Presentation is loading. Please wait.

Presentation is loading. Please wait.

1 COMPANY PROFILE COMPANY PROFILE Location: Factory Site 14,900m 2 / 160 kSF 4,500 Employee 165 persons 1 65 15 min From International Airport Taoyuan.

Similar presentations


Presentation on theme: "1 COMPANY PROFILE COMPANY PROFILE Location: Factory Site 14,900m 2 / 160 kSF 4,500 Employee 165 persons 1 65 15 min From International Airport Taoyuan."— Presentation transcript:

1 1 COMPANY PROFILE COMPANY PROFILE Location: Factory Site 14,900m 2 / 160 kSF 4,500 Employee 165 persons min From International Airport Taoyuan Country

2 2 COMPANY PROFILE COMPANY PROFILE Established Dec, Start Operation Jul, ISO-9001 Certified Sep, 2000 ISO Mass-Lam Startup Apr, 2004 Mass-Lam Emerging Market Jul, TS16949 Certified : Mar, 2011(FST) TS16949 : IS14000 Certified : Jun, 2011(FST) IS14000 : OTC Stock Marking : May, 2011(FST) OTC :

3 3 COMPANY PROFILE COMPANY PROFILE Sales Revenue 2004: US 38M 2004 : : US 46M 2005 : : US 52M 2006 : : US 43M 2007 : : US 31M 2008 : : US 28M 2009 : : US $ 50M 2010 : 15 (FST) SR ( ) including CCL and Mass-Lam

4 4 Sales Revenue CCL + MASS-LAMCCL

5 5 PRODUCTS ( FR-4 ) ( FR-4 ) FR-4 Laminates & Prepregs Di-functional ( ) Tetra-functional ( ) High Performance ( )

6 6 PRODUCTS ( MC-CCL ) ( MC-CCL ) Thermal Conductive RCC (TCR) ( Resin- Coated Copper ) Thermal Conductive Prepreg ( TCP ) ( With glass fiber ) Thermal Conductive Film ( TCC ) ( With glass fiber ) Thermal Thin Core ( TTC ) - for mass-lam use.

7 7 Product Application( ) 5C Computer ( ) PC, Note Book Communication ( ) Cellular, Internet Consumer ( ) DVD, PS, X-Box Car ( ) Inst Panel, Controller / Others ( ) Instrument, Calculator, Controller PRODUCTION PRODUCTION

8 8 (KOREA) (USA) (CHINA) (EUC)/ (MIDDLE EAST) (Others) SALES COVERAGE

9 9 MANUFACTURING PROCESS MANUFACTURING PROCESS

10 10 PRODUCTION EQUIPMENT(1) ( ) Features Drying by IR radiant combined with hot air Advantages Ensure uniform and stable prepreg properties TAKUMA - VERTICAL TREATER / Takuma

11 11 PRODUCTION EQUIPMENT(2) ( ) AIKI AUTOMATED LAY-UP LINE / FeaturesSandwich type lay-up line in clean room Advantages Ensure laminate surface quality

12 12 PRODUCTION EQUIPMENT(3) ( ) KITAGAWA VACUUM PRESS / Features Vacuum assisted and hot / cold transfer system Advantages Ensure even thickness and consistent dimensional stability

13 13 FINAL INSPECTION & AUTO PACKING(4) ( ) FINAL INSPECTION AUTO PACKING

14 14 AUTOMATED STORAGE & RETRIEVING SYSTEM(5) ( ) Makers : Features Integration of AS/RS and MIS System Advantages Ensure warehouse efficiency

15 15 CAPACITY CAPACITY -- CCL 240 K sheets / month 24 / -- P/P 1,250 K m / month 125 / -- MC-CCL : 200 K panel / month LED - : 20 / ( 510 x 610 mm )

16 16 PRODUCT OFFERING PRODUCT OFFERING - CCL Copper H oz ~ 6.0 oz Thickness 3 Mil ~ 197 Mil (0.08 mm) (5.0 mm) - P/P 1080 / 2116 / 7628 / 7629 / 7630 / MC-CCL : Copper 1 oz ~ 6 oz Insulating Thickness 2 mil ~ 10 mil 50 μ m ~ 250 μ m Al-Base Thickness : 0.6 / 1.0 / 1.5 mm K : 1.5 / 2.0 / 3.0 / 6.0 W / m K

17 17 SUMMARY OF FR-4 PRODUCT FR-4 SUMMARY OF FR-4 PRODUCT FR Tg C Size 7628:1250mmx150M 1080:1250mmx300M 2116:1250mmx250M 1506:1250mmx150M Tetrafunctional Epoxy Prepreg Multifunctional Epoxy Prepreg Tetrafunctional Epoxy Prepreg Yellow SM-730B SM-730B (150Tg) SM-750B(170Tg) SM-750B(180Tg) SM-560B Multifunctional Epoxy Laminate,UV Block, AOI Fluorescence Capability, High Tg Yellow Tetrafunctional Epoxy Laminate, UV Block, AOI Fluorescence Capability Thickness ~ (0.08mm~5.0mm) Yellow SM-730R,M SM-730R,M (150Tg) GENERAL SPECIFICATION DESCRIPTIONS COLORPRODUCT UL File No.E SM-750R,M (170Tg) SM-750R,M (180Tg) SM-560 Size inch (mm) 36.8x48.8 (935x1240) 40.8x48.8 (1036x1240) 42.8x48.8 (1087x1240) Copper Cladding 0.5oz ~ 6.0oz (0.018mm~0.204mm) Yellow Tetrafunctional Epoxy Laminate, UV Block, AOI Fluorescence Capability,Halogen -free Normal LF HF Normal LF HF CCL PP B/S Size Maximum: 37*49 41*49 43*49

18 Product FR-4 Roadmap Lead free process compatibility Normal FR-4 (Dicy) High Thermal reliability (PN) Green HF Laminate 1)SM )SM730-E 3)SM )SM )SM )SM )SM )SM560-5 High CTI(>600volts) Laminate 9)SM560-C 10)SM630-4 Special Laminate Cost advantage Under developing Updated FR-4 11) High Perf.Tg180(SM780-8) 12) Fast Cure(SM750-T) 13) Low Dk/Df (SM780-LK) 14) Anti-Migration (SM750-CAF) 15) Phosphate & Halogen Free (SM560-PHF)

19 19 Tg 140 Normal FR-4 Rigid Laminate Tg 140 Normal FR-4 Rigid Laminate Tg 145 Normal FR-4 Multifunctional Tg 150 Normal FR-4 Multifunctional Tg 150 Normal FR-4 Multifunctional Tg 180 Thermal Reliable Laminate Tg 180 Thermal Reliable Laminate Low z-CTE Tg 180 High Reliability Laminate Low z-CTE Tg 180 High Reliability Laminate for Double Side Rigid Board Performance SM730-4 Application SM730-E for Low to Medium Layer Count Multilayer for Medium to High Layer Count Multilayer for High Layer Count Dimensional Stable(IT180 comp) for Thermal Reliable IC Substrate & Telecom PWB VS(IT180A/370-HR comp) SM730-5 SM750-8 SM780-8 HI CTI >600VTg 140 Laminate HI CTI >600VTg 140 Laminate Tg 170 Multifunctional Tg 170 Multifunctional for High Layer Count & Low flow applications(IS-410 comp) SM750-M for D/S & Rigid Board Tg 150 Halogen Free Laminate Tg 150 Halogen Free Laminate for D/S & multiplayer(IT140/NPGN-150R comp) Tg 140 Halogen Free Laminate Tg 140 Halogen Free Laminate for D/S & Multilayer SM560-4 SM560-5 HI CTI >600V+Halogen Free Tg 140 Laminate HI CTI >600V+Halogen Free Tg 140 Laminate SM560-C Product Offerings High Thermal reliability Updated 2010/10/10 L L H H SM630-4

20 20 Metal-CCL TCC Metal-CCL TCC PROPERTYTCC-A18TCC-A22TEST METHOD Dielectric thickness ( um )80 +/- 5 Size ( mm )510 x 610 mm Peeling strength ( kg/cm )>= 1.0 IPC-TM Solder dip test ( 288 o C, 30sec )Pass IPC-TM Chemical resistancePass IPC-TM Flammability ( UL )94V-0 UL-94 Surface resistance ( ohm )> IPC-TM Volume resistance ( ohm-cm )> IPC-TM Breakdown voltage ( AC, V/mil )1,000 IPC-TM Glass transition temp ( o C )120 IPC-TM Thermal conductivity ( W/mK )1.82.2ASTM-D5470

21 21 Metal-CCL TCC Metal-CCL TCC PROPERTYTCC-A15TCC-A20TEST METHOD Dielectric thickness ( um )80 +/- 5 Size ( mm )510 x 610 mm Peeling strength ( kg/cm )>= 1.0 IPC-TM Solder dip test ( 288 o C, 30sec )Pass IPC-TM Chemical resistancePass IPC-TM Flammability ( UL )94V-0 UL-94 Surface resistance ( ohm )> IPC-TM Volume resistance ( ohm-cm )> IPC-TM Breakdown voltage ( AC, V/mil )1,000 IPC-TM Glass transition temp ( o C )120 IPC-TM Thermal conductivity ( W/mK )1.52.0ASTM-D5470

22 22 Metal-CCL TCP Metal-CCL TCP PROPERTYTCP-A20TCP-A10TEST METHOD Dielectric thickness ( um )70 +/- 5 Size ( mm )510 x 610 mm Peeling strength ( kg/cm )>= 1.0 IPC-TM Solder dip test ( 288 o C, 30sec )Pass IPC-TM Chemical resistancePass IPC-TM Flammability ( UL )94V-0 UL-94 Surface resistance ( ohm )> IPC-TM Volume resistance ( ohm-cm )> IPC-TM Breakdown voltage ( AC, V/mil )1,000 IPC-TM Glass transition temp ( o C )120 IPC-TM Thermal conductivity ( W/mK )2.01.5ASTM-D5470

23 23 LABORATORY EQUIPMENT(1) ( ) Thermal Mechanical Analyzer (TMA) / DSC / TGA - Tg & CTE & Td: Digital Viscometer - Prepreg Rheology Monitor X.Y.Z.-Axis 3D Measuring Instrument 3D - Dimensional Stability Isothermal chamber (85°C/ 85RH) Simulator / HT ( High Temp) Furnaces /

24 24 LABORATORY EQUIPMENT(2) ( ) LCR Meter - Dielectric Constant & Electrical Measurement Universal Tester - Mechanical Properties Measurement Lab Test - Chemical Analysis

25 25 LABORATORY EQUIPMENT(3) ( ) Puncture / Insulation Tester - Dielectric Breakdown Voltage,ac TIM Tester TIM Tester -Thermal Resistance and Thermal Conductivity -Thermal Resistance and Thermal Conductivity (K- ) Tracking Resistance Tester - CTI

26 26 LABORATORY EQUIPMENT (4) ( ) Differential Scanning Calorimeter (DSC) - Tg Thermo-gravimetric Analysis (TGA) - Td Metallurgical Microscope - Micro-section

27 27 OUR COMMITMENTS OUR COMMITMENTS We are a customer-oriented company, demonstrating mutual respect and trust to customers and growing through continuous innovation.

28 28 QUALITY POLICY / QUALITY POLICY / We satisfy customers via training our employees to drive for excellence and continuously improving our internal process.

29 29

30 30 ShineMore

31 31 10% 10% 10 (1.1) = % 10% 10 (0.9) = ? ~


Download ppt "1 COMPANY PROFILE COMPANY PROFILE Location: Factory Site 14,900m 2 / 160 kSF 4,500 Employee 165 persons 1 65 15 min From International Airport Taoyuan."

Similar presentations


Ads by Google