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IPC/JEDEC INDUSTRY MAPPING
Agenda Item 6.2 4th JIC meeting Regensburg, Germany June 17, 2003
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Minimum IPC Standards Tool Kit
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IPC STANDARDS MAP
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IPC STANDARDS MAP (cont.)
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ASSEMBLY J-STD-001 IPC-HDBK-001 IPC-9261 IPC-7912
Soldering Electrical and Electronic Assemblies IPC-HDBK-001 Handbook & Guide to Supplement J-STD-001 IPC-9261 In-Process DPMO and Estimated Yield for PWAs IPC-7912 Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies
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ACCEPTANCE IPC-DRM-40 IPC-A-610 IPC-9191 IPC-DRM-SMT
Through-Hole Solder Joint Evaluation Desk Reference Manual IPC-A-610 Acceptability of Electronic Assemblies IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) IPC-DRM-SMT Surface Mount Solder Joint Evaluation Desk Reference Manual
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SOLDERABILITY IPC-WP-001 J-STD-002 J-STD-003 IPC-WP-005 IPC-TR-461
Soldering Capability White Paper Report J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires J-STD-003 Solderability Tests for Printed Boards IPC-WP-005 PWB Surface Finishes IPC-TR-461 Solderability Evaluation of Thick & Thin Fused Coatings IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-Term Storage
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SOLDERABILITY (cont.) IPC-TR-464
Accelerated Aging for Solderability Evaluations IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase 11A IPC-TR-466 Wetting Balance Standard Weight Comparison Test
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ADVANCED IPC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology IPC-WP-003 Chip Mounting Technology J-STD-012 Implementation of Flip Chip and Chip Scale Technology J-STD-013 Implementation of Ball Grid Array & Other High Density Technology J-STD-026 Semiconductor Design Standard for Flip Chip Applications J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation IPC-MC-790 Guidelines for Multichip Module Technology Utilization
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WIRE HARNESS IPC-WHMA-A-620
Requirements & Acceptance for Cable & Wire Harness Assemblies
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OPTOELECTRONICS IPC-0040 Optoelectronic Assembly and Packaging Technology
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ASSEMBLY SUPPORT SMC-WP-002 IPC-DRM-18 IPC-DW-426 IPC-TR-581
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires IPC-DRM-18 Component Identification Desk Reference Manual IPC-DW-426 Specification for Assembly of Discrete Wiring IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC-TA-722 Technology Assessment Handbook on Soldering IPC-TA-723 Technology Assessment Handbook on Surface Mounting IPC-CM-770 Component Mounting Guidelines for Printed Boards
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ASSEMBLY SUPPORT(cont.)
IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments IPC-S-816 SMT Process Guideline & Checklist IPC-AJ-820 Assembly & Joining Handbook IPC-TP-1115 Selection and Implementation Strategy for A Low-Residue No-Clean Process IPC-1720 Assembly Qualification Profile
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ASSEMBLY SUPPORT(cont.)
IPC-7095 Design and Assembly Process Implementation for BGA's IPC-7525 Stencil Design Guidelines IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes IPC-7711 Rework of Electronic Assemblies IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments IPC-9851 Equipment Interface Specification
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ASSEMBLY MATERIALS FLUX/SOLDER J-STD-004 J-STD-005 J-STD-006
Requirements for Soldering Fluxes J-STD-005 Requirements for Soldering Pastes J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders IPC-TP-1043 IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1 IPC-TP-1044 IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2
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ASSEMBLY MATERIALS (cont.)
ADHESIVES IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives IPC-CA-821 General Requirements for Thermally Conductive Adhesives IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films
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ASSEMBLY MATERIALS (cont.)
COAT/MASK IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies IPC-HDBK-830 Guidelines for Design, Selection and Application of Conformal Coatings IPC-SM-840 Qualification and Performance of Permanent Solder Mask
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PCB / ACCEPTANCE IPC-DW-425A IPC-QE-605 IPC-TF-870 IPC-MC-960 IPC-1710
Design and End Product Requirements for Discrete Wiring Boards IPC-QE-605 Printed Board Quality Evaluation Handbook IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards IPC-MC-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards IPC-1710 OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP)
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PCB / ACCEPTANCE (cont.)
IPC-6011 Generic Performance Specification for Printed Boards IPC-6012 Qualification and Performance Specification for Rigid Printed Boards IPC-6013 Qualification & Performance Specification for Flexible Printed Boards IPC-6015 Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards IPC-6018 Microwave End Product Board Inspection and Test
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PCB / ACCEPTANCE (cont.)
IPC/JPCA-6202 Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA-6801 Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards IPC-A-600 Acceptability of Printed Boards
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COMPONENTS J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices J-STD-032 Performance Standard for Ball Grid Array Balls J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
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COMPONENTS (cont.) IPC-9501 IPC-9502 IPC-9503 IPC-9504
PWB Assembly Process Simulation for Evaluation of Electronic Components IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components IPC-9503 Moisture Sensitivity Classification for Non-IC Components IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
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CLEANING/ CLEANLINESS
IPC-SC-60 Post Solder Solvent Cleaning Handbook IPC-SA-61 Post Solder Semi-Aqueous Cleaning Handbook IPC-AC-62 Aqueous Post Solder Cleaning Handbook IPC-CH-65 Guidelines for Cleaning of Printed Boards & Assemblies IPC-TR-468 Factors Affecting Insulation Resistance Performance of Printed Boards IPC-TR-476 Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
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CLEANING/ CLEANLINESS (cont.)
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC-TR-582 Cleaning & Cleanliness Test Program for: Phase 3-Low Solids Fluxes & Pastes Processed in Ambient Air IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines IPC-9201 Surface Insulation Resistance Handbook
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LAMINATE FLEX IPC-FC-234 IPC-4202 IPC-4203 IPC-4204 IPC-4552
PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
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LAMINATE (cont.) RIGID IPC-4101 IPC-4103 IPC-1730 HDI IPC-DD-135
Specifications for Base Materials for Rigid and Multilayer Printed Boards IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications IPC-1730 Laminator Qualification Profile HDI IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials IPC-SM-840 Qualification and Performance of Permanent Solder Mask
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LAMINATE (cont.) IPC-CF-148 IPC-CF-152 IPC-1731 IPC-4562 FOIL
Resin Coated Metal for Printed Boards IPC-CF-152 Composite Metallic Materials Specification for Printed Wiring Boards IPC-1731 Strategic Raw Materials Supplier Qualification Profile IPC-4562 Metal Foil for Printed Wiring Applications
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FABRICATION IPC-DR-570 IPC-DR-572 IPC-OI-645 IPC-TA-724 IPC-PE-740
General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards IPC-DR-572 Drilling Guidelines for Printed Boards IPC-OI-645 Standard for Visual Optical Inspection Aids IPC-TA-724 Technology Assessment Series on Clean Rooms IPC-PE-740 Troubleshooting for Printed Board Manufacture and Assembly
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REINFORCEMENT IPC-4412 IPC-SG-141 IPC-A-142 IPC-QF-143 IPC-1731
Specification for Finished Fabric Woven from "E" Glass for Printed Boards IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards IPC-1731 Strategic Raw Materials Supplier Qualification Profile
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REINFORCEMENT (cont.) IPC-4110 IPC-4121 IPC-4130 IPC-4411
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass Mat IPC-4411 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement
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ASSEMBLY IPC-D-279 IPC-D-326 IPC-C-406 IPC-C-408 IPC-SM-782
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies IPC-D-326 Information Requirements for Manufacturing Electronic Assemblies IPC-C-406 Design & Application Guidelines for Surface Mount Applications Connectors IPC-C-408 Design & Application Guidelines for the Use of Solderless Surface Mount Connectors IPC-SM-782 Surface Mount Design & Land Pattern Standard
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INTERFACES IPC-D-310 IPC-A-311 IPC-D-350 IPC-D-351 IPC-D-356 IPC-D-390
Guidelines for Phototool Generation and Measurement Techniques IPC-A-311 Process Controls for Phototool Generation and Use IPC-D-350 Printed Board Description in Digital Form IPC-D-351 Printed Board Drawings in Digital Form IPC-D-356 Bare Substrate Electrical Test Data Format IPC-D-390 Automated Design Guidelines
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INTERFACES IPC-2511 IPC-2531 IPC-2541 IPC-2571
Generic Requirements for Implementation of Product Mfg. Description Data & Transfer Methodology IPC-2531 Standard Recipe File Format Specification IPC-2541 Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX) IPC-2571 Generic Requirements for Electronics Mfg. Supply Chain Communication - Product Data eXchange (PDX)
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PCB SMC-WP-004 IPC-2252 IPC-D-317 IPC-D-859 IPC-1902 IPC-2141
Design for Success IPC-2252 Design Guide for RF/Microwave Circuit Boards IPC-D-317 Design Guidelines for Electronic Packaging Utilizing High Speed Techniques IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits IPC-1902 Grid Systems for Printed Circuits IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design
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PCB (cont.) IPC-2221 IPC-2222 IPC-2223 IPC-2224 IPC-2225 IPC-2315
Generic Standard on Printed Board Design IPC-2222 Sectional Standard on Rigid Organic Printed Boards IPC-2223 Sectional Design Standard for Flexible Printed Boards IPC-2224 Sectional Standard of Design of PWB for PC Cards IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies IPC-2315 Design Guide for High Density Interconnects & Microvias IPC-2615 Printed Board Dimensions and Tolerances
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JEDEC: IEC PAS ACTIVITY
EIA/JESD22-B102C 47/1446/PAS IEC Ed. 1: Solderability test method JESD22-B106-B 47/1447/PAS: IEC , Ed. 1: Resistance to soldering temperature for through-hole mounted devices EIA/JESD-22-B107-A 47/1448/PAS: IEC 62175, Ed. 1: Marking Permanency 47/1629/MCR: Published as part of IEC , Ed. 1 EIA/JESD22-B116 47/1449/PAS: IEC 62176, Ed. 1: Wire bond shear test method 47/1482A/RVD Withdrawal of 47/1449/PAS
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JEDEC: IEC PAS ACTIVITY
JESD22-A110B-B 47/1450/PAS: IEC 62177, Ed. 1: Highly-accelerated temperature and humidity stress test (HAST) 47/1627/MCR Published as part of IEC , Ed. 1 JESD22-A104-A 47/1451/PAS: IEC 62178, Ed. 1: Temperature cycling EIA/JESD22-A114-A 47/1452/PAS: IEC 62179, Ed. 1: Electrostatic discharge (ESD) sensitivity testing human body model (HBM) EIA/JESD22-A115-A 47/1453/PAS: IEC 62180, Ed. 1: Electrostatic discharge (ESD) sensitivity testing machine model (MM)
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JEDEC: IEC PAS ACTIVITY
JESD78 47/1454/PAS: IEC 62181, Ed. 1: IC latch-up test JESD22-A113-B 47/1455/PAS: IEC 62182, Ed. 1: Preconditioning of nonhermetic surface mount devices prior to reliability testing JESD22-A107-A 47/1456/PAS: IEC 62183, Ed. 1: Salt atmosphere 47/1633/MCR: Published as part of IEC , Ed. 1 JESD22-B105-B 47/1457/PAS: IEC 62184, Ed. 1: Lead integrity
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JEDEC: IEC PAS ACTIVITY
JESD22-A106-A 47/1458/PAS: IEC 62185, Ed. 1: Thermal shock 47/1631/MCR: Published as part of IEC , Ed. 1 JESD22-B104-A 47/1459/PAS: IEC 62186, Ed. 1: Mechanical shock 47/1630/MCR: Published as part of IEC Ed. 1 JESD22-B103-A 47/1460/PAS: IEC 62187, Ed. 1: A vibration, variable frequency 47/1632/MCR: Published as part of IEC , Ed. 1 JESD22-A101-B 47/1461/PAS: IEC 62161, Ed.1: Test method A101-B – Steady state temperature humidity bias life test 47/1680/MCR: Published as IEC , Ed. 1
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JEDEC: IEC PAS ACTIVITY
JESD22-C101 47/1462/PAS: IEC , Ed. 1: Test method C101 – Electrostatic Discharge (ESD) Sensitivity Testing – Charged device model (CDM) JESD22-B101 47/1463/PAS: IEC 62163, Ed. 1: Test method B101 – External Visual 47/1626/MCR: Published as part of IEC , Ed. 1 JEP118 47/1464/PAS: IEC 62164, Ed. 1: Guidelines for GaAs MMIC and FET life testing JEP110 47/1465/PAS: IEC 62165, Ed. 1: Guidelines for the measurement of thermal resistance of GaAs FETs EIA/JESD46-A 47/1466/PAS: IEC 62166, Ed. 1: Guidelines for user notification of product/process changes by semiconductor suppliers
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JEDEC: IEC PAS ACTIVITY
EIA/JESD48 47/1467/PAS: IEC 62167, Ed. 1: Product discontinuance JEP 113-B 47/1468/PAS: IEC 62168, Ed. 1: Symbols and labels for moisture-sensitive devices IPC/JEDEC J-STD-033 47/1469/PAS: IEC 62169, Ed. 1: Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices EIA/JESD59 47/1470/PAS: IEC 62170, Ed. 1: Bond wire modeling standard JEP114 47/1471/PAS: IEC 62171, Ed. 1: Guidelines for particle impact noise detection (PIND) testing, operator training and certification 47/1681/MCR: Published as , Ed. 1
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JEDEC: IEC PAS ACTIVITY
JESD22-A102-B 47/1472/PAS: IEC 62172, Ed. 1: Accelerated moisture resistance – Unbiased autoclave JESD22-A108-A 47/1474/PAS: IEC 62189, Ed. 1: Bias Life J-STD-020A (IPC/JEDEC) 47/1475/PAS: IEC 62190, Ed. 1: Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices 47/1592/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 ( ) and IEC 60749, Ed. 2.2 ( ). J-STD-035 47/1476/PAS: IEC 62191, Ed. 1: Acoustic microscopy for nonhermetic encapsulated electronic components 47/1593/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 ( ) and by IEC 60749, Ed. 2.2 ( )
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JEDEC: IEC PAS ACTIVITY
JEP119 47/1506/PAS: IEC 62201, Ed. 1: A procedure for executing sweat EIA/JEP122 47/1507/PAS: IEC 62202, Ed. 1: Failure mechanisms and models for silicon semiconductor devices EIA/JEP128 47/1508/PAS: IEC 62203, Ed. 1: Guide for standard probe pad sizes and layouts for wafer-level electrical testing EIA/JESD33-A 47/1509/PAS: IEC 62204, Ed. 1: Measuring and using the temperature coefficient of resistance to determine the temperature of a metallization line JESD-A103-A 47/1513/PAS: IEC Ed. 1: High temperature storage life 47/1628/MCR: Published as part of IEC , Ed. 1
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JEDEC: IEC PAS ACTIVITY
EIA/JESD22-A105-B 47/1514/PAS: IEC 62206, Ed. 1: Test Method A105-B – Power and temperature cycling JESD22-A109 47/1515/PAS: IEC 62207, Ed. 1: Test Method A109 – Hermeticity 47/1594/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 ( ) and by IEC 60749, Ed. 2.2 ( ) JESD22-A120 47/1595/PAS: IEC 62307 Test Method for the Measurement of Moisture Diffusivity and Water Solubility in organic Materials Used in Integrated Circuits JESD22-A118 47/1635/PAS: IEC PAS 62336: Accelerated Moisture Resistance – Unbiased HAST
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IPC: IEC PAS ACTIVITY IPC-EIA/J-STD-012 IPC-EIA/J-STD-013 IPC-2511
Flip chip and chip scale technology implementation IPC-EIA/J-STD-013 IEC/PAS 62085 Implementation of ball grid array and other high density technology IPC-2511 IEC/PAS 62119 Generic requirements for implementation of product manufacturing description data and transfer methodology IPC-6202 IEC/PAS Ed. 1.0 Performance guide Manual for single- and double-sided flexible printed wiring boards IPC-4130 IEC/PAS 62212 Specification and characterization methods for nonwoven "E" glass mat
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IPC: IEC PAS ACTIVITY IPC-4411 IPC-6011 IPC-1710 IPC-1720
Specification and characterization methods for nonwoven para-aramid reinforcement IPC-6011 IEC/PAS 62214 Generic performance specification for printed boards IPC-1710 IEC/PAS Ed. 1.0 Manufacturers qualification profile (MQP) IPC-1720 IEC/PAS Ed. 1.0 Assembly qualification profile (AQP)
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IPC: IEC PAS ACTIVITY IPC-1730 IPC-6013 (with amendment)
IEC/PAS Ed. 1.0 Laminator qualification profile IPC-6013 (with amendment) IEC/PAS /ED, 1,9 Qualification and performance specification for flexible printed boards IPC-6012 (with amendment) IEC/PAS 62250 Qualification and performance specification for rigid printed boards
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