 available since January 2011, Samples produced on a Multi-Project- Wafer in the FAB in Unterpremstätten Package: QFN 36 pin, Device characterisation started at austriamicrosystems, Results expected until mid of February 2011, Demonstrator build started at FhG, Charactarisation done in Feb ON Semi analog BMS Analog monitoring circuit, Fabout 15.April on time based on revised schedule. Reason change of concept based on finding requirement and specification refelcting market needs.partitioning, logic FPGA instead og hard coding in the chip. (Multichip approach) -> high flexibility, reprogrammability.

19 EVs - A Way of Life - A New Lifestyle Enjoy Life! Emissions -> Electrical vehicle vs. combustion vehicle: CO : -99%, HC : -97%, NOx : -92%, CO 2 : -50%

20 E 3 Car Culture Interaction, Communication, Information

21 E 3 Car Environment


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