2 Loss of U.S. Manufacturing Employment $25,634,942 (18%)State Appropriated FundsChallenge:Loss of U.S. Manufacturing EmploymentEmployees (thousands)YearSource: data.bls.gov, Current Employment Statistics Survey
3 Next Generation Power Electronics Manufacturing Innovation Institute Vision: Wide bandgap technology for a more energy efficient worldMission: Develop a manufacturing-focused innovation ecosystem to reduce cost, improve performance and reliability, and enable U.S. industry dominance in WBG semiconductor devices and systems to create jobs.As we look at US and world today, there are two simultaneous and seemingly intractable grand challenges:TheOpportunityWe are grateful to the DOE for its leadership and seizing the opportunity to launch the WBG Institute program.
5 Operate above 300 oC compared to 150 oC for Silicon-based devices Reduce losses during DC-to-AC electricity conversion by 90%Handle 10 timeshigher voltagesProduce bulbs with 10 times more light that last 30 times longer …* WBG materials (specifically silicon carbide) may reduce electricity losses during vehicle battery recharging by nearly two-thirds, making it cheaper to recharge electric and plug-in hybrid vehicles.In hybrid and electric vehicles, a second cooling system is needed to cool the power electronics. The higher operating temp of silicon carbide could allow the size of the cooling system to be reduced by 60%, or even eliminated altogether, significantly reducing the overall size of the car engine.* Reduction in losses during DC-to-AC electricity conversion will help integrate renewable sources of electricity into the power grid. Inverters are needed to convert the DC electricity produced by solar panels and wind turbines into the AC electricity that flows to our receptacles. Replacing current inverters with SiC devices could cut losses by 90%.* Powering motor systems consumes 69% of the electricity used in U.S. manufacturing. WBG materials will enable higher efficiency motor drive systems for pumps, fans, compressors, and HVAC systems.saving $250B by 2030
7 MARKET DEMAND MANUFACTURING PROCESS PRODUCTS TALENT Research, Development &DemonstrationComprehensive Education and Workforce Development ProgramMARKET DEMAND MANUFACTURING PROCESSPRODUCTS TALENTThriving Power Electronics Industry EcosystemCommercialProduct AccelerationProduction& Packaging Foundries
8 Comprehensive Education and Workforce Development Program TALENT:Comprehensive Education andWorkforce Development Program$25,634,942 (18%)State Appropriated FundsSummer InstituteTraining for working professionalsTraining community college and high school teachersUndergraduate Research ProgramWBG Professional Science MastersOnline WBG UniversityMEP provided training
9 Approach To Innovation OEMs Market Demand and Feedback Wafer Suppliers DeviceDesignHouseApproachToInnovationWaferFabsOur approachPackagingFabs
11 Reach Parity with Silicon Low VoltageDevices(600V to 1700V)Medium Voltage(3300V to 6500V)3 years5 yearsHigh Voltage Devices(> 10kV)10 yearsCurrently 10XCurrently 10XDon’t ExistAchieve last 50%cost reduction viaPower ElectronicsInnovationTARGET:WBG CostsReach Parity with SiliconCostParity1.5X
12 Wide Bandgap Service Centers and Shared RD&D Facilities Increase reliabilityImprove performanceReduce costEstablish standard testing benchmarks ❶❷❻Long-term reliability test ❶❷❹❺Identify physics of failure mechanism ❹❺❻Develop ruggedness by process/device ❸❹❻ReliabilityDevices to exploit WBG benefits ❸❹❻Advanced package development ❶❷❺Application aligned device choice ❶❷❸Develop WBG exclusive application ❶❷PerformanceImprove materials for predictive output ❹❺❻Larger volume inviting many customers ❶❷❺Silicon compatible manufacturability ❸❹❻Novel device, package development ❸❺❻Cost1High Power Electronics2Power Supply3Device Design4Device Failure Analysis5Power Module Failure Analysis & Reliability6Device Fabrication & CharacterizationWBG Service CentersWBG Service Centers1WBG High Power Electronics2WBG Power Supply3WBG Device Design4WBG Device Failure Analysis5WBG Power Module Failure Analysis & Reliability6WBG Device Fabrication & Characterization
13 RD&D Thrust Areas IP Generation & Technology Transfer Critical GaN Research - Umesh Mishra, Lead- GaN Ron Scaling- Stability and Reliability- Normally-off modeCritical SiC Research - Jay Baliga, Lead- MOS interface quality- Bipolar degradationPower Electronics - Fred Lee, Lead- High density converters- Low cost PV inverters- High temperature EV invertersPackaging - Doug Hopkins, Lead- High temperature packaging- Low Rth- Low parasitic inductance
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