Presentation is loading. Please wait.

Presentation is loading. Please wait.

Shi Lab Opto-Electronics Integration and Packaging

Similar presentations


Presentation on theme: "Shi Lab Opto-Electronics Integration and Packaging"— Presentation transcript:

1 Shi Lab Opto-Electronics Integration and Packaging Shi Lab Opto-Electronics Integration and Packaging Areas of Research Interest: Optoelectronic Packaging 1.High Power White LED Technologies for lighting and backlighting 2.Fiber-Optic Packaging Optoelectronic Device and Packaging Materials 1.Novel rare earth doped materials for high power lasers and phosphors for white LEDs 2.Silicone encapsulant 3.Die attach conductive materials for high power LEDs 4.Conductive pastes for solar cells and other devices 5.Nano-composite conductive and dielectric materials IC Packaging and Manufacturing Areas of Research Interest: Optoelectronic Packaging 1.High Power White LED Technologies for lighting and backlighting 2.Fiber-Optic Packaging Optoelectronic Device and Packaging Materials 1.Novel rare earth doped materials for high power lasers and phosphors for white LEDs 2.Silicone encapsulant 3.Die attach conductive materials for high power LEDs 4.Conductive pastes for solar cells and other devices 5.Nano-composite conductive and dielectric materials IC Packaging and Manufacturing Prof. Frank Shi Full Professor Ph.D., California Institute of Technology (1992) Prof. Frank Shi Full Professor Ph.D., California Institute of Technology (1992) Professor Shi was honored by IEEE-CPMT Society in 2010 as the recipient of Outstanding Sustained Technical Contribution Award,...Dr. Shi is being recognized for his accomplishments in multiple IEEE CPMT fields including optoelectronic packaging technology development; device and packaging materials development; electronic packaging and manufacturing technology development; and his leadership in the technology transfer of these various developments from a research environment to an industrial commercialization and production environment. Dr Shi's work spans more than 15 years and is well disseminated in greater than 130 refereed publications in key industry journals, numerous presentations and conferences. Prof Shi was elected to be an IEEE Fellow in Professor Shi was honored by IEEE-CPMT Society in 2010 as the recipient of Outstanding Sustained Technical Contribution Award,...Dr. Shi is being recognized for his accomplishments in multiple IEEE CPMT fields including optoelectronic packaging technology development; device and packaging materials development; electronic packaging and manufacturing technology development; and his leadership in the technology transfer of these various developments from a research environment to an industrial commercialization and production environment. Dr Shi's work spans more than 15 years and is well disseminated in greater than 130 refereed publications in key industry journals, numerous presentations and conferences. Prof Shi was elected to be an IEEE Fellow in The product of a partnership between engineer Frank Shi (pictured) and urologist Ralph Clayman: silicone materials formulated for optoelectronic devices (foreground) now will be used for breakthrough medical device applications. Full story Key Publication: Mondal, SK; Mitra, A; Singh, N; Shi, F; Kapur, P. Ultrafine Fiber Tip Etched in Hydrophobic Polymer Coated Tube for Near-Field Scanning Plasmonic Probe. IEEE PHOTONICS TECHNOLOGY LETTERS, 23: (2011). Key Publication: Mondal, SK; Mitra, A; Singh, N; Shi, F; Kapur, P. Ultrafine Fiber Tip Etched in Hydrophobic Polymer Coated Tube for Near-Field Scanning Plasmonic Probe. IEEE PHOTONICS TECHNOLOGY LETTERS, 23: (2011).


Download ppt "Shi Lab Opto-Electronics Integration and Packaging"

Similar presentations


Ads by Google