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North Carolina State University © 2014 Next Generation Power Electronics Manufacturing Innovation Institute February 27, 2014 Research Retreat Dennis Kekas.

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Presentation on theme: "North Carolina State University © 2014 Next Generation Power Electronics Manufacturing Innovation Institute February 27, 2014 Research Retreat Dennis Kekas."— Presentation transcript:

1 North Carolina State University © 2014 Next Generation Power Electronics Manufacturing Innovation Institute February 27, 2014 Research Retreat Dennis Kekas Interim Executive Director, Next Generation Power Electronics Manufacturing Innovation Institute

2 Year Employees (thousands) Source: data.bls.gov, Current Employment Statistics Survey $25,634,942 (18%) State Appropriated Funds Challenge: Loss of U.S. Manufacturing Employment

3 Vision: Wide bandgap technology for a more energy efficient world Mission: Develop a manufacturing-focused innovation ecosystem to reduce cost, improve performance and reliability, and enable U.S. industry dominance in WBG semiconductor devices and systems to create jobs. Next Generation Power Electronics Manufacturing Innovation Institute

4 Applications

5 Operate above 300 o C compared to 150 o C for Silicon-based devices Handle 10 times higher voltages Reduce losses during DC-to-AC electricity conversion by 90% Produce bulbs with 10 times more light that last 30 times longer … saving $250B by 2030

6 RD&D Wafer Suppliers Device and Package Foundry Power Electronics Companies Design House /Device Manufacture Founding Partners North Carolina State University © 2014

7 Commercial Product Acceleration Production & Packaging Foundries Comprehensive Education and Workforce Development Program Research, Development & Demonstration Thriving Power Electronics Industry Ecosystem

8 $25,634,942 (18%) State Appropriated Funds TALENT: Comprehensive Education and Workforce Development Program Summer Institute Training for working professionals Training community college and high school teachers Undergraduate Research Program WBG Professional Science Masters Online WBG University MEP provided training

9 Approach To Innovation Wafer Suppliers Market Demand and Feedback Device Design House Wafer Fabs Packaging Fabs OEMs

10 600V, GaN HFET 1200V, SiC JBS, MOSFET 1700V, SiC JBS, MOSFET 4500V SiC JBS, MOSFET 10kV, SiC JBS, MOSFET RFMD 1200V, GaN Vertical Tr. Avogy Monolith Semi. & X-Fab Monolith Semi. & X-Fab USCi CREE 600V 1200V 1700V 4.5kV 10kV 20kW75kW John Deere Heavy Duty EV Inverter Toshiba MVD Toshiba PV Inverter GridBridge Grid Energy Router Delphi Vehicle Traction Inverter Vacon Medium Voltage Drive 200kW Power Voltage End Products Devices 15kV MARKET DEMAND: Commercial Product Acceleration

11 Low Voltage Devices (600V to 1700V) Medium Voltage Devices (3300V to 6500V) 3 years 5 years High Voltage Devices (> 10kV) 10 years Achieve last 50% cost reduction via Power Electronics Innovation TARGET: WBG Costs Reach Parity with Silicon Cost Parity Dont Exist Currently 10X 1.5X

12 Establish standard testing benchmarks Long-term reliability test Identify physics of failure mechanism Develop ruggedness by process/device Reliability Devices to exploit WBG benefits Advanced package development Application aligned device choice Develop WBG exclusive application Performance Improve materials for predictive output Larger volume inviting many customers Silicon compatible manufacturability Novel device, package development Cost 1 WBG High Power Electronics 2 WBG Power Supply 3 WBG Device Design 4 WBG Device Failure Analysis 5 WBG Power Module Failure Analysis & Reliability 6 WBG Device Fabrication & Characterization WBG Service Centers 1 High Power Electronics 2 Power Supply 3 Device Design 4 Device Failure Analysis 5 Power Module Failure Analysis & Reliability 6 Device Fabrication & Characterization WBG Service Centers Wide Bandgap Service Centers and Shared RD&D Facilities Increase reliability Improve performance Reduce cost

13 IP Generation & Technology Transfer IP Generation & Technology Transfer RD&D Thrust Areas Critical GaN Research - Umesh Mishra, Lead - GaN Ron Scaling - Stability and Reliability - Normally-off mode Critical SiC Research - Jay Baliga, Lead - MOS interface quality - Stability and Reliability - Bipolar degradation Power Electronics - Fred Lee, Lead - High density converters - Low cost PV inverters - High temperature EV inverters Packaging - Doug Hopkins, Lead - High temperature packaging - Low Rth - Low parasitic inductance

14 NC State Expertise North Carolina State University © 2014

15 NNF, AIF NSF FREEDM NC States Centennial Campus NCSU Nanofabrication Facility Analytical Instrumentation Facility Existing Infrastructure at NC State

16 NC State Competency: Building Industry Partnerships Centers & Institutes draw about 180 partners, including some of the top names in industry. North Carolina State University © 2014

17 Transforming Economies Dennis Kekas research.ncsu.edu/power


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