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SGI® Rackable® Servers

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1 SGI® Rackable® Servers
First Last Title

2 Speed and Scale Finding Answers™ 10-15 10-6 106 1024 ∞ Subatomic
Atomic to Cellular Human Scale Astronomical Our customers are working with Petascale data sets, using the most compute intense algorithms on problems from subatomic, through molecular to human and astronomical scale We provide the tools and technology that help our customers Finding Answers™ to the world’s most challenging questions. Hadron collider in Geneva: 1 Petabyte per second data creation Genomics customers like Complete Genomics and ICR/TGAC: curing cancer, working on Meta genomics problems of 100s of Terabytes only solvable on UV (coherent shared memory architecture), largest Genom database in the world (Kegg) Rolls Royce modeling turbines, Sikorsky flight simulation for next generation Blackhack World’s largest Hadoop clusters to analyze large part of the digital universe Square Kilometer Array captures 1.5 Exabyte/day – SGI to manage data and provide visualization – 100+ PB archive Steven Hawking modeling black holes at light year scale 1016 1018 10-15 10-6 106 1024 Lightyear Exascale Femtometer Yottascale

3 High Performance Computing
Our Strategy and Focus Business Applications High Performance Computing Business Computing HPC Redundancy Speed & Scale

4 High Performance Computing
Our Strategy and Focus Big Data Business Applications High Performance Computing Business Computing HPC Redundancy Speed & Scale

5 Agenda Rackable® Value Proposition Half-Depth Servers
Standard-Depth Servers

6 Customer Problems Getting the right configuration for a cluster for specific applications is difficult Setting up a cluster can take a lot of time and is prone to error Managing clusters can be very difficult Expanding clusters can lead to disappointing performance and management challenges

7 SGI® Servers for Speed and Scale
HPC Commercial Scientific Modeling & Simulation Big Data Hadoop In-memory Analytics Archive Cloud Public Private Government SGI® ICE™ X Rackable® SGI® UV™ 2000 Rackable® CloudRack™ C2

8 Rackable® Clusters Value Proposition
Best of breed components, tested and integrated by SGI® Engineering Complete software stack including SGI Management Center and SGI Performance Suite Integrated, stood-up and tested in SGI factory Not on your floor Not in some 3rd party’s facility Supported Worldwide by SGI The value proposition of the Rackable product line is truly compelling. The amount of configuration flexibility is truly industry-leading, allowing customers to meet their exact needs for any given application. With up to 2,208 cores per cabinet, Rackable servers deliver high density, allowing data centers to conserve precious space. With power increasingly at a premium, our Eco-Logical™ technology is of particular value to customers. Rackable servers typically consume significantly less power than competitive offerings, dropping OpEx cost per server while allowing a larger number of servers to fit in the facility’s power budget. Whether it be done at the application level or in the server hardware, Rackable configurations are capable of delivering high reliability, availability, serviceability and manageability. And finally, SGI offers Rackable servers as part of complete solutions – fully integrated from both a hardware and software point of view.

9 Fully Integrated in SGI® Factory
Comprehensive factory integration simplifies on-site deployment and management Entirely built on industry-standard hardware and software components, enabling access to the full spectrum of the Linux ecosystem Full integration with the SGI  Performance Suite, which optimizes the performance of applications running on standard Linux, and with the SGI Management Suite, which enables ease of administration, including dynamic power and GPU monitoring and management SGI is renowned for its expertise in shipping complete, fully integrated solutions, whether that be to implement large Internet scale-out environments or substantial HPC clusters. This starts at the physical level – server typically ship fully racked, stacked and cabled. Server and network configuration can be done in the factory, including setting IP addresses, imaging systems, labeling system features and even performing customer-specific asset tagging. These solutions come with a rich set of support and sparing options and world-class technical consulting is available to accompany the systems themselves.

10 Fully Integrated in SGI® Factory(2)
Complete Factory Integration - SGI Rackable® Cluster: Nodes labeled per customer requirements Delivered fully cabled to switches Cables labeled per customer requirements Servers mounted in rack, if ordered Static IP address range applied Fully integrated and tested software on head node Provisioned compute nodes per customer requirements GigE and IB fabric tested using MPI SGI offers fully engineering tested and factory integrated Rackable Standard Depth clusters delivered with a complete cluster management software stack to simplify deployment and management at the customer’s site. These are some of the main factory integration steps taken before a cluster ships out of the SGI factory.  

11 Fully Integrated in SGI® Factory (3)
SGI Linux HPC Stack SGI delivers tightly integrated solutions based on Linux® For HPC clusters, SGI provides a complete Linux technical computing stack For virtualized environments, SGI offers VMware certified platforms, supports Red Hat RHEL with KVM, and Microsoft Hyper-V Full system management and monitoring for both data center and HPC environments with SGI Management Center Performance Optimization SGI Performance Suite System Management SGI Management Center Workload Manager Altair® PBS Professional™ MPI SGI MPT, Intel MPI Runtime RAS SGI Foundation Software File and data management SGI CXFS, SGI DMF, Lustre Linux Operating Systems: Novell SLES 10 & 11; Red Hat RHEL 5 & 6, CentOS 5 & 6* SGI brings substantial software expertise to every engagement. Widely recognized as a key contributor to the Linux kernel, SGI offers a complete Linux HPC stack based on either Novell SUSE or Red Hat Linux, SGI MPT or Intel MPI runtime facilities, Altair PBS Professional workload management with alternate workload manager available, SGI Management Center for systems management and SGI Performance Suite™ to deliver high performance applications. SGI has large numbers of certified VMware Rackable™ platforms. * Shipping when available

12 Ultimate System RAS and Management Capability
Hundreds of thousands of SGI Rackable® servers in production powering the world’s largest internet and technical computing environments Robust reliability and availability features at both the application architecture level and at the server level World class professional consulting, installation and support services. SGI customers have access to 500 Services Professionals in 50 Countries and to same Day Support in 150 Major Metro Areas in over 20 Countries Rackable servers are field proven, with hundreds of thousands in production powering the world’s largest Internet and technical computing environments. Reliability and availability is typically either implemented at the application architecture level (allowing individual servers to fail without consequence) or by relying on redundant power and cooling options at the server hardware level. Rackable servers also optimize for serviceability. Half-depth servers mount like blades with no rack rails required and front-facing ports. Standard-depth servers include multi-node models like the C2112 which support swapping individual nodes to speed service. And when it comes to manageability, all Rackable models support IPMI remote management for lights-off access and control. SGI Management Center unifies these capabilities under an easy-to-use, centralized management view.

13 High Density Both Rackable® half-depth and standard-depth servers can be deployed at leading core densities: C1001 half-depth server: 2,944 cores/46U cabinet in 92 servers mounted back to back C2112 standard-depth server: 2,688 cores/42U cabinet in 21 quad- node servers (84 nodes) Rackable servers also deliver a high local storage density, a central requirement for many applications Practical density is key as most data centers are power limited. A key SGI strength is designing at the cabinet level, optimizing power and thermals for the real life data center environment Rackable servers are known for their superior density. Half-depth server mount back to back for up to 92 servers or 2,208 cores in a 46U cabinet. Standard-depth models include quad-node 2U models that yield 84 nodes and 2,016 cores in a standard 42U cabinet. Of course those are solutions that optimize for CPU core density. Equally important are Rackable server models that optimize for local storage density or a combination of core and storage density. What it comes down to is that practical density is the key metric. Not only the right mix of compute and storage but that which fits inside the typically limited power budget available in a real-life data center. Because SGI designs at the cabinet level, all Rackable servers feature optimum power and thermal characteristics that allow for a superior practical density. Half-depth density is based upon AMD Magny-Cours at 12 cores/socket. So 92 servers x 2S per server x 12 cores = 2,208 cores. Standard-depth density is based upon 4 nodes in a 2U. So a 42U cabinet has 21 x 4 = 84 nodes; with Magny-Cours 84 x 2 x 12 = 2,016 cores.

14 Eco-Logical™ Benefits
SGI servers can cut W of power vs. competitive designs Power savings delivered by Optimizing component choices CPU, memory, hard drives Delivering superior thermal designs that cut cooling fan power Maximizing AC and DC power supply efficiency and right-sizing power supplies to server configurations SGI is industry leading in bringing high-efficiency, Eco-Logical solutions to market. In many cases, this means a decrease of W of power per server relative to competitive designs. 10W may not sound like much but even 10W of savings means roughly $100 of power cost over a three year life of a server, factoring in typical commercial power costs and data center overhead. The Rackable line leverages best-of-breed component level choices, emphasizing high-efficiency parts throughout. For many customers, this means using 50-60W CPUs instead of W ones, leveraging an architecture that allows low-wattage memory (4W instead of 16W per stick), and designing in hard drives at 6-8W per drive instead of 10-18W. Rackable half-depth servers in particular benefit from a superior thermal design that substantially cuts cooling fan power draw, further optimizing server power consumption. Finally, SGI continues to invest in its AC and DC power supply technology to ensure that they are best in class, with efficiencies in the low to mid 90’s in real life use, not just in power efficiency benchmarking. And right-sizing the supplies ensures that each server is operating at peak efficiency for that specific server configuration. CPU: 80-95W -> 50-60W Memory: 16W -> 4W Hard drive: 10-18W -> 6-8W

15 SGI Global Services – Worldwide Reach
Our Global Presence 500 Services Professionals in 50 Countries Global Customer Service Center Infrastructure Global Logistics Infrastructure with over 60 Spare Parts Depots United Kingdom Reading Japan Tokyo Atlanta United States Our Customer Experience Australia Sydney Same Day Support in 150 Major Metro Areas in over 20 Countries Customized Support Available 7x24 via , Telephone or Web Support in Multiple Languages 500 Services Professionals Deliver Services to Customers in 50 Countries Same-Day Support Capability in 150 Metro Areas in Over 20 Countries

16 Rackable® Form Factors
All Rackable servers are 19” rack mount compatible Half-Depth Servers Mount back-to-back in Rackable™ cabinets for double density or in 2-post racks Ideal for homogeneous deployments implemented at cabinet or row level Choose either flow-through or hot-aisle containment configurations 15.5” deep form factor ideal for thermals and reducing fan power Front-facing ports and rail-less design increase serviceability Best of blade features, without lock-in to a handful of motherboard designs! Standard-Depth Servers Mount in all standard racks (rail-based) Ideal for heterogeneous deployments, including use as HPC management nodes with SGI ICE or UV systems Not all available motherboard options fit within a half-depth footprint (e.g. many 4S options) Multi-node solutions such as C2112 server (four nodes in 2U) available for high density deployments Rear-facing ports ideal for compatibility (e.g. attaching to external storage systems) The Rackable Server line is defined by 19” rackmount compatibility and includes two principal form factors – half-depth and standard-depth. SGI invented the half-depth server form factor to allow for superior thermals while mounting servers back to back for double density. They are ideal for largely homogeneous deployments implemented at the cabinet or row level inside the data center. For superior density, configurability, etc. in a standard hot/cold aisle environment, flow-through designs can be implemented—this has the advantage of the superior half-depth design (with lots of SGI added-value). In a hot-aisle containment design Rackable half-depth servers represent an ideal path to implementing hot aisle containment – for example, it is easy to pipe the hot air out of the top of the cabinet directly into the data center’s HVAC return system, eliminating issues of hot air contaminating cold aisles and the associated data center thermal challenges. Thermals tend to be superior overall with half-depth servers because air only needs to be pulled the 15.5” inch length of the chassis. As a result, most Rackable half-depth servers only require 10-15W of cooling fan power to cool, even with the highest wattage processors available. Finally, half-depth servers have front-facing ports and a rail-less design which significantly improve serviceability over traditional rail-mounted servers. SGI also offers standard-depth server models in the Rackable line. These are great for heterogeneous deployments. Not only are these the ideal head nodes or management nodes for SGI ICE and SGI UV systems, but standard-depth Rackable servers are also the best fit for combining with SGI InfiniteStorage systems so that all cabling is at the rear and cooled in an industry standard hot-aisle/cold-aisle approach. Approaching the density of the half-depth designs, multi-node configurations such as the C2112 server are available that share power and cooling infrastructure without compromising performance.

17 Rackable® Standard-Depth Servers
C1103/C1104G Features 1U dual-socket server Ideal for GPU Computing 3 x 3.5” or 4 x 2.5” hot-swap drives Two or three GPUs (C1103 also available with up to 4 x PCIE x8) Key Models C1103-TY12: Intel Xeon 5600 C1104G-RP5: Intel Xeon E5-2600 C1110 Features 1U dual-socket server 4x 3.5” or 10 x 2.5” hot-swap drives Two PCIe Gen 3 x16 slots Redundant Power Supply (RPS) Key Models C1110-RP6: Intel Xeon E5-2600 C1110-RN3: Intel Xeon E5-2400 The C1103 and C1104 servers are both key 1U server models. The C1103-TY12 supports up to two GPU cards, each in a dedicated x16 slot. The C1104-2TY9 is a high density system containing two dual-socket nodes. With optional onboard InfiniBand connectivity, it is a particularly good choice as a compute node for HPC clusters.

18 Rackable® Standard-Depth Servers
Features 2U dual-socket server Ideal HPC management/head node Up to 8 x 3.5” hot-swap drives Up to five expansion slots 1+1 Redundant AC Power Supplies Key Models C2108-RP2: Intel Xeon E5-2600 C2108-G9: AMD Opteron 62/300 C2112 Features 2U quad-node dual-socket server Ideal for HPC cluster nodes Up to 12 x 3.5” hot-swap drives (3/node) Four low-profile expansion slots (1/node) Optional QSFP QDR/FDR InfiniBand port/node 1+1 Redundant AC Power Supplies Key Models C2112-4RP4: Intel Xeon E5-2600 C2112-4G10: AMD Opteron 62/300 The C2108 and C2112 are both 2U standard-depth servers, available with either Intel or AMD processor architectures. The C2108 offers solid I/O expansion capability, up to eight 3.5” hot-swap drives and redundant power supplies. This makes it a good choice for HPC cluster head nodes in addition to general purpose server applications. The C2112 is a system containing four hot-swap nodes that all share power and cooling infrastructure. It is a popular compute node choice when implementing HPC clusters.

19 Rackable® Standard-Depth Servers
Features 2U quad-socket server Ideal HPC management/head node Up to 6 x 3.5” hot-swap drives 32 DIMM slots for up to 1024GB memory using 32GB DIMMs Four low-profile expansion slots 1+1 Redundant AC Power Supplies Key Model H2106-G7: AMD Opteron 62/300 C2110G Features 2U quad-socket server Ideal high GPU/socket density node Up to 10 x 2.5” hot-swap drives 8 DIMM slots Up to four GPUs Two AC Power Supplies Key Model C2110G-RP5: Intel Xeon E5-2600 The C3108 is the highest-end dual socket standard-depth server in the Rackable line and stays within a 3U rackmount profile. Solid expansion slot choices, 18 DIMM slots, eight hot-swap drives, redundant power all make it the ideal head node for clusters or a capable database platform. The H2106 is a powerful, quad socket Opteron 6100 based server, delivering up to 48 cores of compute power and 256GB of memory using 8GB DIMMs. And best of all, it’s only a 2U!

20 Rackable® Half-Depth Advantage
Flexibility Density Choice of 22U, 36U, 40U, 44U racks & full range of AMD/Intel server models Half-depth server design mounted back-to-back for 2x density Thermal Management & Power Distribution Unobstructed central air plenum for superior ventilation DC Power option provides power savings of up to 30% Passive cooling design for highest reliability On this slide you can see the many advantages of the half-depth server form factor, where SGI has collapsed the hot aisle into the center of the cabinet. This creates a plenum, allowing the hot air to rise either into a air conditioning return in the ceiling above the row or even into an attached duct that pipes the hot air directly out of the data center. This eliminates hot aisle thermal challenges and makes cooling much more efficient. Half-depth servers “blind mate” into the center of the rack like blades for ease of serviceability. Front-facing I/O and cabling reduces maintenance time by up to 75% while providing remote management capabilities that allow administrators to never leave their office except to service actual hardware failures. Serviceability I/O in front and clean cabling reduces maintenance time by up to 75% IPMI remote management

21 Two Airflow Options Chimney Front to Back Airflow Hot aisle/cold aisle
The flow-through config basically turns fans in the opposite direction for the ‘trailing’ chassis, and blows the airflow through in a conventional manner. This is a great slide to bring up the DTO capability, as flow-through started with an idea from Amazon, now it’s broadly available across the line. Hot aisle/cold aisle Typical data center footprint In-cabinet hot aisle containment Easily duct hot air out Optimal cooling

22 Rackable® Half-Depth Server Cabinets
26” wide, 40” deep Can support both half-depth back-to-back and standard-depth front-to-back deployments 26” width cabinet cable troughs sufficient for large cable bundles including InfiniBand interconnect cabling Heights offered: 22U, 36U,40U, 44U 24” wide 24” width cabinet better aligned with standard 24 x 24” data center floor tiles Heights offered: 36U, 42U and 46U The Rackable cabinet line accommodates either form factor but is especially relevant to support half-depth, back-to-back mounted servers. A variety of sizes are available in both 24” and 26” rack widths. Both feature cable troughs for exceptionally clean cabling and serviceability. As mentioned previously, one of the big advantages of the Rackable line is the ability of cabinets to ship fully integrated with servers, networking and storage. This allows servers to be up and running extraordinarily quickly, assuming the data center has been prepared in advance to receive them.

23 Rackable® Half-Depth Rack-level DC Power Delivery
AC-to-DC rectification within the rack for superior combination of reliability and efficiency AC power supplies replaced with 96.5% efficient DC power supply with 2 million hours MTBF Rectifiers convert AC input to DC power for 10%-30% power savings Now available in 1U model DC distribution bars inside cabinet deliver N+M redundant DC power to individual servers Easily deployed in any existing AC data center (no infrastructure upgrades needed) Allows rack-level UPS at significant cost savings over individual chassis RPS While Rackable servers are available with high efficiency AC power supplies, rack-level AC-DC conversion is a compelling choice for many customers. By placing N+M redundant rectifiers at the top of the cabinet, incoming AC power to the cabinet is converted to -48V DC power at high efficiency and distributed to the servers in the rack. In a DC cabinet, Rackable half-depth servers inside the cabinet use an extremely reliable 96.5% efficient DC power supply. The end result is a reliability level equivalent to putting a redundant power supply inside every server with the density and efficiency associated with single supplies. Because the cabinet is still an AC based one from the data center perspective, this in-rack solution is delivered without the need for expensive DC data center infrastructure.

24 Rackable® Half-Depth Servers
Features Blade level density (2,208 cores/46U rack) 1 x 3.5” / 2 x 2.5” hot-swap drives 6 Gb SAS Single expansion slot AC or DC power Key Models C1001-TY8: Intel Xeon 5600 C1001-RP6: Intel Xeon E5-2600 C1001-C1: AMD Opteron 4200 C1001-G13: AMD Opteron 62/300 C2005 Features Industry-leading thermals Up to 5 x 3.5” / 10 x 2.5” hot-swap drives 6 Gb SAS Up to five expansion slots AC, DC, or AC RPS power Key Models C2005-TY6: Intel Xeon 5600 C2005-RP1: Intel Xeon E5-2600 C2005-RN1: Intel Xeon E5-2400 C2005-C3: AMD Opteron 4200 C2005-G11: AMD Opteron 62/300 The 1U C1001 and 2U C2005 servers are SGI’s most popular Rackable half-depth servers. When mounted back to back, the C1001 ends up effectively being a 1/2U and the C2002 a 1U from a density perspective. The C1001 goes after the highest possible blade-level density of up to 2,208 cores in a 46U cabinet, each with one hot-swap 3.5” or a pair of 2.5” hard drives, one expansion slot and choice of AC or DC power supply. The C2005 is often the practical density champion, delivering a rich feature set unheard of in competitive 1U servers at the same density point – up to 5 x 3.5” or 10 x 2.5” hot-swap drives and up to five expansion slots. Redundant AC power is even available with front-facing, hot-swap power supply modules. A wide variety of compatible Intel and AMD server boards make these servers leading choices in the Rackable line.

25 Rackable® Half-Depth Server: C2005
Four top drive tray / expansion slot configurations: 4 x 3.5” tray 1 slot on riser 8 x 2.5” tray 5 low-profile slots (2-6) 4 x 2.5” + 2 x 3.5” tray 1 slot on riser 2 x 3.5” tray 5 low-profile slots (2-6) Here you can see the flexibility of the C2005 in more detail. The top portion of the server has four options and determines the type and number of hard drives, along with the server’s I/O expansion capabilities. There is an additional bay at the lower left that allows the choice of an additional 3.5” or pair of 2.5” drives (or redundant power modules) for even more server configurability. Plus additional lower-left bay capabilities: Internal 3.5” drive and/or DVD-ROM & AC or DC power supply Hot-Swap 3.5” drive or pair 2.5” drives & AC or DC power supply Redundant AC power supply

26 Rackable® Half-Depth Servers
C30xx Features High local storage density (720TB and 360 cores/46U cabinet) Storage and/or I/O focused models Key Models ISS3012-TY15: Intel Xeon 5600 ISS3009-TY15: Intel Xeon 5600 ISS3012-RP1: Intel Xeon E5-2600 ISS3009-RP1: Intel Xeon E5-2600 H4002 Features Specialized applications Quad-socket models Overclocking options Key Models H4002-G6: AMD Opteron 6200 The 1U C1001 and 2U C2005 servers are SGI’s most popular Rackable half-depth servers. When mounted back to back, the C1001 ends up effectively being a 1/2U and the C2002 a 1U from a density perspective. The C1001 goes after the highest possible blade-level density of up to 2,208 cores in a 46U cabinet, each with one hot-swap 3.5” or a pair of 2.5” hard drives, one expansion slot and choice of AC or DC power supply. The C2005 is often the practical density champion, delivering a rich feature set unheard of in competitive 1U servers at the same density point – up to 5 x 3.5” or 10 x 2.5” hot-swap drives and up to five expansion slots. Redundant AC power is even available with front-facing, hot-swap power supply modules. A wide variety of compatible Intel and AMD server boards make these servers leading choices in the Rackable line. 26

27 Summary Rackable™ servers are industry-leading in their configurability and flexibility Designed from the data center down, Rackable™ servers are well suited for both homogeneous and heterogeneous scale-out environments Fully Integrated for Easy Deployment Optimized for RAS and ease of management In summary, Rackable servers are truly unmatched in their configurability and flexibility. By designing them from a data center perspective, Rackable servers are ideal for a wide range data center types and for both homogeneous and heterogeneous scale-out deployments. Eco-Logical energy efficiency, high density and their high level of integration all lead to a low Total Cost of Ownership (or TCO).

28 QUESTIONS? SGI® Rackable® Servers

29 Rackable® Servers Backup Slides

30 Rackable® Server Model Grid

31 Rackable® Standard Depth: Single Node
Model C1104G-RP5 C2110G-RP5 C2108-RP2 C1110-RP6 Form Factor 1U standard-depth 2U standard-depth CPU 2 x Intel Xeon E5-2600 Max. Cores 16 Chipset Intel C600 Memory 8 x DDR3 24 x DDR3 16 x DDR3 Hard Drives 4 x 2.5” 10 x 2.5” 8 x 3.5”; 12 x 3.5” or 24 x 2.5” 4 x 3.5” or 10 x 2.5” Expansion Slots Two PCI-E 3.0 x 16 (two internal, one external) double-wide slots; one PCI-E 3.0 x8 low-profile slot Four PCI-E 3.0 x16 (internal only) double-width slots (optional riser card for 2 additional external PCI-E 3.0 x16 double width slots***), One PCI-E 3.0 x8 and one PCI-E 2.0 x4 low profile Six PCI-E 3.0 x 8 Full Height 1 x Intel SAS Module*** 1 x PCI-E Gen3 x 8 Intel I/O Expansion module One PCI-E x 16 Full Height and one PCI-E 3.0 x16 Low-Profile Networking 2 x GigE 4 x GigE 3 x GigE Management IPMI 2.0 Power Supply AC RPS AC RPS *** not available at launch

32 Two PCI-E 2.0 x16 and two PCI-E 2.0 x8
Rackable® Standard Depth: Single Node (Cont’d) Model C2108-G9 H2106-G7 C1103-TY12 Form Factor 2U standard-depth 1U standard-depth CPU 2 x AMD Opteron 62/300 Series 4 x AMD Opteron 62/300 Series 2 x Intel Xeon 5500/5600 Max. Cores 32 64 12 Chipset AMD SR SP5100 AMD SR SR SP5100 Intel 5520 Memory 16 x DDR3 32 x DDR3 12 x DDR3 Hard Drives 8 x 3.5” 6 x 3.5” 3 x 3.5” Expansion Slots Three PCI-E 2.0 x8 Two PCI-E 2.0 x16 and two PCI-E 2.0 x8 [Two PCI-E 2.0 x16] or [one PCIE 2.0 x16 and two PCI-E 2.0 x8] or [four PCI-E 2.0 x8]. Additional PCI-E 2.0 x4 LP Networking 2 x GigE Management IPMI 2.0 (TBD: KVM) IPMI KVM Power Supply AC RPS AC

33 Rackable® Standard Depth: Multi-Node
Model C2112-4RP4 C2112-4RP3 C2112-4G10 Form Factor 2U standard-depth Nodes/Server Four CPU/Node 2 x Intel Xeon E5-2600 2 x AMD Opteron 62/6300 series Max. Cores/Node 16 24 Chipset/Node Intel C600 Memory/Node 16 x DDR3 8 x DDR3 Hard Drives/Node 4 x 2.5” or 3 x 3.5” 3 x 3.5” Expansion Slots/Node One PCI-E 3.0 x16 low-profile PCI-E 3.0 Intel I/O Module 1 x PCIe Gen 3 x16 low-profile Networking/Node 2 x GigE + optional QSFP QDR or FDR* InfiniBand per node 2 x GigE + optional QSFP QDR or FDR* InfiniBand per node 2 x GigE + optional IB QDR single-port Management/Node IPMI 2.0 Power Supply AC RPS * Not at launch

34 Rackable® Half-Depth: C1001
Model C1001-TY8 C1001-C1 C1001-G13 C1001-RP6 Form Factor 1U half-depth CPU 2 x Intel Xeon 5500/5600 2 x AMD Opteron 4200 2 x AMD Opteron 6200 2 x Intel Xeon E5-2600 Max. Cores 12 16 32 Chipset Intel 5520 AMD SR SP5100 Intel C600 Memory 18 x DDR3 12 x DDR3 16 x DDR3 Hard Drives 1 x 3.5” or 2 x 2.5” Expansion Slots 1 x PCI-E 2.0 x16 Networking 3 x GigE Management IPMI KVM Power Supply AC or DC

35 Rackable® Half-Depth: C2005
Model C2005-TY7 C2005-TY15 C2005-C3 C2005-G11 C2005-RP1 C2005-RN1 Form Factor 2U half-depth CPU 2 x Intel Xeon 5500/5600 2 x AMD Opteron 4200 2 x AMD Opteron 6200 2 x Intel Xeon E5-2600 2 x Intel Xeon E5-2400 Max. Cores 12 16 32 Chipset Intel 5520 AMD SR SP5100 Intel C600 Memory 18 x DDR3 12 x DDR3 8 x DDR3 16 x DDR3 Hard Drives 5 x 3.5”, 10 x 2.5” or combination Expansion Slots (Single Riser Slot Also Available) Three PCI-E 2.0 x8 and one PCI-E 2.0 x4 Four PCI-E 2.0 x8 and one PCI-E 2.0 x4 Two PCIE-E 2.0 x16, one PCI-E 2.0 x8, one PCI-E 2.0 x4 and one PCI-33 One PCI-E 2.0 x16 or two PCI-E 2.0 x8 (auto-selected), one PCI-E 2.0 x8, one PCI-E 2.0 x4 One PCI-E 3.0 x8 full-height (horiz) or 5 PCI-E 3.0 half-height x8 (vertical) Two PCI-E 3.0 x16, one PCI-E 3.0 x8 and two PCI-E 3.0 x4 Networking 4 x GigE 2 x GigE 2 or 4 x GigE Management IPMI KVM Power Supply AC, AC RPS or DC

36 Rackable® Server Motherboards

37 SGI Board Form Factors SGI leverages three principal form factors to achieve best-in-class designs that are thermally superior: EATX form factor Rear CPU/memory Ideal for 1U-2U Rackable + CloudRack EATX form factor Offset CPU/memory Ideal for 2U+ Rackable + CloudRack “Twin” form factor Ideal for Rackable std-depth + CloudRack

38 Intel Romley Platform (SandyBridge EP and EN)

39 RP1 (Intel® S2600CP “Canoe Pass”)
Processor (2) Intel® Xeon® E (Romley EP) 130W 8 core CPUs Chipset Intel® C600 series PCH (Patsburg-A/-D) Memory (4) memory channels per CPU (8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs PCI Expansion Slots (6) PCI-E G3 x8 slots Network (4) GbE ports (Intel® I350-AM) Storage (2) SATA-III ports (4) SATA-II ports RAID 0/1/10/5 support (8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support (w/upgrade key) VGA & IPMI 2.0 Server Engines Pilot III iBMC w/iKVM Shared management port (dedicated via add-on module) Form Factor SSI EEB (12” x 13”) Target Applications Search engine Hadoop / storage server Workstation

40 RP6 (Tyan® S7056) Target Applications CPU-centric HPC Search engine
Processor (2) Intel® Xeon® E (Romley EP) 150W 8 core CPUs Chipset Intel® C600 series PCH (Patsburg-A/-D) Memory (4) memory channels per CPU (8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs PCI Expansion Slots (2) PCI-E G3 x16 slots (2) PCI-E G3 x4 slots Network (3) GbE port Storage (2) SATA-III ports (4) SATA-II ports RAID 0/1/10/5 support (8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support] VGA & IPMI 2.0 ASPEED AST2300 iBMC w/iKVM Shared management port Form Factor EATX (12” x 13”) Target Applications CPU-centric HPC Search engine Virtual machine

41 RP2 (Intel® S2600GZ4/GL4 “Grizzly Pass”)
Processor (2) Intel® Xeon® E (Romley EP) 130W 8 core CPUs Chipset Intel® C600 series PCH (Patsburg-A w/option keys) Memory (4) memory channels per CPU S2600GL4 – (8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs S2600GL4 – (12+12) U/LR/RDDR3 1.5V, 1.35V DIMMs PCI Expansion Slots (6) PCI-E G3 x8 slots (riser) Network (4) GbE port (Intel® Powerville-17) Storage (2) SATA-III ports (4) SATA-II ports RAID 0/1/10/5 support (8) SATA/SAS 3Gb ports RAID 0/1/10 support (module) VGA & IPMI 2.0 Server Engines Pilot III iBMC w/iKVM Shared management port (dedicated via add-on module) Form Factor 16.5” x 16.5” Target Applications “Summit” RFP 2U storage server

42 RP4 (Intel® S2600WP “Washington Pass”)
Processor (2) Intel® Xeon® E (Romley EP) 135W 8 core CPUs Chipset Intel® C600 series PCH (Patsburg-A/-B) Memory (4) memory channels per CPU (8+8) U/LR/RDDR3 1.5V, 1.35V DIMMs PCI Expansion Slots (4) PCI-E G3 x16 slots Network (1) IB QDR (CX3) WPQ SKU (1) IB FDR (CX3) Q2 2012*** (2) GbE ports (Intel® Powerville) Storage (2) SATA-III ports (one via SATA DOM) (4) SATA-II ports RAID 0/1/10/5 support (via module) VGA & IPMI 2.0 Server Engines Pilot III iBMC w/iKVM Shared management port (dedicated via add-on module) Form Factor SFF (6.8” x 18.9”) ***not available at launch Target Applications GPU or CPU-centric HPC Application gateway Virtual machine Search engine

43 RP5 (SuperMicro® X9DRG-HF)
Processor (2) Intel® Xeon® E (Romley EP) 135W 8 core CPUs Chipset Intel® C600 series PCH (Patsburg-A) Memory (4) memory channels per CPU (4+4) U/LR/RDDR3 1.5V, 1.35V DIMMs PCI Expansion Slots (4) PCI-E G3 x16 slots (1) PCI-E G3 x8 slot Network (2) GbE ports (Intel® I350) Storage (2) SATA-III ports (4) SATA-II ports RAID 0/1/10/5 support VGA & IPMI 2.0 Server Engines Pilot III iBMC w/iKVM (w/key) Shared management port Form Factor SFF (7.71” x 16.64”) Target Applications GPU-centric HPC Storage server Application gateway Search engine

44 RN1(Intel® S2400GP “Granite Pass”)
Processor (2) Intel® Xeon® E (Sandy Bridge-EN)95W Chipset Intel® C600 series PCH (Patsburg-A/D/T) Memory (3) memory channels per CPU (6+6) U/LR/RDDR3 1.5V, 1.35V DIMMs PCI Expansion Slots (2) PCI-E G3 x16 slot (1) PCI-E G3 x8 slot (1) PCI-E G3 x8 slot x4 electrical (1) PCI-E G2 x8 slot x4 electrical (1) PCI 32bit/33MHz slot Network (2/4) GbE ports (Intel® I350-AM) Storage (2) SATA-III ports (4) SATA-II ports RAID 0/1/10/5 support (8) SATA/SAS from SCU 3Gb ports RAID 0/1/10 support (w/upgrade key) VGA & IPMI 2.0 Server Engines Pilot III iBMC w/iKVM Shared management port (dedicated via add-on module) Form Factor SSI EEB (12” x 13”) Target Applications Search engine Hadoop / storage server Workstation

45 AMD Socket G (Magny Cours)

46 G11 Form Factor: EATX Chipset: AMD SR5690 + SP5100
CPU: 2 x AMD Opteron 6200 Memory: 16 x DDR3 DIMM (Max. 1600MHz) Expansion Slots: One PCI-E 2.0 x16 or two PCI-E 2.0 x8 (auto-selected), one PCI-E 2.0 x8, one PCI-E 2.0 x4 Networking: Two GigE (Two Intel 82574L) Management: IPMI KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Asus KGPE-D16

47 G13 Form Factor: EATX Chipset: AMD SR5690 + SP5100
CPU: 2 x AMD Opteron 6200 Memory: 16 x DDR3 DIMM (Max. 1600MHz) Expansion Slots: One PCI-E 2.0 x16 Networking: Three GigE (Intel 82576EB + Intel 82574L) Management: IPMI KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S8236IL

48 C1 Form Factor: EATX Chipset: AMD SR5690 + SP5100
CPU: 2 x AMD Opteron 4200 Memory: 12 x DDR3 DIMM (Max. 1600MHz) Expansion Slots: One PCI-E 2.0 x16 Networking: Three GigE (Intel 82576EB + Intel 82574L) Management: IPMI KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S8226

49 C3 Form Factor: EATX Chipset: AMD SR5690 + SP5100
CPU: 2 x AMD Opteron 4200 Memory: 12 x DDR3 DIMM (Max. 1600MHz) Expansion Slots: Two PCIE-E 2.0 x 16, one PCI-E 2.0 x8, one PCI-E 2.0 x4 and one PCI-33 Networking: Four GigE (Intel 82576EB +2 x Intel 82574L) Management: IPMI KVM Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S8225

50 Intel Tylersburg Platform (Westmere EP)

51 TY6 Form Factor: EATX Chipset: Intel 5500
CPU: 2 x Intel Xeon 5500 or 5600 (Up to 130W) Memory: 8 x DDR3 DIMM (Max. 1333MHz) Expansion Slots: One PCI-E x8 and One PCI-E x4 Networking: Embedded dual port Intel® Gigabit Ethernet with Intel I/O Acceleration Technology (I/O AT) Management: IPMI KVM Options: Modular SAS and SAS RAID solution via optional Intel® I/O Expansion Module Manufacturer model: Intel S5500WB

52 TY7 Form Factor: EATX Chipset: Intel 5520 (Tylersburg 36D)
CPU: 2 x Intel Xeon 5500 or 5600 (Up to 95W) Memory: 18 x DDR3 DIMM (Max. 1333MHz) Expansion Slots: Four PCI-E 2.0 x8 and PCI-E x4 slot Networking: Four GigE (Intel L) Management: IPMI KVM (also Roamer compatible) Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S7012 Application: Edge servers with high memory requirements and/or need for multiple NICs

53 TY8 Form Factor: EATX Chipset: Intel 5520 (Tylersburg 36D)
CPU: 2 x Intel Xeon 5500 or 5600 (Up to 95W) Memory: 18 x DDR3 DIMM (Max. 1333MHz) Expansion Slots: PCI-E 2.0 x16 or two x8 (auto-selected) Networking: Three GigE (Intel ) Management: IPMI KVM (also Roamer compatible) Options: Onboard SAS motherboard SKU available Manufacturer model: Tyan S7016 Positioning: Application/edge servers with high memory requirements and/or need for multiple NICs

54 TY15 Form Factor: EATX Chipset: Intel 5520
CPU: 2 x Intel Xeon 5500 or 5600 (Up to 130W) Memory: 12 x DDR3 DIMM (Max. 1333MHz) Expansion Slots: Four x PCI-E 2.0 x8 and one x4 Networking: Embedded dual port Intel® 82575EB Gigabit Ethernet Management: IPMI KVM Options: Modular SAS and SAS RAID solution via optional Intel® I/O Expansion Module Manufacturer model: Intel S5520HC

55 Rackable® Servers Model Reference Slides

56 Rackable® Model Numbering Introduction
Rackable server model numbering is logical and extensible. Important for a large and growing product line. All Rackable model numbers are structured as follows: C: Compute Server <numeral>: Number of U’s <numeral>: Form factor 0 = half-depth, 1 = std-depth, 2 = ICE Cube optimized <two numerals>: Number of hot-swap drive bays Default to 3.5” bays if a server has the choice of either 2.5” or 3.5” <hyphen> <optional numeral>: Number of nodes (one, if not present) <motherboard identifier>: Based on chipset architecture

57 Rackable® Model Numbering Example
Rackable C2112-4RP4 (“Steelhead-WP”): C = Compute Server 2 = 2U 1 = Standard Depth 12 = 12 x 3.5” hot-swap drive bays 4 = four nodes RP4 = the 4th Romley-Platform board qualified

58 Rackable® Half-Depth Server: C1001
Form Factor: 1U half-depth Hard Drives (hot-swap): One 3.5” SAS/SATA drive Two 2.5” SAS/SATA/SSD drives Access via hinged Roamer LCD Expansion Slot: One standard-height (on riser) Power Supply: AC or DC Remote Management: Integrated IPMI KVM or Roamer Positioning: Ideal general-purpose edge server High configuration flexibility, expansion slot, up to 18 DIMM slots

59 Rackable® Half-Depth Server: C2005
Form Factor: 2U half-depth Hard Drives: Up to five 3.5” SAS/SATA drives Up to ten 2.5” SAS/SATA/SSD drives 2.5” / 3.5” combinations supported Access to lower left bay drive(s) via hinged Roamer LCD Expansion Slots: One standard-height (on riser) or five low-profile slots, config. dependent. Power Supply: AC or DC New redundant AC RPS option Remote Management: Integrated IPMI KVM or Roamer Positioning: Ideal general purpose 2U half-depth server where greater local storage density or I/O expansion is required. Strong in Internet search, scale-out database configurations.

60 Rackable® Half-Depth Server: H4002-G6
Form Factor: 4U half-depth CPU: AMD Opteron quad socket Hard Drives: Two 3.5” SAS/SATA drives Memory: 32 x DDR3 1600/1333/1066/800 MHz Expansion Slots: 1 x PCIEx16 (full height) 3 x PCIEx8 (full height) Power Supply: AC, Redundant AC, (or DC) LSI SAS 2008 : 6Gbs, RAID 0, 1, 10 option 3 x GigE onboard ports Positioning: Typically sold with redundant AC power, SAS drives as a database server.

61 Rackable® Standard-Depth Servers (Intel Xeon E5-2600 and E5-2400)
1U 2U 2U/Multi-node C2112-4RP4 C1104G-RP5 C2110G-RP5 1U 2U C1110-RP6 C2108-RP2 Altix XE U, Intel EPSD design 2 Xeon sockets, Blackford chipset Altix XE U, Intel EPSD design 2 Xeon sockets, Blackford chipset Altix XE U, dense, Supermicro "Thin Twin“ 2 x 2 nodes ea. with 2 Xeon Sockets, Greencreek chipset Altix XE U, Supermicro design 2 Xeon Sockets, Seaburg chipset Altix XE U, Dense, Supermicro "Thin Twin“2 x 2 nodes ea. with 2 Xeon Sockets, Seaburg chipset Altix XE 270, 2U, Supermicro design 2 Xeon Sockets, QPI, Tylersburg chipset Altix XE U, Dense, Supermicro "Thin Twin“2 x 2 nodes ea. with 2 Xeon Sockets, QPI, Tylersburg chipset Altix XE U, Supermicro design 2 Xeon sockets, QPI, Tylersburg chipset 2 x Intel IOH's (IO Hubs)

62 IPMI Remote Management
Rackable® C1104G-RP5 Code Name “Pyramid 1U” Chassis Profile 1U standard-depth Servers/System One dual-socket Chipset Intel® C600 Max. Processors Two Intel® Xeon® E5-2600 Max. CPU TDP 115W Memory Slots 8 DIMM slots Memory Type 1600/1333/1066/800 MHz DDR3 ECC Reg Max. Hard Disk Drives 4 x 2.5" drives Expansion Slot Three PCI-E 3.0 x16 (two internal and one external) double-width slots One external PCI-E 3.0 x8 low-profile slot Networking (Onboard) Dual-Port GigE controller (Intel® I350) IPMI Remote Management Integrated IPMI 2.0 Power Supply 1800W Redundant* Platinum Level Compute GPU/ Co-processor support: Tesla M2075, M2090**, K10, K20, Xeon PHI NVIDIA graphics GPU support: Quadroplex 7000 *Redundant per configuration **130W standard Max CPU TDP. 135W CPU TDP with ambient temp. restrictions

63 IPMI Remote Management
Rackable® C2110G-RP5 Code Name “Pyramid 2U” Chassis Profile 2U standard-depth Servers/System One dual-socket Chipset Intel® C600 Max. Processors Two Intel® Xeon® E5-2600 Max. CPU TDP 130W Memory Slots 8 DIMM slots Memory Type 1600/1333/1066/800 MHz DDR3 ECC Reg Max. Hard Disk Drives 10 x 2.5” drives Expansion Slot Four internal PCI-E 3.0 x16 double-width One external PCI-E 3.0 x8 low profile and one PCI-E 2.0 x4 full height Networking (Onboard) Dual-Port GigE controller (Intel® I350) IPMI Remote Management Integrated IPMI 2.0 Power Supply 1800W Redundant** Platinum Level Compute GPU/ Co-processor support: Tesla M2075, M2090, K10, K20, Xeon PHI NVIDIA graphics GPU support: Quadroplex 7000 **Redundant per configuration

64 Expansion Slots/Networking IPMI Remote Management
Rackable® C2112-4RP4 Code Name “Steelhead-WP” Chassis Profile 2U standard-depth Servers/System Four dual-socket (hot-pluggable) Chipset Four Intel® C600 (one/server) Max. Processors Eight Intel® Xeon® E5-2600 (two per server node) Max. CPU TDP 135W* Memory Slots 64 DIMM slots (16/server) Memory Type 1600/1333/1066/800 MHz DDR3 ECC reg. Max. Hard Disk Drives 16 x 2.5" drives (four per server) or 12 x 3.5” drives (three per server) Expansion Slots/Networking Four PCI-E 3.0 x16 low-profile (one/server) Four single port IB QDR or FDR onboard optional (one/server) Four Gen3 x8 I/O module Networking (Onboard) Dual-Port GigE controller (Intel® I350) IPMI Remote Management Integrated IPMI 2.0 Power Supply 1200W Redundant** Platinum Level *130W standard Max. 135W with ambient temp. restrictions **Redundant per configuration

65 Expansion Slots/Networking IPMI Remote Management
Rackable® C2112-4RP3 Code Name “Steelhead-JP” Chassis Profile 2U standard-depth Servers/System Four dual-socket (hot-pluggable) Chipset Four Intel® C600 (one/server) Max. Processors Eight Intel® Xeon® E5-2600 (two per server node) Max. CPU TDP 135W* Memory Slots 32 DIMM slots (8/server) Memory Type 1600/1333/1066/800 MHz DDR3 ECC reg. Max. Hard Disk Drives 16 x 2.5" drives (four per server) or 12 x 3.5” drives (three per server) Expansion Slots/Networking Four PCI-E 3.0 x16 low-profile (one/server) Four single port IB QDR or FDR onboard optional (one/server) Four Gen3 x8 I/O module Networking (Onboard) Dual-Port GigE controller (Intel® I350) IPMI Remote Management Integrated IPMI 2.0 Power Supply 1200W Redundant** Platinum Level *130W standard Max. 135W with ambient temp. restrictions **Redundant per configuration

66 IPMI Remote Management
Rackable® C2108-RP2 Code Name “Summit” Chassis Profile 2U standard-depth Servers/System One dual-socket Chipset Intel® C600 Max. Processors Two Intel® Xeon® E5-2600 Max. CPU TDP 135W* Memory Slots 24 DIMM slots Memory Type 1600/1333/1066/800 MHz DDR3 ECC reg. Max. Hard Disk Drives 8 x 3.5“ 12 x3.5" or 24 x2.5” drives Expansion Slots Six PCIe Gen3 x8 Full Height or Two PCIe Gen3 x16 Double Width and two PCIE Gen3 x8 Full Height 1 x PCIe Gen3 x8 Intel I/O module option Networking (Onboard) Quad-Port GigE controller (Intel® I350) IPMI Remote Management Integrated IPMI 2.0 Power Supply 750W Redundant Platinum Level** Compute GPU/ Co-processor support: Tesla K20, Xeon PHI *130W standard Max. 135W with ambient temp. restrictions ** Redundant per configuration

67 IPMI Remote Management
Rackable® C1110-RP6 Code Name “Bison” Chassis Profile 1U standard-depth Servers/System One dual-socket Chipset Intel® C600 Max. Processors Two Intel® Xeon® E5-2600 Max. CPU TDP 135W Memory Slots 16 DIMM slots Memory Type 1600/1333/1066/800 MHz DDR3 ECC reg. Max. Hard Disk Drives 4 x 3.5“ or 10 x 2.5" drives Expansion Slots One PCIE Gen3 x16 full height and one PCIE Gen3 x16 low profile Networking (Onboard) Three GigE controllers (two Intel® I350 and one Intel® 82574L) IPMI Remote Management Integrated IPMI 2.0 Power Supply 650W Redundant PS or 450W Single PS

68 Rackable™ Standard-Depth Servers (Intel 5600 and AMD 62/300)
1U 2U 2U C2108-G9 C1103-TY12 C2112-4G10 2U H2106-G7 Altix XE U, Intel EPSD design 2 Xeon sockets, Blackford chipset Altix XE U, Intel EPSD design 2 Xeon sockets, Blackford chipset Altix XE U, dense, Supermicro "Thin Twin“ 2 x 2 nodes ea. with 2 Xeon Sockets, Greencreek chipset Altix XE U, Supermicro design 2 Xeon Sockets, Seaburg chipset Altix XE U, Dense, Supermicro "Thin Twin“2 x 2 nodes ea. with 2 Xeon Sockets, Seaburg chipset Altix XE 270, 2U, Supermicro design 2 Xeon Sockets, QPI, Tylersburg chipset Altix XE U, Dense, Supermicro "Thin Twin“2 x 2 nodes ea. with 2 Xeon Sockets, QPI, Tylersburg chipset Altix XE U, Supermicro design 2 Xeon sockets, QPI, Tylersburg chipset 2 x Intel IOH's (IO Hubs)

69 C1103-TY12 (1U) NVIDIA compute GPU support:
Processor Support Dual Nehalem-EP Xeon CPU, 5500 series Memory Capacity 12 DIMM, DDR3 1333/1066/800 MHz Expansion Slots 2 x PCI-e X16 Gen 2.0 (Full height, double width) - Optional riser cards to split one or both x16 slots in two x 8 slots - 1 x PCI-e X4 (Low-profile) I/O ports 1 x VGA, 1 x COM, 2 x Gbit LAN, 2 x USB 2.0 ports System management On board BMC (Baseboard Management Controllers) supports IPMI2.0 Drive Bays 3x hot-swap 3.5” SATA HDD System Cooling 4 fans w/ Optimal Fan Speed Control Power Supply 1400W High-efficiency power supply NVIDIA compute GPU support: S2090, M2075, M2090, M2070Q NVIDIA graphics GPU support: Quadro FX 1800, 3800, 4800, 5800 Quadro 2000, 4000, 5000, 6000 Quadroplex 7000

70 C2108-G9 (2U) Processor Support Memory Capacity Expansion Slots
AMD Socket G34 Opteron™ 6200 /6300 Series – dual socket Memory Capacity 16 DIMM , DDR3 1600/1333/1066/800 MHz Expansion Slots 1 UIO slot 3 PCI-E 2.0 x8 slot I/O ports 1 x VGA, 1 x COM, 2 x Gbit LAN, 4 x USB 2.0 ports System management On board BMC (Baseboard Management Controllers) supports IPMI2.0 Drive Bays 8 x 3.5” SATA/SAS HDD or SSDs: JBOD, RAID 0, 1, 5, 6, 10 System Cooling 4x PWM Fans w/ Optimal Fan Speed Control Power Supply 2 x 720W High-efficiency redundant power supplies

71 C2112-4G10 (2U) C2112-4G10 (2U) Processor Support 4 nodes per chassis AMD Socket G34 Opteron™ 6200 /6300 Series – dual socket Memory Capacity 8 DIMMs (per node), DDR3 1600/1333/1066/800 MHz Expansion Slots 1 x PCI-e X16 Gen 2 per node (low profile) IB QDR single port optional I/O ports 1 x VGA, 1 x COM, 2 x Gbit LAN, 4 x USB 2.0 ports System management On board BMC (Baseboard Management Controllers) supports IPMI2.0 Drive Bays 3 x 3.5” SATA HDD (per node), JBOD System Cooling 4x PWM Fans w/ Optimal Fan Speed Control Power Supply 2 x 1600W High-efficiency redundant power supplies Nvidia graphics GPU support: Quadroplex 7000

72 H2106-G7 (2U) I/O ports 72 Processor Support & Chipset Memory Capacity
Power Supply 1400W High-efficiency Gold Level Redundant Power (RPS optional) Expansion Slots 2 x PCI-E 2.0 x16 (low profile) 1 x PCI-E 2.0 x8 slot (low profile) System Cooling 6x 4-pin PWM Fans w/ Optimal Fan Speed Control Drive Bays 6x Hot-swappable 3.5” SAS/SATA Hard Drive Bays I/O ports 1 VGA, 1 COM, 2 Gbit LAN, 4 USB 2.0 ports. IPMI 2.0 Processor Support & Chipset AMD Socket G34 Opteron™ 6200/6300 Series – quad socket Memory Capacity 32 DIMMs DDR3 1600/1333/1066/800 MHz 72

73 Why Romley?

74 Romley Value Propositions
Most dramatic performance improvement in a generation, in some cases up to 3X performance increase Most flexible and highest price-performance product line in the industry Ideal for workloads in Private Enterprise and Public Cloud, Hadoop, HPC Most ecological solution in the industry using fine- grained power optimization Replacing systems from 2007 will result in a 66% TCO decrease

75 New Capabilities for Romley
New server for GPU compute “Pyramid” 3 GPUs + IB in a 1U, or up to 6 GPUs + IB in a 2U RPS available Consolidates capabilities from several models New 2U/4 node dense cluster node “Steelhead” Same great density, increased I/O options New 2U I/O rich server “Summit” Six Full Height PCIE slot options, consolidates three models New 1U model with RPS: “Bison” New capability! Redundant Power Supply option and up to 10 x 2.5” HDDs in 1U

76 “SandyBridge” Servers Summary
Project Code Name “Tylersburg”Equivalent Key Features Application Areas “Steelhead” C2112-4RP4 and C2112-4RP3 C2112-4TY14 C1104-2TY9 4 x 2S nodes in a 2U; optional on-board IB; 4 LP PCIe x 16 slots HPC—dense cluster compute node; cloud “Summit” C2108-RP2 C2108-TY10 C2108-TY11 Single 2S EATX Motherboard; Up to 24 x 2.5 in. HDD; Up to 6 Full Height PCIe slots Head node for HPC cluster “Pyramid” C1104G-RP5 (1U), C2110G-RP5 (2U) C1103-TY12 C3108-TY11 H4002 Single 2S slim Motherboard; up to3 x GPUs in 1U or 6 x GPUs in 2U; RPS HPC—GPU computing “Bison” C1110-RP6 New capability! 1 x 2S EATX motherboard; RPS Media, Financial Services computer/rending node

77 Rackable® Networking Reference Slides

78 Ethernet adapters The Silicom SFP+ 10 Gigabit Ethernet PCI Express server adapters are based on Intel 82599ES Ethernet controller with SFP ports The fourth-generation (T4) technology from Chelsio provides the highest 10GbE performance available and dramatically lowers host- system CPU communications overhead with onboard hardware that off-loads TCP/IP, iSCSI, FCoE, and iWARP RDMA processing from its host system Silicom PE210G2SPi9 Chelsio T420-CR

79 LG-Ericsson stacking switches
24 port and 48 port switches provide the infrastructure for Ethernet clusters as well as the administrative fabric for the IB clusters Max. stacking limit is 192 ports (4 x 48port switches) Fat tree topology utilizing the10 GbE switch at L2 and 1 GbE switches at L1 to support large clusters iPECS 10G Data Center Switch ES-5000XG Series iPECS Ethernet Switch ES-4500G Series

80 Mellanox/Voltaire IB QDR switches
4036 36 port QDR (1U) 324 port QDR (19U) IS5025/IS5030/IS port 40Gb/s InfiniBand Switch Systems 4700 4200 144 port QDR (11U) IS Port InfiniBand Chassis Switch 648 ports QDR 108 CXP-CXP cables Fully non-blocking Flexible Racking 12 x 12X connectors 2 x 4700

81 Qlogic QDR IB switches Form Factors: 36 port, Internally Managed (1U)
72-96 port, Director Class (5U), port, Director Class (6U) port, Director Class (10U) port, Director Class (14U) port, Director Class (29U) 6U 1U

82 Mellanox IB FDR adapters and switches
5th generation SwitchX® InfiniBand switch devices, up to 56Gb/s (FDR) full bisectional bandwidth per port Onboard subnet manager, enabling simple, out-of-the-box fabric bring-up for up to 648 nodes Compliant with IBTA 1.21 and 1.3 Mellanox ConnectX-3 provides one adapter for InfiniBand, 10/40 Gig Ethernet or Data Center Bridging fabrics. PCIe Base 3.0 compliant, 1.1 and 2.0 compatible SX Port InfiniBand Director Switch ConnectX®-3 SX6025/SX port 56Gb/s InfiniBand Switch Systems


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