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Overview Technology System. Overview Technology System.

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Presentation on theme: "Overview Technology System. Overview Technology System."— Presentation transcript:


2 Overview Technology System

3 Company Profile Established Year 1999 Factory Size 25,000 m2 Employee
1,100 60,000 m2/month Capacity

4 Milestone 6oz with UL, 12oz sample Rigid-Flex TS16949 18L MP HDI
AL PCB SongGang Plant 40,000 m2/month Nan You Plant move to Sha Jing 20,000 m2/month Start to Manufacture on Q3 for new plant ISO14001 5OZ with UL Nan You Plant ISO9001 UL E232940 24L Sample 32L Sample He Shan Plant Establish 1999 2001 2002 2003 2004 2006 2007 2009 2010 2011 2013 2014

5 Group O-chart

6 Factory O-chart

7 Quality O-chart

8 Market Strategy ◎ Meet all kinds of business types from sample to high mix low volume (HMLV) to high volume mass production. ◎ Invest the most up-to-date equipment/advanced technology to continuous improvement on Multilayer/ Heavy copper/ HDI/ PTFE/ Ceramic/ Rigid-Flex. R&D center look through technology trend on customer requirements and PCB industry field all the time. ◎ System automation management on Engineering review and process quality control and total factory operation. ◎ Quick turn delivery Prototype quantities: 24 hours to seven days Production quantities: 3 to 10 days

9 Annual Operation Plan (Year 2014)
◎ Sales’ goal to 95 millions USD ◎ Quality goal for rate of complaint ≤0.45% by batch, ≤95PPM by quantity; ◎ The rate of total internal scrap: ≤3.4%; ◎ The rate of delivery on time: ≥95% for normal PCB, 100% for VMI PCB.

10 Our Customer

11 Market Share Remark: Statistic data are based on delivery location.

12 Sales Turnover M USD

13 Marketing Segment

14 Product by layer count

15 Capacity R&D samples, small volume and quick turn jobs (High Mix Low Volume) ◎ Capacity: 20,000square meters/month ◎ R&D samples, small volume (below 5m2) and quick turn jobs ◎ High- mix technology up to 32 layers, HDI and heavy copper thickness boards to 12 oz ◎ 2000 projects/month ◎ Cam Engineer: 50

16 Capacity Mass production ◎ Capacity: 40,000sqm/month
◎ Low/medium volume mass production high-mix technology multilayer up to 18 layers, HDI and heavy copper thickness to 6 oz ◎ 800 Part No/month ◎ Average 40 square meters/order

17 Separate two stages to finish
Developing Plan A new factory will be established. ◎ Located on He Shan, Jiang Men city, Guang Dong province, China ◎ Factory area 100,000 square meters ◎ Total Investment: 80 Millions USD ◎ Marketing Direction: First stage: 2-12 layers mass production Second stage: focus on HDI, Heavy copper, PTFE, Ceramic, Rigid-Flex PCB and industry fields Separate two stages to finish First stage: Investment: 30 Millions USD Capacity: 50K SQM/month Date: Finish factory house on Q2of 2014 Start to manufacture on Q3 of 2014 Second stage: Investment: 50 Millions USD Capacity: 50K SQM/month

18 Layout Picture of New plant

19 Overview Technology System

20 Technology Roadmap Item 2014 2015 2016 Multilayer Rigid PCB 34L 36L
Rigid-flex PCB 12L 14L 16L Al/Cu metal PCB 4L 8L 8L+ HDI 2+N+2 sample 2+N+2 Low volume 3+N+3 sample Fine line 3/3mil 2.5/2.5mil 2/2mil High Heat sink PCB FR4+Al/Cu FR4+Alloy metal FR4+other material Buried Cu/magnetic Sample Low volume Mass production Buried capacitor/resistor Heavy copper HDI(4-7OZ) IC substrate Low Dk /High Frequency/ high speed PCB Mix construction FR4+Rogers FR4+PTFE sample FR4+PTFE

21 Products Technology ◎ Material: FR-4 (Tg130-170) ARLON Rogers Teflon
Normal material list with UL approval ◎ Material: FR-4 (Tg ) ARLON Rogers Teflon Aluminum Based Polyimide ◎ High layer count (32+ layers) ◎ ROHS & Reach Compliance ◎ Min line/space: 2.5mil/3mil ◎ Min drilling bit 0.15mm, Laser drilling 0.1mm ◎ Backdrilling Supplier Matreial Type Application KB KB6160 SS/DS ShengYi S1141/S1000/S1000-2 /S1600/S1155 SS/DS/Multilayer ITEQ IT588TC/IT158TC/IT180TC Isola FR406/FR-370HR Nelco N4xxx-13RF-xx Rogers R04350B Bergquist MP06503 SS Al base Laird T-Lam SS 1KA DS Al/Cu base

22 Products Technology ◎Surface Treatment:
◇In-house: Lead free HAL / OSP / Immersion Ni, Au / Gold finger / Selected hard gold ◇Subcontract: Immersion Silver / Immersion Tin / HAL ◎ Sequential lamination ◎ Buried and blind via and HDI ◎ Heavy Copper PCB’s Up to 6oz with UL,12oz for sample ◎ Controlled Impedance

23 Production Capability
Item Sample Standard Layer count 32L 18L Final board thickness 0.3-6mm 0.35-6mm Aspect rate 12:1 8:1 Copper thickness 12oz 6oz Impedance Single line +/-8% +/-10% Differential line Line/space Inner layer 2.5/2.5mil 3/3mil Outer layer Min drill bit 6mil 8mil Hole position tolerance +/-3mil PTH hole dimension tolerance +/-2mil NPTH hole dimension tolerance +/-1mil Solder mask Line to solder PAD 3mil 4mil Registration tolerance +/-1.5mil

24 Halogen free lamination Rogers/Teflon/Aluminum base/Polyimide
Production Capability Peel able mask thickness 5mil Carbon ink thickness 0.3mil HAL/LF HAL thickness SMD: u” GND:30-800u” Immersion Au Au 1-5u” Ni 80-200u” Gold finger thickness 10-50u” OSP thickness um Immersion Tin um Immersion Ag um Profile Punching +/-5mil Routing +/-4mil Lamination Type FR4(Tg ) Halogen free lamination Rogers/Teflon/Aluminum base/Polyimide

25 Product Type---Heavy Copper
Layer: 18L Inner/Outer:4oz Board thickness: 4.0mm Layer: 4L Inner:12oz+1mm Cu base Outer: 3oz Board thickness: 2.5mm Layer: 10L Inner/Outer: 6oz Board thickness: 3.2mm Layer: 12L Inner/Outer: 4oz Board thickness: 2.85mm Layer: 14L Inner: 3oz Outer: 2oz Board thickness: 3.3mm

26 Product Type---Al base PCB
Power model LED model

27 Product Type---Buried copper & Mix construction
TOP面 Rogers +FR4 Bottom面

28 Product Type---Rigid-flex PCB
2L Rigid-flex PCB Board thickness: 1.6mm 4L Rigid-flex PCB Board thickness: 1.6mm 6L Rigid-flex PCB Board thickness: 0.7mm

29 Product Type---Other 10L HDI PCB/hole size 0.1mm 16L blind hole PCB
Semi-flex. PCB 14L backplane PCB/size: 664x800mm Board thickness: 5.2mm

30 Product Type---Other Via plugged by copper paste
Via plugged by silver paste Backdrilling Via plugged by resin

31 High Reliability Products
2 automatic coating machines for inner layer 1 OPE punching machine before laminate 5 CCD parallel exposure machines 1 CCD fuse machine 5 Orbotech AOI machines, total 11 AOI. 8 lamination machines, including 1 fast press 11 Schmoll drill machines/10 Mania machines, total 29 machines/154 spindles 2 X- RAY CM 800 for inspection after drilling 2 automatic PTH lines 5 automatic plating lines( including VCP) 22 CNC routing machines 1 Automatic V-CUT machine 37 E-testes: 12 flying probes, including 3 micro resistance testers, 18 E-testers, 3automatic E- tester, 6 Hi-pot testers, 2 automatic visual inspection machine on FQC 33 automatic horizontal production lines Base material: ShengYi and ITEQ and Isola and Nelco PTH solution: Rohm & Haas Plating solution: Rohm & Haas SM: Taiyo and Greencure Surface finish: Atotech solution on Immersion Tin Japanese SN100(Sn/Cu/Ni) on LF HASL Material Machine Method Add test coupon (Registration and Micro resistance) on production panel to control quality of critical process. High process control on PTH and plating process. Backlight: one sample every fly bar to inspect Copper thickness: one sample every fly bar to measure 1 CMI 900 tester/ 2 CMI 700 testers/ 2 CMI 500 testers 2 Ionic contamination testers, one is to test NaCl content, other is to test content of single ionic 1 DSC TG tester/1 ROHS tester/2 Hi-pot testers 2 Impedance testers/ 2 Peel strength testers 1 Temperature and humidity chamber 1 Salt-corrosion box 1 Reflow soldering machine 1 Atom absorption tester

32 Key Production Equipment
Automatic coating machine CCD parallel expose machine OPE Pin punching machine CCD fuse machine Laminate machine X-ray drilling Tooling hole

33 Key Production Equipment
Fast laminate machine SCHMOLL drilling machine Automatic PTH line Automatic plating line Vertical continue plating line(VCP) Acid etching line

34 Print machine for via plug
Key Production Equipment Alkaline etching line Print machine for via plug CCD exposure machine Immersion Au line Gold finger line

35 Visual inspection machine(AVI)
Key Inspection Equipment AOI Visual inspection machine(AVI) Line&space tester Fly probe Automatic E-test

36 Key Reliability Testing Equipment
◎100% E-TEST ◎100% Visual Inspection ◎Outline measurement ◎Micro section ◎Solder ability (245±5ºC; 3-5 sec) ◎Thermal shocking (288±5ºC,10 sec. 3times) ◎Solder mask peeling testing ◎Peeling intensity testing ◎Impedance testing ◎Ionic contamination testing ◎Reflow test ◎DSC Tg tester ◎ROHS ◎Temp& Humidity test Ionic contamination Impedance DSC Tg tester ROHS tester Reflow machine Temp/Humidity Chamber

37 Overview Technology System

38 Certificate System certificate: ◎ ISO9001:2008 ◎ ISO14001:2004
◎ TS16949:2009 Product certificate: ◎ UL File NO.: E232940 ROHS+REACH Test Reports: ◎ SGS File NO.:CANEC ◎ SGS File NO.:CANEC ◎ SGS File NO.:CANEC ◎ REACH File NO.:GZ /CHEM ◎ REACH File NO.:GZ /CHEM

39 ISO9001:2008 certificate ISO14001:2004 certificate

40 TS16949:2009 certificate UL certificate

41 Environment Protection
◎ ISO Certified ◎ Guangdong Environmental Protection Member ◎ All control items meet Class 1 of GB SPEC on Waste Water Discharge Test report From Government

42 System Automation Process Flow Software System Main Function
Quotation Automation Quotation Track/Analysis Gerber File Review Automation Panelization Automation Match Automation on Plant Capability and Customer specification MI Automation and Standard Database Process Parameter/Production Record/Quality/Maintenance data Traceability Quality Data Analysis Manage all processes From order to WIP to delivery Intelligent Quote Quotation Engineering Review For Gerber File Genesis Panelizer Enginex Information System For Quality Control Quality Information System Management System Paradigm ERP

43 Award

44 Jove , your reliable PCB solution provider
Thanks Jove , your reliable PCB solution provider

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