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Presentation on theme: "Www.isola-group.com Isola Technology and Product Update June 2005."— Presentation transcript:

1 Isola Technology and Product Update June 2005

2 Isola Product Technology Roadmap Isola Lead Free, FR4 Replacement Product Solutions Isola High Speed, Signal Integrity Product Solutions Reliability Overview of Isola Test Capabilities Isola Technology Agenda

3 Isola Technology Overview

4 High Speed Digital - High Gbps Data rates. - High Clock speeds Optical Solutions Gbps data rates and beyond Lead free and Thermal Reliability Higher Thermals Higher Thermal Cycling resistance Miniaturization - Thinner Dielectrics - Embedded passives - Packaging Thermal Management - Thermal conductive Substrates Environmental - Halogen Free Manufacturing and Process Technology Emerging Trends Signal Integrity Lead Free

5 * Speeds a function of design such as line length etc. **Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes. Isolas Product offering- High Tg High performance IS420 Thermal Performance T260/ Decomp./IST Electrical Performance Loss /DK FR406 High Tg 170° Epoxy FR406 High Tg 170° Epoxy IS ° Tg IS ° Tg FR Tg Low Dk & Df FR Tg Low Dk & Df IS640 Next Generation Low Loss-.005 IS640 Next Generation Low Loss-.005 P Tg Polyimide V0/V1 P Tg Polyimide V0/V1 G200 BT Epoxy Laminate G200 BT Epoxy Laminate P Tg Polyimide HB P Tg Polyimide HB Telecom Higher Reliability High Speed Digital / Base stations/Routers/Servers/Burn in Military/Computers/drilling Gbps * Gbps * Low Freq and speed T Mins/Td.300** T Mins/Td.350** High Speed /High Frequency Gbps* T Mins/Td.400** IS415 L e a d Free IS620 Tg 215 Low Ghz Laminate IS620 Tg 215 Low Ghz Laminate IS625 IS500

6 Performance Isola Product Offering Application FR-4 ED130 Tg 130 FR-4 Multifunctional Tg 130 FR-4 Multifunctional ED130UV Tg 140 Multifunctional Tg 140 Multifunctional FR402/DE114 Tg 150 Halogen Free Laminate Tg 150 Halogen Free Laminate DE156 High Tg 170° Epoxy High Tg 170° Epoxy FR406/DE117 High Tg Lead free Signal Integrity High Tg Lead free Signal Integrity FR408 IS640 Tg 180 Low Dk & Df Tg 180 Low Dk & Df Tg 215 Low Ghz Laminate Tg 215 Low Ghz Laminate Next Gen Low Loss Next Gen Low Loss P95 Tg 260 Polyimide Laminate HB Tg 260 Polyimide Laminate HB BT / Epoxy Laminate BT / Epoxy Laminate IS415 G200 FR406BC IS410 BC FR408 BC Buried Capacitance Applications Buried Capacitance Applications IS620 Low Flow No Flow FR406 NF/A11 Tg 260 Polyimide Laminate V0/V1 Tg 260 Polyimide Laminate V0/V1 P96 Chip Packaging IS420/IS410 Thermal Conductive IS450 High Tg 180° Halogen free High Tg 180° Halogen free IS500 High Tg Lead free High Reliability High Tg Lead free High Reliability IS420 IS Low Loss IS Low Loss IS Low Loss IS Low Loss IS Low Loss IS Low Loss IS Low Loss IS Low Loss IS Low Loss IS Low Loss RF&MICROWAVERF&MICROWAVE Tg 150 Lead Free High Reliability Tg 150 Lead Free High Reliability IS400

7 Signal Integrity- Overview Drivers Overview of Technical issues –High Speed Basics –Key definitions –Measurements –Time domain measurements Losses –Dielectric losses –Conductor losses –Conductor roughness losses Frequency domain measurements Isola offering Product selection criteria

8 Drivers - High Speed and High Frequency

9 High Speed digital communication involves sending bits of information coded on Trapezoidal waveforms. The Information - Zeros and ones are coded on the rise time or on both the rise time and fall time. High Voltage is 1 and Low voltage is zero The conductive paths between a chip that sends a signal to the chip that receives a signal are called interconnects, A group of interconnects represents a bus The sharper the Rise time the faster the signal To achieve faster rise times Sinusoidal wave forms are superimposed on one another. The range of frequencies used is called bandwidth The bandwidth is given as =0.35/Rise time Example a 2.5 Gbps signal with a rise time of 70 Ps will have a fundamental frequency = 1.25 Ghz and a second cut off frequency of 4.5 Ghz and a 2.5 Gbps signal with a rise time of 125 Ps will have a fundamental frequency equal to 1.25 Ghz and a bandwidth or second cut off frequency = 2.5 Ghz. Frequency is a function of Data rate and bandwidth is a function of Rise Time High Speed Digital basics

10 Time-domain definition of a periodic digital clock signal with analog definitions of rise time, fall time, and duty cycle. From Practical RF circuit Design for Modern Wireless systems Vol1 – Les Besser and Rowan Gilmore

11 Digital detector output signal - eye diagram - shows the effect of random jitter. A large eye amplitude and small difference between bit window and eye duration are necessary for low bit error rate.

12 Height of the central eye opening measures noise margin in the received signal Width of the signal band at the corner of the eye measures the jitter Thickness of the signal line at the top and bottom of the eye is proportional to noise and distortion in the receiver output Transitions between the top and bottom of the eye show the rise and fall times of the signal The Eye One Bit Length Signal with Noise Good Sampling Period Noise Margin Jitter Noise Eye Pattern Analysis Reference: Handbook of Fiber Optics

13 After 40 inches through 406 A 10 Gbps signal at source After 40 inches through IS640 The effect of Laminate substrate on Signal integrity

14 Isola Products and Signal integrity in time domain Simulated Eye 5 Gbps -1 M -50 Ohms impedance 5 Mil Track width PRBS 35 PS Rise time At Source Zero Dielectric Loss IS640 Df =.004 IS620 DF=.008 FR408 DF=.012 FR4 Df =.020

15 High Speed Digital Drivers TrendsTrends Rising Bandwidths- Bandwidth Approx.=0.35/Rise timeRising Bandwidths- Bandwidth Approx.=0.35/Rise time Faster edge rates ----> 35 PS and lowerFaster edge rates ----> 35 PS and lower High Data rates 10 Gbps/ 4 Channels at GbpsHigh Data rates 10 Gbps/ 4 Channels at Gbps Longer Lines up to 1 M longLonger Lines up to 1 M long Narrower lines with higher conductor lossNarrower lines with higher conductor loss

16 Lossy transmission line Model Characterisitic impedance Zo = (R+JwL)/(G+JwC) R and G are not negligible

17 What is attenuation (loss)? 20 Log V out / V in = Loss in dB γ=α+ iβ Where α is the attenuation co-efficient and β is the phase related co-efficient The Voltage of a signal drops exponentially as the energy is absorbed in the dielectric medium, dissipated as conductor loss and radiated

18 Dielectric loss α Dieletric (in dB) approx =2.3 *f(In Ghz) *df* Dk

19 Conductor loss Wider lines are less lossier due to reduced skin effectWider lines are less lossier due to reduced skin effect A lower loss product like IS620 allows the designer to use thinner lines.A lower loss product like IS620 allows the designer to use thinner lines. α Conductor (in dB/inch) approx =36/(w(line width in mils)*Z 0 (impedance) )* f(In Ghz)

20 Effect of Conductor Roughness Surface roughness difference between 1 and 5 Microns = Dielectric loss tangent of –approx % of the dielectric loss

21 IS620 is the best in class product for dissipation factor

22 FR406 and IS415 are best in class - Loss close to Getek type products PCL 370 HR is the highest loss product in this category

23 Line Lengths and widths dictate the use of materialsLine Lengths and widths dictate the use of materials More & More Standard materials will be usedMore & More Standard materials will be used Focus on equalization technologiesFocus on equalization technologies Key factors will be the ability to predict accurately P.U.L characterisitcsKey factors will be the ability to predict accurately P.U.L characterisitcs While Dielectric losses dominate at higher speedsWhile Dielectric losses dominate at higher speeds Copper losses are not insignificant- Focus on Lower tooth profileCopper losses are not insignificant- Focus on Lower tooth profile Material Challenges

24 Isola Roadmap High Speed/High Frequency Enabling High Speed Digital Speeds beyond 10 Gbps Enabling High Speed Digital Speeds beyond 10 Gbps Low Dk / Df Solutions with Conventional Process Friendly Technologies Low Dk / Df Solutions with Conventional Process Friendly Technologies Flat Df Response vs. Frequency for Higher Signal Integrity Flat Df Response vs. Frequency for Higher Signal Integrity

25 Selection –High speed products Key design factors in selecting products for very high speed applications –Data rates Higher data rates require the use of Lower DF products –Faster Rise times Lower DF –Higher Frequency range or bandwidth Stable Dissipation factor over frequency and lower DF –Thinner packages Narrower Lines- Lower DK and Lower Dissipation factor –Large Backplanes Longer lines- Lower dissipation factors –Error correction- Predictable PUL properties Equalization- Pre emphasis –Reliability Higher CAF, Thermal Cycling and Lead free assembly compatibility –Cost –Extendibility and scalability Lower dissipation factor

26 Overview Lead free assembly Overview Thermal Analysis Thermal Resistance Thermal Cycling Resistance Isola Lead free product offering Product selection for Lead free assembly

27 Overview Restriction of Hazardous Substances Legislation bans the following Six substances for shipment to EU countries – effective July –Lead –Mercury –Hexavalent Chromium( Cr 6+ ) –Polybrominated biphenyl –Polybrominated diphenyl ether –Cadmium High End Networking companies exempt Max Conc. By Wt. < 0.1 % Max Conc. By Wt.< 0.01 %

28 Liquidus and Reflow Temperatures of Candidate Lead-Free Solder alloys for Replacing Eutectic Tin-Lead Solder Patented compositions; may require licensing or royalty agreements before use. **For more information see: Phase Diagrams & Computational Thermodynamics, Metallurgy Division of Materials Science and Engineering Laboratory, NIST.Phase Diagrams & Computational Thermodynamics, Metallurgy Division of Materials Science and Engineering Laboratory, NIST. Source : NIST Website

29 Candidate Alloys for Replacing Lead-Alloy Solders Table 3.1. Criteria for Down-Selection of Alloys Criteria for Down-Selection of Alloys Source : NIST Website

30 Thermal Resistance Drivers - Lead Free Legislation driven < 1000 PPM of lead. Lead Free Solders - Ternary alloys of Tin/Silver /Copper - Average reflow temperature Deg C higher

31

32

33 Lead Free Laminate Attributes Sn/Pb37 Reflow Lead Free ~Reflow

34

35 Thermal Analysis Overview

36 Overview DSC / TMA / DMA /TGA Isola ASL equipment Dual cell DSC with autosampler Dual Cell DSC Pressurized DSC/Dual cell DSC with autosampler TMA TGA DMA Test Method DSC –IPC-TM Glass Transition and Cure Factor by DSC TMA –IPC-TN Glass Transition and Z-axis Thermal Expansion by TMA

37 DSC: Differential Scanning Calorimetry Definitions DSC measures the temperatures and heat flows associated with transitions in materials as a function of time and temperature in a controlled atmosphere. These measurements provide quantitative and qualitative information about physical and chemical changes that involve endothermic and exothermic processes, or changes in heat capacity. A DSC measures the heat into or out of a sample relative to a reference while heating the sample and reference with a linear temperature ramp. Endothermic: Heat flows into the sample. Exothermic: Heat flows out of the sample. What is happening to the sample? As the sample is heated, it absorbs energy in order to change the temperature of the sample Energy units (W/g) Watts per gram of sample. Principle of Operation

38 Glass Transition A sample goes through the Glass Transition when the amorphous or not crosslinked areas change to (or from) a viscous or rubbery condition to (or from) a hard and relatively brittle condition This is a fully reversible change The glass transition takes place over a temperature range. The glass transition temperature (Tg) is a temperature chosen to represent the temperature range over which the glass transition takes place. NOTE: FIRST AND SECOND RUNS ARE DONE ON THE SAME PIECE OF SAMPLE Delta Tg = Tg(run 2) - Tg(run 1) What does a Delta Tg tell us? Degree of Cure of the Laminate or Printed Wiring Board Printed Wiring Board –All parts are cured equally

39 DSC:Interpretation Selection of TG – First derivativeSelection of TG – Half height -Isola Selection of Tg - Inflection

40 TMA – Thermo Mechanical Analysis TMA measures linear or volumetric changes in the dimensions of a sample as a function of time, temperature, and force in a controlled environment. As the sample is heated, the material expands according to its Coefficient of Thermal Expansion (CTE) Upon reaching its decomposition temperature (Td) delamination occurs TMA: Measurements –Glass Transition Temperature (Tg) –Temperature of Decomposition (Td) –Time to Decomposition at 260C (T-260) –Time to Decomposition at 288C (T-288) –Coefficient of Thermal Expansion (CTE) X, Y & Z Axis Below Tg, Above Tg & Overall ( C) Tg measurement Materials exhibit a dramatic increase in CTE as it goes through the Tg region. Measurement of the onset of the change determines the Tg Temperature at which delamination of the sample occurs Analysis can be obtained from 2nd scan Tg Decomposition temperature Measurement of onset of the dramatic change in probe position determines the Td Similar onset analysis to T-260 T-288

41 TMA TMA : Typical 1 St Run Chart TMA : Typical 2 nd Run chart

42 Sample time at temperature before delamination occurs Typical temperatures are 260C and 288C Sample is heated at 100C/min to the desired temperature and quickly equilibrated Sample is then held isothermally at the desired temperature until delamination occurs T-260(288) = Time(delam) - Time(temp equilib) TMA T-260 T-288 Method variations Other laboratories heat sample at 10C/min Side by side testing of 100C/min v 10C/min shows no measurable difference between the two methods TMA: T-260 & T-288 Typical TMA Decomp Curves

43 TGA Thermogravimetrical Analysis TGA measures the amount and rate of change in the weight of a material as a function of temperature or time in a controlled atmosphere. Instrument made up of extremely sensitive balance within a controlled atmosphere TGA: What is happening to the sample? As the sample is heated, volatiles escape causing a loss of weight in the sample. Upon decomposition, a dramatic weight change occurs. TGA Measurements Temperature at which x percent of weight is lost Decomposition Temperature (Td) TGA Typical Curve

44 DMA-Dynamic Mechanical Analysis The periodic application of stress and strain to the material as the temperature is varied. Measurement of the modulii of the material provides important physical information for the material as well as the Tg Storage modulus: Measurement of the materials ability to store energy Loss modulus: Measurement of the materials ability to dissipate energy Tan Delta: Ratio of the storage modulus to the loss modulus What is happening when the sample is being heated? While the sample is being heated, it is physically displaced from parallel by a set force, to a set amplitude at a set frequency The instrument measures the samples resistance to displacement and its ability to return to its original position. These properties change as the temperature of the sample is changed –Sample becomes more elastic as it goes through the glass transition range –If cross-linking is occurring during the temperature increase, the sample becomes more rigid. Measurements Glass Transition Temperature (Tg) Delta Tg Modulus information Two most common methods for selecting the glass transition temperature –Onset of the Storage Modulus –Peak of the Tan Delta

45 DMA: Transitions Broad TransitionTypical DMA curveIncreasing CureMultiple Transitions

46 Thermal Resistance and Lead-Free

47 Thermal Resistance- Drivers Drivers Process conditions Lead Free OEM reliability requirements. Failure mechanism - Matrix Decomposition and De-lamination

48 Laminate factors Td- Decomposition temperature of laminate measured by weight loss by TGA. Function of Resin Chemistry T-260,T Resistance to De-lamination at elevated temperatures. This follows a Power law. Function of Resin Chemistry and board design. Tg - Marginal effect Thermal Resistance - Laminate factors

49 Thermal Cycling Resistance

50 Drivers OEM reliability requirements due to harsh service conditions Failure mechanism - Mainly metal Fatigue Thermal Cycling Resistance-Drivers

51 Tests - Simulated tests such as IST – Electrically heating interconnects in cycles of 3 minutes and cooling HATS-Air to Air Liquid to liquid and other cycling tests Thermal Cycling Resistance -Tests

52 Laminate factors –CTE Z axis - Lower CTE reduces Stresses on the interconnect –Modulus in the Z-direction, Poisson ratio, Lower Modulus helps reduce the Stress. –Tg (TMA) - Higher Tg –Thermal resistance - Higher Thermal resistance avoids degradation during pre conditioning or actual process. May over ride other factors Thermal Cycling Resistance-Laminate Factors

53 Board design factors –Ductility of the copper - Higher is better –Thickness of the board –Hole diameter- Smaller holes and higher aspect ratio reduce cycles to failure. –Plating Thickness and quality Thermal Cycling Resistance-Fabrication Factors

54 Low Cycle fatigue Finite life Infinite life Reliability Roadmap - Thermal Cycling - Drivers Average thermal cycling conditions may not push copper into plastic range Higher strains during preconditioning IST change the failure mechanism

55 Thermal Cycling Resistance-Data presentation

56 Typical Stress Strain Curve Copper has a modulus = 17.6 E6 Psi and a Yield strength of 30Ksi which means it reaches its Yield point at < 0.2 % elongation or 35 Deg C excursion on a board

57 Cu Layer – Elastic/Plastic E Cu = 15.6x10 6 psi, y,Cu = 20,000 psi, CTE Cu =17x10 -6 / o C Composite Substrate – Linear Elastic E substrate =15 GPa, CTE substrate =80x10 -6 / o C (RT-180 o C), CTE substrate =320x10 -6 / o C ( o C) Material Properties of Cu Layer and Composite Substrate 21 o C 260 o C Time Temperature 150 o C Simulated Thermal Cycles

58 260 o C 21 o C 150 o C 21 o C Mises Stress (MPa) Stress/Strain (average) in Cu Layer Cyclic stress behavior in Cu layer during thermal cycling.

59 Cycle 1, 260 o C Cycle 1, 21 o C Mises Stress Analysis Stress in Cu is highest in the first thermal cycle and stabilizes in subsequent cycles. Cycle 6, 260 o CCycle 1, 21 o C

60 What attributes do we need for Thermal cycling resistance? Laminate factors –CTE Z axis - Lower CTE reduces Stresses on the interconnect –Modulus in the Z-direction, Poisson ratio, Lower Modulus helps reduce the Stress. –Tg (TMA) - Higher Tg –Thermal resistance - Higher Thermal resistance avoids degradation during pre conditioning or actual process. May over ride other factors Modeling results show that the Overall Expansion, CTE and Preconditioning are biggest factors governing the IST performance Isolas Low expansion and High TMA Tg products such as IS620,IS420,IS400 perform better on Thermal cycling IS400 IS410 DE117 FR408

61 Isola Roadmap Thermal Resistance Td and T-260/T-288 are key factors determining Thermal Resistance from a Laminate standpoint - Isolas response - IS410, IS415 and IS620.

62 Higher Decomposition temperature Higher than 340 Deg C Higher T-260 performance Higher than 60 minutes Higher T-288 performance Lower overall Z axis expansion Less than 3.5 % Low Wt loss at elevated temperature (Lower vols.) What attributes do we need in a lead free product?

63 Precondition: 6x - 260C; PTH; MLB Thickness Acceptable service life *Based on Published papers and discussions with fabs and OEMs High Performance Very High performance Very High Thermal strains

64 Isola Lead Free Compatible Laminate Product Offering

65 Isola Product Technology Roadmap Isola Lead Free, FR4 Replacement Product Solutions Isola High Speed, Signal Integrity Product Solutions Reliability Overview of Isola Test Capabilities Isola Technology Agenda

66 Lead-free solderable IS410 + Low CTE IS400 Phenolic epoxy Tg 180C CAF resistant CTE – 3.5 % amb – 288 C Td – 350C T288 > 15 min UL Approved Phenolic cured, filled Tg 150C CAF resistant CTE – 3.00 % amb – 288 C Td – 330C T288 > 5 min UL Approved IS420 Phenolic cured, filled Tg 170C CAF resistant CTE– 2.80 % amb -288 C Td – 340C T288 > 15 min UL approved + Low Df IS415 Non-dicy, Non phenolic Tg 190C CAF resistant CTE – 2.90 % amb C Td – 370C T288 > 20 min UL approved Applications : 6 x solder float, lead-free soldering Applications : Severe thermal cycling, lead-free soldering Applications : High data rate; Severe TCT, lead-free solder, Isola Thermal Reliability Products

67 Isola Product Ad

68 Isola Lead Free Compatible Products

69 IS400

70 Features -Better Thermal Reliability With Non-dicy Cured Chemistry -Excellent Z-axis Thermal Expansion -Excellent Solder Heat Resistance & Low Moisture Absorption -Higher Tg 150 o C (DSC) Than Standard Epoxies -Standard FR-4 Epoxy Processing -UV Blocking & AOI Compatible Applications - Computers, Servers, Workstations, Telecommunications, Consumer Electronics & Automotives IS400 Product Strengths

71 * For 0.71mm (0.028 Laminate, 38% Weight Resin Content ItemFR402IS400 Tg ( o C) DSC TMA DMA 140 ± ± ± ± ± 5 Z-axis CTE (ppm/ o C) Room Temp to Tg Tg to 288 o C Room Temp to 288 o C Solder o C (sec)> 60> 180 Decomposition Temp ( o C, TGA) Time to Delamination (min, TMA) T288 T > 60 IS400 Laminate Thermal Properties

72 Thickness :0.028 PropertyUnitCondition IS400 FR402 Peel Strength (1oz) Flexural Strength Length Cross Volume Resistivity Surface Resistivity Dielectric Constant (500MHz) Dissipation Factor (500MHz) Water Absorption Solder o C Glass Transition Temp. (DSC) Flammability lb/in psi.cm - % sec o C - A C-96/35/90 C-24/23/50 D-24/23 A UL94 6~ ~ ~ x10 14 ~ 5x x10 13 ~ 1x ~ ~0.18 > V-0 9~ ~ ~ x10 14 ~ 5x x10 13 ~ 1x ~ ~0.20 > ~145 V-0 IS400 Laminate Physical Properties

73 Result Pass Result Pass Test condition TCT (-40 o C to +125 o C) 15 min/10 sec/15 min for 200 cycles, then microsection and E-testing. Sample 8L MLB Test condition TCT (-40 o C to +125 o C) 15 min/10 sec/15 min for 200 cycles, then microsection and E-testing. Sample 8L MLB Current State No delam, copper crack, resin recession been found. IS400 Thermal Reliability Testing

74 IS410

75 IS420 Thermal Performance T260/ Decomp./IST Electrical Performance Loss /DK FR406 High Tg 170° Epoxy FR406 High Tg 170° Epoxy IS ° Tg IS ° Tg FR Tg Low Dk & Df FR Tg Low Dk & Df IS620 Tg 215 Low Ghz Laminate IS620 Tg 215 Low Ghz Laminate IS640 Next Generation Low Loss-.005 IS640 Next Generation Low Loss-.005 P Tg Polyimide V0/V1 P Tg Polyimide V0/V1 G200 BT Epoxy Laminate G200 BT Epoxy Laminate P Tg Polyimide HB P Tg Polyimide HB Telecom High Reliability - Lead Free High Speed Digital / Base stations/Routers/Servers/Burn in Military/Computers/drilling Gbps * Gbps * Low Freq and speed * Speeds a function of design such as line length etc. T Mins/Td.300* * T Mins/Td.350* * High Speed /High Frequency Gbps* T Mins/Td.400* * **Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes. IS Tg IS Tg IS500 Halogen Free 180 Tg IS500 Halogen Free 180 Tg

76 High Tg FR4 (180°C TMA) Enhanced thermal stability High Decomposition Temperature (350°C) Superior PTH reliability due to very low z-axis CTE Unique resin chemistry contributes to CAF Resistance Lead-Free Compatible PCB substrate (6x peak 260°C reflow) Un-filled resin matrix enhances Hi-pot resistance on thin cores Enhanced drilling performance on high aspect ratio holes Low Cost of ownership Wide market acceptance and North American and Asia Pacific manufacturing IS410 Product Strengths

77 As a substitute for Std. FR4 requiring lead-free performance As an improvement over FR4 materials by achieving CAF resistance An alternative to filled phenolic resin systems that are more susceptible to insulation resistance failures IS410 Product Positioning

78 PropertyUnitsFR406IS410G200FR408IS620 Tg, (DSC)ºC Td, (TGA)ºC CTE x-axis (amb - Tg)ppm/ºC y-axis (amb - Tg)ppm/ºC z-axis (amb - 288C)%4.4 %3.5 % 2.8 % Solder Float, 288Csec>220>500>1200>500> 800 T-260, (TMA)min10>6020>60 T-288, (TMA)min<1>15820>15 Material Tested: 0.008, 44% Resin % IS410 Laminate Thermal Properties

79 > lb/inPeels, 1 oz volt/milElectrical Strength 94 V-0 -Flammability.15* 0.14*0.20* %Moisture Absorption Units GPYFR-4 UL Recognition DF, 2 GHz N/A DF, 1 MHz DK, 2 GHz N/A DK, 1MHz IS620FR408G200IS410FR406Property Material Tested: 50% Resin Content *Material Tested: 0.008, 44% Resin % IS410 Laminate Physical Properties

80 IS410 vs. High Tg FR4 Immersion Silver Finish; 100 V Bias; 25 Coupons Spacing - PTH to PTH Failure % B1 = 11 mil diagonal spacing B2 = 15 mil diagonal spacing B3 = 20 mil diagonal spacing B4 = 25 mil diagonal spacing IS410 CAF Test Results

81 Mean Time to Failure (MTTF) = 325 cycles IS410 IST (9.8 mil PTH)

82 IS410 Dk Matrix

83 IS410 Df Matrix

84 FR406IS410IS415 Scaling See Scaling Table in Process Guide Same as FR406Similar to FR408 Oxide Multiple options availableSame as FR406Same as FR406/8 Lamination ROR = F/min Cure = 360F (60 min) Pressure = psi ROR = F/min Cure = 375F (50 min) Pressure = psi ROR = F/min Cure = 375F (90 min) Pressure = psi Drilling See Drilling Table in Process Guide Same as FR406, longer drill life Same as FR406 longer drill life Desmear Chemical Desmear (single pass) Same as FR406Similar to FR408 (double pass cyclic amine) IS410 Processing Cross Reference

85 IS415 Next Generation in Thermally Reliable Laminate and Prepreg

86 IS420 Thermal Performance T260/ Decomp./IST Electrical Performance Loss /DK FR406 High Tg 170° Epoxy FR406 High Tg 170° Epoxy IS ° Tg IS ° Tg FR Tg Low Dk & Df FR Tg Low Dk & Df IS620 Tg 215 Low Ghz Laminate IS620 Tg 215 Low Ghz Laminate IS640 Next Generation Low Loss-.005 IS640 Next Generation Low Loss-.005 P Tg Polyimide V0/V1 P Tg Polyimide V0/V1 G200 BT Epoxy Laminate G200 BT Epoxy Laminate P Tg Polyimide HB P Tg Polyimide HB Telecom High Reliability - Lead Free High Speed Digital / Base stations/Routers/Servers/Burn in Military/Computers/drilling Gbps * Gbps * Low Freq and speed * Speeds a function of design such as line length etc. T Mins/Td.300* * T Mins/Td.350* * High Speed /High Frequency Gbps* T Mins/Td.400* * **Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes. IS Tg IS Tg IS500 Halogen Free 180 Tg IS500 Halogen Free 180 Tg

87 Superior PTH reliability due to very low z-axis CTE Very high Tg (200°C by TMA) compared to FR4 (160ºC by TMA) Non-phenolic based resin system Very high decomposition temperature (375°C) suitable for Pb-free assembly Dielectric constant comparable to Std High Tg FR4 Dissipation factor comparable to Std High Tg FR4 (20% lower than phenolic resin systems) Low cost of ownership relative to modified epoxy systems with Mid- Dk, mid-Df performance IS415 Product Strengths

88 The only low cost, non-phenolic, lead free substrate in the market As a substitute for Std. FR4 requiring lead-free performance without sacrificing electrical performance An improvement over phenolic-based FR4 materials by providing lower loss comparable to Std FR4 materials An alternative to filled phenolic resin systems that are more susceptible to insulation resistance failures IS415 Product Positioning

89 PropertyUnitsFR406IS410IS415P95 Tg, (DSC)ºC * Td, (TGA)ºC CTE α 1, z-axis (amb - Tg) ppm/ºC Solder Float, 288Csec>220>500>1000>1200 T-260, (TMA)min10>60 T-288, (TMA)min<1>10>20>60 Dk (2 GHz) Df (2 GHz) Isola Material Tested: 0.008, 44% Resin Content IS415 Laminate Thermal Properties

90 IS415 Tg by TMA 196C (Better Thermal Performance) IS415 Laminate Thermal Properties

91 IS415 Dk Matrix

92 IS415 Df Matrix

93 FR406 and IS415 are best in class - Loss close to Getek type products PCL 370 HR is the highest loss product in this category IS415 Attenuation Comparison

94 FR406IS410IS415 Scaling See Scaling Table in Process Guide Same as FR406Similar to FR408 Oxide Multiple options availableSame as FR406Same as FR406/8 Lamination ROR = F/min Cure = 360F (60 min) Pressure = psi ROR = F/min Cure = 375F (50 min) Pressure = psi ROR = F/min Cure = 375F (90 min) Pressure = psi Drilling See Drilling Table in Process Guide Same as FR406, longer drill life Same as FR406 longer drill life Desmear Chemical Desmear (single pass) Same as FR406Similar to FR408 (double pass cyclic amine) IS415 Processing Cross Reference

95 IS500

96 IS420 Thermal Performance T260/ Decomp./IST Electrical Performance Loss /DK FR406 High Tg 170° Epoxy FR406 High Tg 170° Epoxy IS ° Tg IS ° Tg FR Tg Low Dk & Df FR Tg Low Dk & Df IS620 Tg 215 Low Ghz Laminate IS620 Tg 215 Low Ghz Laminate IS640 Next Generation Low Loss-.005 IS640 Next Generation Low Loss-.005 P Tg Polyimide V0/V1 P Tg Polyimide V0/V1 G200 BT Epoxy Laminate G200 BT Epoxy Laminate P Tg Polyimide HB P Tg Polyimide HB Telecom High Reliability - Lead Free High Speed Digital / Base stations/Routers/Servers/Burn in Military/Computers/drilling Gbps * Gbps * Low Freq and speed * Speeds a function of design such as line length etc. T Mins/Td.300* * T Mins/Td.350* * High Speed /High Frequency Gbps* T Mins/Td.400* * **Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes. IS Tg IS Tg IS500 Halogen Free 180 Tg IS500 Halogen Free 180 Tg

97 High Tg (180°C) Halogen-Free PCB substrate Superior Dk across frequency ( ) closely matching High Tg FR4 Loss Tangent comparable to High Tg FR4 ( ) Very Low z-axis CTE (2.3%), as compared to Std FR4 (4%) Superior Thermal Reliability, capable of meeting lead-free requirements (T 260 and T 288 >60 minutes) Low moisture absorption (0.2%) Very high copper peel strength 8 lb/in. (1.4KN/m) after thermal stress Global product availability (N. America, Europe, Asia) by early 2005 IS500 Product Strengths

98 Competitive Products: Hitachi E-67G(H), Hitachi E-679FG, Polyclad PCL-HF-571F, Nelco D1049 (beta) Superior Dk relative to all currently available Halogen-Free substrates (3.8 vs ) Globally manufactured High Tg, Halogen Free PCB Substrate Low z-axis CTE, ideal for IST critical applications 40% higher peel strengths than competitive materials Significant Cost Advantage IS500 Product Positioning

99 T G DSC - 180°C TMA - 170°C DMA - 210°C CTE (z-axis, RT °C):< T G : ppm/°C > T G : 180 ppm/°C T 260 (TMA):> 60 min T 288 (TMA):> 60 min T D (TGA):400°C Thermal stress tests: Solder 288°C > 5 minutes: passed 10x °C: passed High Pressure Cooker Test: passed (30 min + solder dip °C) IS500 Thermal Characteristics

100 Flammability:V-0 Moisture uptake: (D24/23)0.12 % 10 GHz: GHz: Alkali Resistance:passed (D24/125, 20 70°C 20 in 10 % NaOH) CTI (Comparative Tracking Index)300 ColorDark Yellow Peel Strength> 7.0 lb/in. (1.4KN/m) IS500 Physical Characteristics

101 IS500 – Dk matrix

102 IS500 - Df matrix

103 FR406 and IS415 are best in class - Loss close to Getek type products PCL 370 HR is the highest loss product in this category IS500 Attenuation Comparison

104 FR406IS410IS500 Scaling See Scaling Table in Process Guide Same as FR406Currently using FR406 scaling factors (additional characterization reqd) Oxide Multiple options availableSame as FR406Same as FR406/8 Lamination ROR = F/min Cure = 360F (60 min) Pressure = psi ROR = F/min Cure = 375F (50 min) Pressure = psi ROR = F/min Cure = 390F (90 min) Pressure = 300 psi Drilling See Drilling Table in Process Guide Same as FR406, longer drill life See Drilling table in following slides Desmear Chemical Desmear (single pass) Same as FR406Similar to FR408 (double pass cyclic amine) IS500 Processing Cross Reference

105 Isola Product Technology Roadmap Isola Lead Free, FR4 Replacement Product Solutions Isola High Speed, Signal Integrity Product Solutions Reliability Overview of Isola Test Capabilities Isola Technology Agenda

106 FR408

107 IS420 Thermal Performance T260/ Decomp./IST Electrical Performance Loss /DK FR406 High Tg 170° Epoxy FR406 High Tg 170° Epoxy IS ° Tg IS ° Tg FR Tg Low Dk & Df FR Tg Low Dk & Df IS620 Tg 215 Low Ghz Laminate IS620 Tg 215 Low Ghz Laminate IS640 Next Generation Low Loss-.005 IS640 Next Generation Low Loss-.005 P Tg Polyimide V0/V1 P Tg Polyimide V0/V1 G200 BT Epoxy Laminate G200 BT Epoxy Laminate P Tg Polyimide HB P Tg Polyimide HB Telecom High Reliability - Lead Free High Speed Digital / Base stations/Routers/Servers/Burn in Military/Computers/drilling Gbps * Gbps * Low Freq and speed * Speeds a function of design such as line length etc. T Mins/Td.300* * T Mins/Td.350* * High Speed /High Frequency Gbps* T Mins/Td.400* * **Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes. IS Tg IS Tg IS500 Halogen Free 180 Tg IS500 Halogen Free 180 Tg

108 Positioning FR408 is a high performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications. As an improvement over Std. FR4, FR408 offers improved electrical properties as well as Pb-Free compatibility. As an alternative to PPO resin systems, FR408 offers lower signal loss improving electrical performance. As an alternative to PPO resin systems, FR408 offers a 33% lower CTE improving PTH reliability As an alternative to modified epoxy systems with Cyanate Ester, FR408 offers better fracture toughness making it the product of choice for high density designs and CAF resistance Value Proposition High thermal performance Tg of 180°C by DSC Very high decomposition temperature, Td of 360°C by TGA suitable for Pb-Free assembly Improved Dielectric Properties (Dk 3.3 – 3.8; Df ) Superior Processing, closest to conventional FR-4 as compared to all high speed materials FR408 Positioning and Value Proposition

109 PropertyUnitsFR406IS410G200FR408IS620 Tg, (DSC)ºC Td, (TGA)ºC CTE x-axis (amb - Tg)ppm/ºC y-axis (amb - Tg)ppm/ºC z-axis (amb - 288C)ppm/ºC Solder Float, 288Csec>220>500>1200>500> 800 T-260, (TMA)min10>6020>60 T-288, (TMA)min<1>10820>15 Material Tested: 0.008, 44% Resin % FR408 Laminate Thermal Properties

110 Material Tested: 50% Resin Content *Material Tested: 0.008, 44% Resin Content FR408 Laminate Physical Properties

111 FR408 Dk matrix

112 FR408 Df matrix

113 IS620

114 IS420 Thermal Performance T260/ Decomp./IST Electrical Performance Loss /DK FR406 High Tg 170° Epoxy FR406 High Tg 170° Epoxy IS ° Tg IS ° Tg FR Tg Low Dk & Df FR Tg Low Dk & Df IS620 Tg 215 Low Ghz Laminate IS620 Tg 215 Low Ghz Laminate IS640 Next Generation Low Loss-.005 IS640 Next Generation Low Loss-.005 P Tg Polyimide V0/V1 P Tg Polyimide V0/V1 G200 BT Epoxy Laminate G200 BT Epoxy Laminate P Tg Polyimide HB P Tg Polyimide HB Telecom High Reliability - Lead Free High Speed Digital / Base stations/Routers/Servers/Burn in Military/Computers/drilling Gbps * Gbps * Low Freq and speed * Speeds a function of design such as line length etc. T Mins/Td.300* * T Mins/Td.350* * High Speed /High Frequency Gbps* T Mins/Td.400* * **Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes. IS Tg IS Tg IS500 Halogen Free 180 Tg IS500 Halogen Free 180 Tg

115 IS620 Ad

116 Superior Electrical Performance - The Loss With IS620 is Lower at Higher Frequencies and Stays Stable, the Response With APPE is Not Stable and it Increases With Frequency IS620 is a Thermoset Resin, Unlike APPE Resins Which Are Thermoplastic Blends. The APPE Resin Conforms While IS620 Flows IS620 Does Not Use Special Glass and is Therefore Available in Standard Sizes and is Not Subject to the Supply Issues The Cost of Ownership vs. Performance is Very Favorable With IS620 Superior PTH reliability due to very low z-axis CTE The Only Lead-Free Compatible Product in its Class IS620 Product Strengths

117 Appropriate for High Speed Digital applications up to 5 Gbps As a performance upgrade replacement for Nelco N Product due to its ease of processing and superior thermal and electrical attributes at a slightly lower cost of ownership As a substitute for Nelco N SI Products due to its ease of processing, availability and lower cost of ownership As a replacement for APPE resin systems due to its much lower cost of ownership and availability As a replacement for Rogers 4350 in the lower to mid end designs due to its stable electrical performance at a substantially reduced cost As a substitute for G-200/BT applications due to its better thermal and electrical performance at similar cost As the lead-free low loss product IS620 Product Positioning

118 PropertyUnitsFR406G200IS415IS500IS620IS640 Tg, (DSC)ºC Td, (TGA)ºC CTE x-axis (amb - Tg)ppm/º C y-axis (amb - Tg)ppm/º C z-axis (amb - 288C) %4.4%3.5%2.9%2.8% 3.6% Solder Float, 288Csec>220>1200 TBD>800TBD T-260, (TMA)min1020>60 T-288, (TMA)min<18>20>15 >10 Material Tested: 0.008, 44% Resin % IS620 Laminate Thermal Properties

119 PropertyUnitsFR406G200IS415IS500IS620IS640 Dk, 2 GHz Dk, 10 GHz Df, 2 GHz <.0045 Df, 10 GHz <.0045 Electrical StrengthV/mil > TBD Peels, 1ozlbs./in.87>6.3 >5.5 Flammability94V-0 Moisture Absorption % * UL RecognitionFR-4 TBDGPYNon ANSI *Material Tested: 0.030(5-2116), 52% Resin % IS620 Laminate Physical Properties

120 IS620 Dk Matrix

121 IS640 Df matrix

122 12 Inch Trace 8 Inch Trace IS620 vs. Modified Epoxy Special Glass

123 Data courtesy Northrup Grumman IS620 Attenuation 16 Transmission Line

124 IS620 is the best in class product for dissipation factor IS620 Attenuation Comparison

125 a) Time Domain Reflectometry Figure a shows a TDR measurement of the impedance profile of a 1m conductor in layer HF 1. For comparison purposes TDR results of conductors in a board made from IS 620 and R04350 are confronted. The difference of the impedance course can be basically attributed to 2 reasons: 1. Inevitable different geometrical dimensions (line width, height of chamber etc.) of the two boards 2. Different dielectric figures for both materials Due to different dielectric figures of different types of material there are varying delays of electrical signals. Also these delays can be taken from TDR measurements. The difference in time of the scarped flanks at the end of the effective range marks the double difference in delay (feed and return run of signal) of electrical signals. IS620 TDR Measurements - Siemens

126 TDR measurements allow a very precise determination of running time differences and thereof the differences of dielectric figures. However, in order to identify damping characteristics, gauging in the frequency range are more suitable. In order to do so scattering parameters S21 (transmisson damping) of both materials are compared. Figure b shows that there are no differences in damping features of both materials in a range of up to 15GHz. As a result of this it can be said that both materials hold nearly the same dissipation factors tan b) Frequency Domain IS620 S 21 Measurements - Siemens

127 IS620 Lead Free Assembly Testing

128 IS620 Pb-Free Simulation – NEMI Parameters

129 IS620 Lead-Free Assembly – European Customer A

130 IS620 Lead-Free Assembly – European Customer B

131 Plated-Thru Holes after 8x Reflow Process

132 Samples of the finished test cards were sent to Isola for thermal analysis prior to reflow simulation. The results shown support the claim that the IS620 would perform as expected in the reflow simulation. Additional, samples were submitted to the Isola R&D lab after 8 reflow passes. Before Reflow Simulation After Reflow Simulation CTE before Tg61.2 ppm/ C C CTE after Tg259.0 ppm/ C C CTE after Tg786.0 ppm/ C C Overall CTE155.9 ppm/ C C TGA350 C 349 C DSC Tg Cleave A C Delta 1 C DSC Tg Cleave B C Delta 1 C Peak Tan Delta171 C and 269 C T-260 by TMA60 minutes + 60 minutes+ T-288 by TMA2.8, 2.9, 3.0, 3.7 minutes Weight Loss %0.4% to 260 C 0.4% to 260 C IS620 Thermal Analysis (before and after 8x Reflow Simulation)

133 IS620 Lead Free is getting great traction in the market and we are already seeing a strong Ramp up. It is now the only Lead Free product in its Class IS620 Lead-Free Assembly Summary Feedback from the Market IS620 Passes Lead-Free Assembly Testing 7x at Merix IS620 Passes Lead-Free Assembly Testing 6x at PPC Positive Results at all customers to date Finished Board thermal analysis demonstrates T260 greater than 60 minutes Finished Board decomposition temperature greater than 350 C Joint Press-Release with Merix on Lead-Free Compatibility

134 Isola Processing Cross Reference FR408IS620IS640 Scaling 30% greater in Grain Similar to FR408 in Fill Currently evaluating* (using IS620 factors) Oxide Same as FR406/8 Lamination ROR = F/min Cure = 375F (90 min) Pressure = psi 40 min soak – 200F ROR = 4 F/min Cure = 390F (120 min) Pressure = psi ROR = F/min Cure = 390F (150 min) Pressure = psi Drilling Similar to N or N SI Similar to R4350 F&S Drill life substantially better than R4350 Desmear Double Pass Desmear Plasma Desmear Similar to FR408 (prefer Plasma Desmear) Similar to FR406

135 Next Generation Low Loss IS640

136 IS640 Ad

137 IS420 Thermal Performance T260/ Decomp./IST Electrical Performance Loss /DK FR406 High Tg 170° Epoxy FR406 High Tg 170° Epoxy IS ° Tg IS ° Tg FR Tg Low Dk & Df FR Tg Low Dk & Df IS620 Tg 215 Low Ghz Laminate IS620 Tg 215 Low Ghz Laminate IS640 Next Generation Low Loss-.005 IS640 Next Generation Low Loss-.005 P Tg Polyimide V0/V1 P Tg Polyimide V0/V1 G200 BT Epoxy Laminate G200 BT Epoxy Laminate P Tg Polyimide HB P Tg Polyimide HB Telecom High Reliability - Lead Free High Speed Digital / Base stations/Routers/Servers/Burn in Military/Computers/drilling Gbps * Gbps * Low Freq and speed * Speeds a function of design such as line length etc. T Mins/Td.300* * T Mins/Td.350* * High Speed /High Frequency Gbps* T Mins/Td.400* * **Laminate Data- IST performance is a function of Hole dia/board thickness,plating parameters and laminate attributes. IS Tg IS Tg IS500 Halogen Free 180 Tg IS500 Halogen Free 180 Tg

138 IS640 Product Strengths Superior Signal Integrity - flat Df from 2 to 15 GHz Stable Dielectric Constant from 2 to 15 GHz Customized Dk for different applications (ie.3.0, 3.20, 3.25, 3.38, 3.45) Utilizes Standard E-Glass Standard Thicknesses Available Tack-free prepreg for ease in handling Superior Drilling performance Conventional FR-4 processing Compatible with Isola IS410, FR406 & FR408 Lower Cost of Ownership

139 Applicable for RF Microwave/High-Speed Digital Market (5+ Gbps) Capable of meeting lead-free requirements IS640 prepreg is non-tacky, unlike Rogers 4350 Significant Cost Advantage Rogers 4350 has 60% ceramic filler in the resin, more difficult drilling IS640 Product Positioning

140 Electrical PropertiesValues 2 GHz GHz GHz GHz GHz GHz Mechanical PropertiesValues Peel Strength - after thermal stress4 lbs/in (1/2 oz)RT Flammability94 V-0 T- 260 > 60 minutes Tg - DSC220 Degrees C *All tests run on with 52 % retained resin % Electrical properties tested by Bereskin Stripline Method IS640 Material Properties

141 55 % RESIN IS640 Stripline Dk Comparison

142 55 % RESIN IS640 Stripline Df Comparison

143 IS640 Dk matrix – High Speed Digtal Electrical test data by Bereskin Stripline Method at ambient temp. Tg tested by DSC Td tested by onset

144 IS640 Df matrix – High Speed Digital Electrical Data tested by Bereskin Stripline Method at ambient temp. Tg – tested by DSC Td – tested by onset

145 IS640 RF/ Microwave – 3.45 and 3.38 Dk Tested per IPC TM

146 IS640 Rf/ Microwave Df matrix– 3.45 and 3.38 Dk Tested per IPC TM

147 IS640 RF/ Microwave – 3.25 & 3.20 Dk Tested per IPC TM

148 IS640 RF/ Microwave Df matrix – 3.25 & 3.20 Dk Tested per IPC TM

149 IS640 RF/ Microwave Dk Tested per IPC TM

150 Isola Processing Cross Reference FR408IS620IS640 Scaling 30% greater in Grain Similar to FR408 in Fill Currently evaluating* (using IS620 factors) Oxide Same as FR406/8 Lamination ROR = F/min Cure = 375F (90 min) Pressure = psi 40 min soak – 200F ROR = 4 F/min Cure = 390F (120 min) Pressure = psi ROR = F/min Cure = 390F (150 min) Pressure = psi Drilling Similar to N or N SI Similar to R4350 F&S Drill life substantially better than R4350 Desmear Double Pass Desmear Plasma Desmear Similar to FR408 (prefer Plasma Desmear) Similar to FR406

151 Isola Product Technology Roadmap Isola Lead Free, FR4 Replacement Product Solutions Isola High Speed, Signal Integrity Product Solutions Reliability Overview of Isola Test Capabilities Isola Technology Agenda

152 PWB Reliability Test Methods Interconnect Stress Testing (IST)

153 IST is an accelerated stress test method Creates uniform strain from within substrate DC current is used to heat the PTH barrels and forced convection cooling to cycle PTH Technique identifies and assesses the severity of post separation and barrel cracks Interconnect Stress Testing (IST)

154 Test Method Comparison

155 Failure defined as resistance degradation IST Data Analysis

156 Benefits of Weibull Analysis method Accounts for infant mortality Requires few data points to fit data Attributes of Weibull Distribution - Good Fit of data: Shape parameter (slope) > 3 - Number of cycles at 1% failure > 75 cycles - MTTF (Mean Time to Failure) is a meaningful summary of data IST Weibull Analysis

157 PWB Reliability Test Methods Hi-Pot Testing

158 Hi-Pot testing is analogous to high voltage testing Determine the state of the materials electrical insulation Synonymous terms: Voltage withstanding test Dielectric strength testing Insulation breakdown testing Technique to test the insulation resistance of materials ZBC used in buried distributive capacitance applications Reference: Buried Capacitance and thin laminates Hi-Potential Testing (Hi-Pot)

159 PWB Reliability Test Methods Conductive Anodic Filament (CAF) Failure

160 CAF formation was first reported in 1976, but field failures were identified later in the 1980s Electrochemical failure Growth of copper containing filament along epoxy-glass interface Bell Laboratories investigated mechanism of CAF formation Physical degradation of glass/epoxy bond Moisture absorption occurs under high humidity conditions An electrochemical pathway develops and electrochemical corrosion occurs Water acts as electrolyte, the copper circuitry becomes the anode and cathode, and the operating voltages acts as the driving potential Conductive Anodic Filament (CAF)

161 CAF Pathways

162 Sun Microsystems Test Board 10 Layer Board,.050 Single Ply 2116 Construction All Layers, B and C-Stage D1 D2 A1 A2 A3 A4 B1 B2 B3 B4 C1 C2 C3 C4 A1 - A4 = Hole to Hole In Line with Glass B1 - B4 = Hole to Hole Diagonal to Glass C1 - C4 = Hole to Plane Clearance (antipad) D1 & D2 = Plane to Plane CAF Test Vehicle

163 PWB Reliability Test Methods Registration

164 Registration error composed of several different sources Types: Offset error, Compensation error, angle error, random noise Offset error Related to tooling processes Punch, pinning, and drilling Compensation error Related to scaling artwork Material movement or artwork movement Angle error Related to a rotational misalignment Post-etch punch machines that are miscalibrated Random noise Registration Summary

165 References 1.Ready, W. Jud, Turbini, Laura J., Conductive Anodic Filament Failure: A Material Perspective 2.Biunno, Nicholas, Schroeder, Greg, Buried Capacitance and Thin Laminates. 3.PCB reliability testing with Interconnect Stress Test. 4.McQuarrie, Wm. Gray, Control of Key Registration Variables for Improved Process Yields on Dense MLBs.

166 Isola Product Technology Roadmap Isola Lead Free, FR4 Replacement Product Solutions Isola High Speed, Signal Integrity Product Solutions Reliability Overview of Isola Test Capabilities Isola Technology

167 Isola Laboratory Capabilities

168 Thermal Analysis –Differential Scanning Calorimetry (DSC) Tg, delta Tg –Thermomechanical Analysis (TMA) X, Y, Z- CTE, Tg, T-260, T- 288 –Dynamic Mechanical Analysis (DMA) Tg, Modulus –4 Camera CTE (X and Y) –Rheometer Gel Window, Minimum Viscosity Microscopy –Scanning Electron Microscopy (SEM) –Energy Dispersive Spectroscopy (EDS) –Optical Microscopy (Microsectioning including thermal stress) –Fourier-Transform Infrared Spectroscopy (FTIR) –Coulometric Titration (Moisture Content) IPC-4101A Qualification and Conformance Testing Isola Analytical lab Capabilities

169 Electrical Testing –Dielectric Constant/ Dissipation Factor 1 MHz (Two Fluid) 100 MHz to 1.5 GHz (HP 4291A) 1 GHz to 20 GHz (Bereskin Method) Network Analyzer and full signal integrity bench –Electric Strength –Hi-Pot –Arc Resistance –Insulation Resistance –Conductive Anodic Filament (CAF) Physical Testing –Dimensional Stability 4 Camera System –Peel Strength –UL Flammability –Oxygen Index –Flexural Strength –Compressive Strength –Bond Strength –Shear Strength –Warp and Twist –Surface Profilometry Isola Analytical Lab Capabilities

170 Agilent PNA/PLTS Signal Integrity Bench

171 Signal Integrity with Eye Diagrams

172 Mechanical Analysis

173 Scanning Electron Microscopy (SEM)

174 Development Methodology Modeling Large IP Portfolio and Large Data base of Research Strong Development and Process Technology group Neat Resin characterization and modeling Infrastructure Pilot manufacturing facilities Best in class Analytical Labs Global footprint with Regional Centers of excellence Investment in new Technology Focus on cost effective technologies Isolas new Technologies based on unique formulas using components vs. prepackaged value priced Technologies from Vendors Leading Technology Player Isola Competitive Advantage – Product Technology


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