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IPC/JEDEC INDUSTRY MAPPING Agenda Item 6.2 4th JIC meeting Regensburg, Germany June 17, 2003.

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Presentation on theme: "IPC/JEDEC INDUSTRY MAPPING Agenda Item 6.2 4th JIC meeting Regensburg, Germany June 17, 2003."— Presentation transcript:

1 IPC/JEDEC INDUSTRY MAPPING Agenda Item 6.2 4th JIC meeting Regensburg, Germany June 17, 2003

2 Minimum IPC Standards Tool Kit

3 IPC STANDARDS MAP

4 IPC STANDARDS MAP (cont.)

5 ASSEMBLY J-STD-001 Soldering Electrical and Electronic Assemblies IPC-HDBK-001 Handbook & Guide to Supplement J-STD-001 IPC-9261 In-Process DPMO and Estimated Yield for PWAs IPC-7912 Calculation of DPMO & Manufacturing Indices for Printed Board Assemblies

6 ACCEPTANCE IPC-DRM-40 Through-Hole Solder Joint Evaluation Desk Reference Manual IPC-A-610 Acceptability of Electronic Assemblies IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) IPC-DRM-SMT Surface Mount Solder Joint Evaluation Desk Reference Manual

7 SOLDERABILITY IPC-WP-001 Soldering Capability White Paper Report J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires J-STD-003 Solderability Tests for Printed Boards IPC-WP-005 PWB Surface Finishes IPC-TR-461 Solderability Evaluation of Thick & Thin Fused Coatings IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long-Term Storage

8 SOLDERABILITY (cont.) IPC-TR-464 Accelerated Aging for Solderability Evaluations IPC-TR Round Robin Test on Steam Ager Temperature Control Stability IPC-TR The Effect of Steam Aging Time and Temperature on Solderability Test Results IPC-TR Evaluation of Steam Aging on Alternative Finishes, Phase 11A IPC-TR-466 Wetting Balance Standard Weight Comparison Test

9 ADVANCED IPC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology IPC-WP-003 Chip Mounting Technology J-STD-012 Implementation of Flip Chip and Chip Scale Technology J-STD-013 Implementation of Ball Grid Array & Other High Density Technology J-STD-026 Semiconductor Design Standard for Flip Chip Applications J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation IPC-MC-790 Guidelines for Multichip Module Technology Utilization

10 WIRE HARNESS IPC-WHMA-A-620 Requirements & Acceptance for Cable & Wire Harness Assemblies

11 OPTOELECTRONICS IPC-0040 Optoelectronic Assembly and Packaging Technology

12 ASSEMBLY SUPPORT SMC-WP-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires IPC-DRM-18 Component Identification Desk Reference Manual IPC-DW-426 Specification for Assembly of Discrete Wiring IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC-TA-722 Technology Assessment Handbook on Soldering IPC-TA-723 Technology Assessment Handbook on Surface Mounting IPC-CM-770 Component Mounting Guidelines for Printed Boards

13 ASSEMBLY SUPPORT(cont.) IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting IPC-SM-785 Guidelines for Accelerated Reliability Testing of Surface Mount Attachments IPC-S-816 SMT Process Guideline & Checklist IPC-AJ-820 Assembly & Joining Handbook IPC-TP-1115 Selection and Implementation Strategy for A Low-Residue No- Clean Process IPC-1720 Assembly Qualification Profile

14 ASSEMBLY SUPPORT(cont.) IPC-7095 Design and Assembly Process Implementation for BGA's IPC-7525 Stencil Design Guidelines IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes IPC-7711 Rework of Electronic Assemblies IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments IPC-9851 Equipment Interface Specification

15 ASSEMBLY MATERIALS J-STD-004 Requirements for Soldering Fluxes J-STD-005 Requirements for Soldering Pastes J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders IPC-TP-1043 IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1 IPC-TP-1044 IPC Cleaning and Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2 FLUX/SOLDER

16 ASSEMBLY MATERIALS (cont.) ADHESIVES IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives IPC-CA-821 General Requirements for Thermally Conductive Adhesives IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives IPC-3408 General Requirements for Anisotropically Conductive Adhesives Films

17 ASSEMBLY MATERIALS (cont.) IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies IPC-HDBK-830 Guidelines for Design, Selection and Application of Conformal Coatings IPC-SM-840 Qualification and Performance of Permanent Solder Mask COAT/MASK

18 PCB / ACCEPTANCE IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards IPC-QE-605 Printed Board Quality Evaluation Handbook IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards IPC-MC-960 Qualification and Performance Specification for Mass Lamination Panels for Multilayer Printed Boards IPC-1710 OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP)

19 PCB / ACCEPTANCE (cont.) IPC-6011 Generic Performance Specification for Printed Boards IPC-6012 Qualification and Performance Specification for Rigid Printed Boards IPC-6013 Qualification & Performance Specification for Flexible Printed Boards IPC-6015 Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures IPC-6016 Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards IPC-6018 Microwave End Product Board Inspection and Test

20 PCB / ACCEPTANCE (cont.) IPC/JPCA-6202 Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards IPC/JPCA-6801 Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC) IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards IPC-A-600 Acceptability of Printed Boards

21 COMPONENTS J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices J-STD-032 Performance Standard for Ball Grid Array Balls J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

22 COMPONENTS (cont.) IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components IPC-9502 PWB Assembly Soldering Process Guideline for Electronic Components IPC-9503 Moisture Sensitivity Classification for Non-IC Components IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)

23 CLEANING/ CLEANLINESS IPC-SC-60 Post Solder Solvent Cleaning Handbook IPC-SA-61 Post Solder Semi-Aqueous Cleaning Handbook IPC-AC-62 Aqueous Post Solder Cleaning Handbook IPC-CH-65 Guidelines for Cleaning of Printed Boards & Assemblies IPC-TR-468 Factors Affecting Insulation Resistance Performance of Printed Boards IPC-TR-476 Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

24 CLEANING/ CLEANLINESS (cont.) IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results IPC-TR-581 IPC Phase III Controlled Atmosphere Soldering Study IPC-TR-582 Cleaning & Cleanliness Test Program for: Phase 3-Low Solids Fluxes & Pastes Processed in Ambient Air IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing IPC-SM-839 Pre & Post Solder Mask Application Cleaning Guidelines IPC-9201 Surface Insulation Resistance Handbook

25 LAMINATE IPC-FC-234 PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Circuitry IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards FLEX

26 LAMINATE (cont.) RIGID IPC-4101 Specifications for Base Materials for Rigid and Multilayer Printed Boards IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications IPC-1730 Laminator Qualification Profile HDI IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules IPC-4104 Specification for High Density Interconnect (HDI) and Microvia Materials IPC-SM-840 Qualification and Performance of Permanent Solder Mask

27 LAMINATE (cont.) IPC-CF-148 Resin Coated Metal for Printed Boards IPC-CF-152IPC-CF-152 Composite Metallic Materials Specification for Printed Wiring Boards IPC-1731 Strategic Raw Materials Supplier Qualification Profile IPC-4562 Metal Foil for Printed Wiring Applications FOIL

28 FABRICATION IPC-DR-570 General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards IPC-DR-572 Drilling Guidelines for Printed Boards IPC-OI-645 Standard for Visual Optical Inspection Aids IPC-TA-724 Technology Assessment Series on Clean Rooms IPC-PE-740 Troubleshooting for Printed Board Manufacture and Assembly

29 REINFORCEMENT IPC-4412 Specification for Finished Fabric Woven from "E" Glass for Printed Boards IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards IPC-1731 Strategic Raw Materials Supplier Qualification Profile

30 REINFORCEMENT (cont.) IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass Mat IPC-4411 Specification and Characterization Methods for Non-Woven Para- Aramid Reinforcement

31 ASSEMBLY IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies IPC-D-326 Information Requirements for Manufacturing Electronic Assemblies IPC-C-406 Design & Application Guidelines for Surface Mount Applications Connectors IPC-C-408 Design & Application Guidelines for the Use of Solderless Surface Mount Connectors IPC-SM-782 Surface Mount Design & Land Pattern Standard

32 INTERFACES IPC-D-310 Guidelines for Phototool Generation and Measurement Techniques IPC-A-311 Process Controls for Phototool Generation and Use IPC-D-350 Printed Board Description in Digital Form IPC-D-351 Printed Board Drawings in Digital Form IPC-D-356 Bare Substrate Electrical Test Data Format IPC-D-390 Automated Design Guidelines

33 INTERFACES IPC-2511 Generic Requirements for Implementation of Product Mfg. Description Data & Transfer Methodology IPC-2531 Standard Recipe File Format Specification IPC-2541 Generic Requirements for Electronics Manufacturing Shop Floor Equipment Communication (CAMX) IPC-2571 Generic Requirements for Electronics Mfg. Supply Chain Communication - Product Data eXchange (PDX)

34 PCB SMC-WP-004 Design for Success IPC-2252 Design Guide for RF/Microwave Circuit Boards IPC-D-317 Design Guidelines for Electronic Packaging Utilizing High Speed Techniques IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits IPC-1902 Grid Systems for Printed Circuits IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design

35 PCB (cont.) IPC-2221 Generic Standard on Printed Board Design IPC-2222 Sectional Standard on Rigid Organic Printed Boards IPC-2223 Sectional Design Standard for Flexible Printed Boards IPC-2224 Sectional Standard of Design of PWB for PC Cards IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies IPC-2315 Design Guide for High Density Interconnects & Microvias IPC-2615 Printed Board Dimensions and Tolerances

36 JEDEC: IEC PAS ACTIVITY EIA/JESD22-B102C –47/1446/PAS IEC Ed. 1: –Solderability test method JESD22-B106-B –47/1447/PAS: IEC , Ed. 1: –Resistance to soldering temperature for through-hole mounted devices EIA/JESD-22-B107-A –47/1448/PAS: IEC 62175, Ed. 1: –Marking Permanency –47/1629/MCR: Published as part of IEC , Ed. 1 EIA/JESD22-B116 –47/1449/PAS: IEC 62176, Ed. 1: –Wire bond shear test method –47/1482A/RVD Withdrawal of 47/1449/PAS

37 JEDEC: IEC PAS ACTIVITY JESD22-A110B-B –47/1450/PAS: IEC 62177, Ed. 1: –Highly-accelerated temperature and humidity stress test (HAST) –47/1627/MCR Published as part of IEC , Ed. 1 JESD22-A104-A –47/1451/PAS: IEC 62178, Ed. 1: –Temperature cycling EIA/JESD22-A114-A –47/1452/PAS: IEC 62179, Ed. 1: –Electrostatic discharge (ESD) sensitivity testing human body model (HBM) EIA/JESD22-A115-A –47/1453/PAS: IEC 62180, Ed. 1: –Electrostatic discharge (ESD) sensitivity testing machine model (MM)

38 JEDEC: IEC PAS ACTIVITY JESD78 –47/1454/PAS: IEC 62181, Ed. 1: –IC latch-up test JESD22-A113-B –47/1455/PAS: IEC 62182, Ed. 1: –Preconditioning of nonhermetic surface mount devices prior to reliability testing JESD22-A107-A –47/1456/PAS: IEC 62183, Ed. 1: –Salt atmosphere –47/1633/MCR: Published as part of IEC , Ed. 1 JESD22-B105-B –47/1457/PAS: IEC 62184, Ed. 1: –Lead integrity

39 JEDEC: IEC PAS ACTIVITY JESD22-A106-A –47/1458/PAS: IEC 62185, Ed. 1: –Thermal shock –47/1631/MCR: Published as part of IEC , Ed. 1 JESD22-B104-A –47/1459/PAS: IEC 62186, Ed. 1: –Mechanical shock –47/1630/MCR: Published as part of IEC Ed. 1 JESD22-B103-A –47/1460/PAS: IEC 62187, Ed. 1: –A vibration, variable frequency –47/1632/MCR: Published as part of IEC , Ed. 1 JESD22-A101-B –47/1461/PAS: IEC 62161, Ed.1: –Test method A101-B – Steady state temperature humidity bias life test –47/1680/MCR: Published as IEC , Ed. 1

40 JEDEC: IEC PAS ACTIVITY JESD22-C101 –47/1462/PAS: IEC , Ed. 1: –Test method C101 – Electrostatic Discharge (ESD) Sensitivity Testing – Charged device model (CDM) JESD22-B101 –47/1463/PAS: IEC 62163, Ed. 1: –Test method B101 – External Visual –47/1626/MCR: Published as part of IEC , Ed. 1 JEP118 –47/1464/PAS: IEC 62164, Ed. 1: –Guidelines for GaAs MMIC and FET life testing JEP110 –47/1465/PAS: IEC 62165, Ed. 1: –Guidelines for the measurement of thermal resistance of GaAs FETs EIA/JESD46-A –47/1466/PAS: IEC 62166, Ed. 1: –Guidelines for user notification of product/process changes by semiconductor suppliers

41 JEDEC: IEC PAS ACTIVITY EIA/JESD48 –47/1467/PAS: IEC 62167, Ed. 1: –Product discontinuance JEP 113-B –47/1468/PAS: IEC 62168, Ed. 1: –Symbols and labels for moisture-sensitive devices IPC/JEDEC J-STD-033 –47/1469/PAS: IEC 62169, Ed. 1: –Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices EIA/JESD59 –47/1470/PAS: IEC 62170, Ed. 1: –Bond wire modeling standard JEP114 –47/1471/PAS: IEC 62171, Ed. 1: –Guidelines for particle impact noise detection (PIND) testing, operator training and certification –47/1681/MCR: Published as , Ed. 1

42 JEDEC: IEC PAS ACTIVITY JESD22-A102-B –47/1472/PAS: IEC 62172, Ed. 1: –Accelerated moisture resistance – Unbiased autoclave JESD22-A108-A –47/1474/PAS: IEC 62189, Ed. 1: –Bias Life J-STD-020A (IPC/JEDEC) –47/1475/PAS: IEC 62190, Ed. 1: –Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices –47/1592/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 ( ) and IEC 60749, Ed. 2.2 ( ). J-STD-035 –47/1476/PAS: IEC 62191, Ed. 1: –Acoustic microscopy for nonhermetic encapsulated electronic components –47/1593/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 ( ) and by IEC 60749, Ed. 2.2 ( )

43 JEDEC: IEC PAS ACTIVITY JEP119 –47/1506/PAS: IEC 62201, Ed. 1: –A procedure for executing sweat EIA/JEP122 –47/1507/PAS: IEC 62202, Ed. 1: –Failure mechanisms and models for silicon semiconductor devices EIA/JEP128 –47/1508/PAS: IEC 62203, Ed. 1: –Guide for standard probe pad sizes and layouts for wafer-level electrical testing EIA/JESD33-A –47/1509/PAS: IEC 62204, Ed. 1: –Measuring and using the temperature coefficient of resistance to determine the temperature of a metallization line JESD-A103-A –47/1513/PAS: IEC Ed. 1: –High temperature storage life –47/1628/MCR: Published as part of IEC , Ed. 1

44 JEDEC: IEC PAS ACTIVITY EIA/JESD22-A105-B –47/1514/PAS: IEC 62206, Ed. 1: –Test Method A105-B – Power and temperature cycling JESD22-A109 –47/1515/PAS: IEC 62207, Ed. 1: –Test Method A109 – Hermeticity –47/1594/MCR: Publication Withdrawn – Topic is now covered by IEC 60749, Amendment 2, Ed. 2 ( ) and by IEC 60749, Ed. 2.2 ( ) JESD22-A120 –47/1595/PAS: IEC –Test Method for the Measurement of Moisture Diffusivity and Water Solubility in organic Materials Used in Integrated Circuits JESD22-A118 –47/1635/PAS: IEC PAS 62336: –Accelerated Moisture Resistance – Unbiased HAST

45 IPC: IEC PAS ACTIVITY IPC-EIA/J-STD-012 –IEC/PAS –Flip chip and chip scale technology implementation IPC-EIA/J-STD-013 –IEC/PAS –Implementation of ball grid array and other high density technology IPC-2511 –IEC/PAS –Generic requirements for implementation of product manufacturing description data and transfer methodology IPC-6202 –IEC/PAS Ed. 1.0 –Performance guide Manual for single- and double-sided flexible printed wiring boards IPC-4130 –IEC/PAS –Specification and characterization methods for nonwoven "E" glass mat

46 IPC: IEC PAS ACTIVITY IPC-4411 –IEC/PAS –Specification and characterization methods for nonwoven para- aramid reinforcement IPC-6011 –IEC/PAS –Generic performance specification for printed boards IPC-1710 –IEC/PAS Ed. 1.0 –Manufacturers qualification profile (MQP) IPC-1720 –IEC/PAS Ed. 1.0 –Assembly qualification profile (AQP)

47 IPC: IEC PAS ACTIVITY IPC-1730 –IEC/PAS Ed. 1.0 –Laminator qualification profile IPC-6013 (with amendment) –IEC/PAS /ED, 1,9 –Qualification and performance specification for flexible printed boards IPC-6012 (with amendment) –IEC/PAS –Qualification and performance specification for rigid printed boards


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