2 Speed and Scale Finding Answers™ 10-15 10-6 106 1024 ∞ Subatomic Atomic to CellularHuman ScaleAstronomical∞Our customers are working with Petascale data sets, using the most compute intense algorithms on problems from subatomic, through molecular to human and astronomical scaleWe provide the tools and technology that help our customers Finding Answers™ to the world’s most challenging questions.Hadron collider in Geneva: 1 Petabyte per second data creationGenomics customers like Complete Genomics and ICR/TGAC: curing cancer, working on Meta genomics problems of 100s of Terabytes only solvable on UV (coherent shared memory architecture), largest Genom database in the world (Kegg)Rolls Royce modeling turbines, Sikorsky flight simulation for next generation BlackhackWorld’s largest Hadoop clusters to analyze large part of the digital universeSquare Kilometer Array captures 1.5 Exabyte/day – SGI to manage data and provide visualization – 100+ PB archiveSteven Hawking modeling black holes at light year scale1016101810-1510-61061024LightyearExascaleFemtometerYottascale
3 High Performance Computing Our Strategy and FocusBusinessApplicationsHigh Performance ComputingBusiness ComputingHPCRedundancySpeed & Scale
4 High Performance Computing Our Strategy and FocusBigDataBusinessApplicationsHigh Performance ComputingBusiness ComputingHPCRedundancySpeed & Scale
5 Agenda Rackable® Value Proposition Half-Depth Servers Standard-Depth Servers
6 Customer ProblemsGetting the right configuration for a cluster for specific applications is difficultSetting up a cluster can take a lot of time and is prone to errorManaging clusters can be very difficultExpanding clusters can lead to disappointing performance and management challenges
8 Rackable® Clusters Value Proposition Best of breed components, tested and integrated by SGI® EngineeringComplete software stack including SGI Management Center and SGI Performance SuiteIntegrated, stood-up and tested in SGI factoryNot on your floorNot in some 3rd party’s facilitySupported Worldwide by SGIThe value proposition of the Rackable product line is truly compelling. The amount of configuration flexibility is truly industry-leading, allowing customers to meet their exact needs for any given application. With up to 2,208 cores per cabinet, Rackable servers deliver high density, allowing data centers to conserve precious space. With power increasingly at a premium, our Eco-Logical™ technology is of particular value to customers. Rackable servers typically consume significantly less power than competitive offerings, dropping OpEx cost per server while allowing a larger number of servers to fit in the facility’s power budget. Whether it be done at the application level or in the server hardware, Rackable configurations are capable of delivering high reliability, availability, serviceability and manageability. And finally, SGI offers Rackable servers as part of complete solutions – fully integrated from both a hardware and software point of view.
9 Fully Integrated in SGI® Factory Comprehensive factory integration simplifies on-site deployment and managementEntirely built on industry-standard hardware and software components, enabling access to the full spectrum of the Linux ecosystemFull integration with the SGI Performance Suite, which optimizes the performance of applications running on standard Linux, and with the SGI Management Suite, which enables ease of administration, including dynamic power and GPU monitoring and managementSGI is renowned for its expertise in shipping complete, fully integrated solutions, whether that be to implement large Internet scale-out environments or substantial HPC clusters. This starts at the physical level – server typically ship fully racked, stacked and cabled. Server and network configuration can be done in the factory, including setting IP addresses, imaging systems, labeling system features and even performing customer-specific asset tagging. These solutions come with a rich set of support and sparing options and world-class technical consulting is available to accompany the systems themselves.
10 Fully Integrated in SGI® Factory(2) Complete Factory Integration - SGI Rackable® Cluster:Nodes labeled per customer requirementsDelivered fully cabled to switchesCables labeled per customer requirementsServers mounted in rack, if orderedStatic IP address range appliedFully integrated and tested software on head nodeProvisioned compute nodes per customer requirementsGigE and IB fabric tested using MPISGI offers fully engineering tested and factory integrated Rackable Standard Depth clusters delivered with a complete cluster management software stack to simplify deployment and management at the customer’s site. These are some of the main factory integration steps taken before a cluster ships out of the SGI factory.
11 Fully Integrated in SGI® Factory (3) SGI Linux HPC StackSGI delivers tightly integrated solutions based on Linux®For HPC clusters, SGI provides a complete Linux technical computing stackFor virtualized environments, SGI offers VMware certified platforms, supports Red Hat RHEL with KVM, and Microsoft Hyper-VFull system management and monitoring for both data center and HPC environments with SGI Management CenterPerformance OptimizationSGI Performance SuiteSystem ManagementSGI Management CenterWorkload ManagerAltair® PBS Professional™MPISGI MPT, Intel MPI RuntimeRASSGI Foundation SoftwareFile and datamanagementSGI CXFS, SGI DMF, LustreLinux Operating Systems: Novell SLES 10 & 11;Red Hat RHEL 5 & 6, CentOS 5 & 6*SGI brings substantial software expertise to every engagement. Widely recognized as a key contributor to the Linux kernel, SGI offers a complete Linux HPC stack based on either Novell SUSE or Red Hat Linux, SGI MPT or Intel MPI runtime facilities, Altair PBS Professional workload management with alternate workload manager available, SGI Management Center for systems management and SGI Performance Suite™ to deliver high performance applications.SGI has large numbers of certified VMware Rackable™ platforms.* Shipping when available
12 Ultimate System RAS and Management Capability Hundreds of thousands of SGI Rackable® servers in production powering the world’s largest internet and technical computing environmentsRobust reliability and availability features at both the application architecture level and at the server levelWorld class professional consulting, installation and support services.SGI customers have access to 500 Services Professionals in 50 Countries and to same Day Support in 150 Major Metro Areas in over 20 CountriesRackable servers are field proven, with hundreds of thousands in production powering the world’s largest Internet and technical computing environments. Reliability and availability is typically either implemented at the application architecture level (allowing individual servers to fail without consequence) or by relying on redundant power and cooling options at the server hardware level. Rackable servers also optimize for serviceability. Half-depth servers mount like blades with no rack rails required and front-facing ports. Standard-depth servers include multi-node models like the C2112 which support swapping individual nodes to speed service. And when it comes to manageability, all Rackable models support IPMI remote management for lights-off access and control. SGI Management Center unifies these capabilities under an easy-to-use, centralized management view.
13 High DensityBoth Rackable® half-depth and standard-depth servers can be deployed at leading core densities:C1001 half-depth server: 2,944 cores/46U cabinet in 92 servers mounted back to backC2112 standard-depth server: 2,688 cores/42U cabinet in 21 quad- node servers (84 nodes)Rackable servers also deliver a high local storage density, a central requirement for many applicationsPractical density is key as most data centers are power limited. A key SGI strength is designing at the cabinet level, optimizing power and thermals for the real life data center environmentRackable servers are known for their superior density. Half-depth server mount back to back for up to 92 servers or 2,208 cores in a 46U cabinet. Standard-depth models include quad-node 2U models that yield 84 nodes and 2,016 cores in a standard 42U cabinet. Of course those are solutions that optimize for CPU core density. Equally important are Rackable server models that optimize for local storage density or a combination of core and storage density. What it comes down to is that practical density is the key metric. Not only the right mix of compute and storage but that which fits inside the typically limited power budget available in a real-life data center. Because SGI designs at the cabinet level, all Rackable servers feature optimum power and thermal characteristics that allow for a superior practical density.Half-depth density is based upon AMD Magny-Cours at 12 cores/socket. So 92 servers x 2S per server x 12 cores = 2,208 cores.Standard-depth density is based upon 4 nodes in a 2U. So a 42U cabinet has 21 x 4 = 84 nodes; with Magny-Cours 84 x 2 x 12 = 2,016 cores.
14 Eco-Logical™ Benefits SGI servers can cut W of power vs. competitive designsPower savings delivered byOptimizing component choicesCPU, memory, hard drivesDelivering superior thermal designs that cut cooling fan powerMaximizing AC and DC power supply efficiency and right-sizing power supplies to server configurationsSGI is industry leading in bringing high-efficiency, Eco-Logical solutions to market. In many cases, this means a decrease of W of power per server relative to competitive designs. 10W may not sound like much but even 10W of savings means roughly $100 of power cost over a three year life of a server, factoring in typical commercial power costs and data center overhead.The Rackable line leverages best-of-breed component level choices, emphasizing high-efficiency parts throughout. For many customers, this means using 50-60W CPUs instead of W ones, leveraging an architecture that allows low-wattage memory (4W instead of 16W per stick), and designing in hard drives at 6-8W per drive instead of 10-18W.Rackable half-depth servers in particular benefit from a superior thermal design that substantially cuts cooling fan power draw, further optimizing server power consumption. Finally, SGI continues to invest in its AC and DC power supply technology to ensure that they are best in class, with efficiencies in the low to mid 90’s in real life use, not just in power efficiency benchmarking. And right-sizing the supplies ensures that each server is operating at peak efficiency for that specific server configuration.CPU: 80-95W -> 50-60WMemory: 16W -> 4WHard drive: 10-18W -> 6-8W
15 SGI Global Services – Worldwide Reach Our Global Presence500 Services Professionals in 50 CountriesGlobal Customer Service Center InfrastructureGlobal Logistics Infrastructure with over 60 Spare Parts DepotsUnitedKingdomReadingJapanTokyoAtlantaUnited StatesOur Customer ExperienceAustraliaSydneySame Day Support in 150 Major Metro Areas in over 20 CountriesCustomized Support Available 7x24 via , Telephone or WebSupport in Multiple Languages500 Services ProfessionalsDeliver Services to Customers in 50 CountriesSame-Day Support Capability in 150 Metro Areas in Over 20 Countries
16 Rackable® Form Factors All Rackable servers are 19” rack mount compatibleHalf-Depth ServersMount back-to-back in Rackable™ cabinets for double density or in 2-post racksIdeal for homogeneous deployments implemented at cabinet or row levelChoose either flow-through or hot-aisle containment configurations15.5” deep form factor ideal for thermals and reducing fan powerFront-facing ports and rail-less design increase serviceabilityBest of blade features, without lock-in to a handful of motherboard designs!Standard-Depth ServersMount in all standard racks (rail-based)Ideal for heterogeneous deployments, including use as HPC management nodes with SGI ICE or UV systemsNot all available motherboard options fit within a half-depth footprint (e.g. many 4S options)Multi-node solutions such as C2112 server (four nodes in 2U) available for high density deploymentsRear-facing ports ideal for compatibility (e.g. attaching to external storage systems)The Rackable Server line is defined by 19” rackmount compatibility and includes two principal form factors – half-depth and standard-depth.SGI invented the half-depth server form factor to allow for superior thermals while mounting servers back to back for double density. They are ideal for largely homogeneous deployments implemented at the cabinet or row level inside the data center. For superior density, configurability, etc. in a standard hot/cold aisle environment, flow-through designs can be implemented—this has the advantage of the superior half-depth design (with lots of SGI added-value). In a hot-aisle containment design Rackable half-depth servers represent an ideal path to implementing hot aisle containment – for example, it is easy to pipe the hot air out of the top of the cabinet directly into the data center’s HVAC return system, eliminating issues of hot air contaminating cold aisles and the associated data center thermal challenges. Thermals tend to be superior overall with half-depth servers because air only needs to be pulled the 15.5” inch length of the chassis. As a result, most Rackable half-depth servers only require 10-15W of cooling fan power to cool, even with the highest wattage processors available. Finally, half-depth servers have front-facing ports and a rail-less design which significantly improve serviceability over traditional rail-mounted servers.SGI also offers standard-depth server models in the Rackable line. These are great for heterogeneous deployments. Not only are these the ideal head nodes or management nodes for SGI ICE and SGI UV systems, but standard-depth Rackable servers are also the best fit for combining with SGI InfiniteStorage systems so that all cabling is at the rear and cooled in an industry standard hot-aisle/cold-aisle approach. Approaching the density of the half-depth designs, multi-node configurations such as the C2112 server are available that share power and cooling infrastructure without compromising performance.
17 Rackable® Standard-Depth Servers C1103/C1104GFeatures1U dual-socket serverIdeal for GPU Computing3 x 3.5” or 4 x 2.5” hot-swap drivesTwo or three GPUs (C1103 also available with up to 4 x PCIE x8)Key ModelsC1103-TY12: Intel Xeon 5600C1104G-RP5: Intel Xeon E5-2600C1110Features1U dual-socket server4x 3.5” or 10 x 2.5” hot-swap drivesTwo PCIe Gen 3 x16 slotsRedundant Power Supply (RPS)Key ModelsC1110-RP6: Intel Xeon E5-2600C1110-RN3: Intel Xeon E5-2400The C1103 and C1104 servers are both key 1U server models. The C1103-TY12 supports up to two GPU cards, each in a dedicated x16 slot. The C1104-2TY9 is a high density system containing two dual-socket nodes. With optional onboard InfiniBand connectivity, it is a particularly good choice as a compute node for HPC clusters.
18 Rackable® Standard-Depth Servers Features2U dual-socket serverIdeal HPC management/head nodeUp to 8 x 3.5” hot-swap drivesUp to five expansion slots1+1 Redundant AC Power SuppliesKey ModelsC2108-RP2: Intel Xeon E5-2600C2108-G9: AMD Opteron 62/300C2112Features2U quad-node dual-socket serverIdeal for HPC cluster nodesUp to 12 x 3.5” hot-swap drives (3/node)Four low-profile expansion slots (1/node)Optional QSFP QDR/FDR InfiniBand port/node1+1 Redundant AC Power SuppliesKey ModelsC2112-4RP4: Intel Xeon E5-2600C2112-4G10: AMD Opteron 62/300The C2108 and C2112 are both 2U standard-depth servers, available with either Intel or AMD processor architectures. The C2108 offers solid I/O expansion capability, up to eight 3.5” hot-swap drives and redundant power supplies. This makes it a good choice for HPC cluster head nodes in addition to general purpose server applications. The C2112 is a system containing four hot-swap nodes that all share power and cooling infrastructure. It is a popular compute node choice when implementing HPC clusters.
19 Rackable® Standard-Depth Servers Features2U quad-socket serverIdeal HPC management/head nodeUp to 6 x 3.5” hot-swap drives32 DIMM slots for up to 1024GB memory using 32GB DIMMsFour low-profile expansion slots1+1 Redundant AC Power SuppliesKey ModelH2106-G7: AMD Opteron 62/300C2110GFeatures2U quad-socket serverIdeal high GPU/socket density nodeUp to 10 x 2.5” hot-swap drives8 DIMM slotsUp to four GPUsTwo AC Power SuppliesKey ModelC2110G-RP5: Intel Xeon E5-2600The C3108 is the highest-end dual socket standard-depth server in the Rackable line and stays within a 3U rackmount profile. Solid expansion slot choices, 18 DIMM slots, eight hot-swap drives, redundant power all make it the ideal head node for clusters or a capable database platform. The H2106 is a powerful, quad socket Opteron 6100 based server, delivering up to 48 cores of compute power and 256GB of memory using 8GB DIMMs. And best of all, it’s only a 2U!
20 Rackable® Half-Depth Advantage FlexibilityDensityChoice of 22U, 36U, 40U, 44U racks & full range of AMD/Intel server modelsHalf-depth server design mounted back-to-back for 2x densityThermal Management& Power DistributionUnobstructed central air plenum for superior ventilationDC Power option provides power savings of up to 30%Passive cooling design for highest reliabilityOn this slide you can see the many advantages of the half-depth server form factor, where SGI has collapsed the hot aisle into the center of the cabinet. This creates a plenum, allowing the hot air to rise either into a air conditioning return in the ceiling above the row or even into an attached duct that pipes the hot air directly out of the data center. This eliminates hot aisle thermal challenges and makes cooling much more efficient.Half-depth servers “blind mate” into the center of the rack like blades for ease of serviceability. Front-facing I/O and cabling reduces maintenance time by up to 75% while providing remote management capabilities that allow administrators to never leave their office except to service actual hardware failures.ServiceabilityI/O in front and clean cabling reduces maintenance time by up to 75%IPMI remote management
21 Two Airflow Options Chimney Front to Back Airflow Hot aisle/cold aisle The flow-through config basically turns fans in the opposite direction for the ‘trailing’ chassis, and blows the airflow through in a conventional manner. This is a great slide to bring up the DTO capability, as flow-through started with an idea from Amazon, now it’s broadly available across the line.Hot aisle/cold aisleTypical data center footprintIn-cabinet hot aisle containmentEasily duct hot air outOptimal cooling
22 Rackable® Half-Depth Server Cabinets 26” wide, 40” deepCan support both half-depth back-to-back and standard-depth front-to-back deployments26” width cabinet cable troughs sufficient for large cable bundles including InfiniBand interconnect cablingHeights offered: 22U, 36U,40U, 44U24” wide24” width cabinet better aligned with standard 24 x 24” data center floor tilesHeights offered: 36U, 42U and 46UThe Rackable cabinet line accommodates either form factor but is especially relevant to support half-depth, back-to-back mounted servers. A variety of sizes are available in both 24” and 26” rack widths. Both feature cable troughs for exceptionally clean cabling and serviceability. As mentioned previously, one of the big advantages of the Rackable line is the ability of cabinets to ship fully integrated with servers, networking and storage. This allows servers to be up and running extraordinarily quickly, assuming the data center has been prepared in advance to receive them.
23 Rackable® Half-Depth Rack-level DC Power Delivery AC-to-DC rectification within the rack for superior combination of reliability and efficiencyAC power supplies replaced with 96.5% efficient DC power supply with 2 million hours MTBFRectifiers convert AC input to DC power for 10%-30% power savingsNow available in 1U modelDC distribution bars inside cabinet deliver N+M redundant DC power to individual serversEasily deployed in any existing AC data center (no infrastructure upgrades needed)Allows rack-level UPS at significant cost savings over individual chassis RPSWhile Rackable servers are available with high efficiency AC power supplies, rack-level AC-DC conversion is a compelling choice for many customers. By placing N+M redundant rectifiers at the top of the cabinet, incoming AC power to the cabinet is converted to -48V DC power at high efficiency and distributed to the servers in the rack. In a DC cabinet, Rackable half-depth servers inside the cabinet use an extremely reliable 96.5% efficient DC power supply. The end result is a reliability level equivalent to putting a redundant power supply inside every server with the density and efficiency associated with single supplies. Because the cabinet is still an AC based one from the data center perspective, this in-rack solution is delivered without the need for expensive DC data center infrastructure.
24 Rackable® Half-Depth Servers FeaturesBlade level density (2,208 cores/46U rack)1 x 3.5” / 2 x 2.5” hot-swap drives6 Gb SASSingle expansion slotAC or DC powerKey ModelsC1001-TY8: Intel Xeon 5600C1001-RP6: Intel Xeon E5-2600C1001-C1: AMD Opteron 4200C1001-G13: AMD Opteron 62/300C2005FeaturesIndustry-leading thermalsUp to 5 x 3.5” / 10 x 2.5” hot-swap drives6 Gb SASUp to five expansion slotsAC, DC, or AC RPS powerKey ModelsC2005-TY6: Intel Xeon 5600C2005-RP1: Intel Xeon E5-2600C2005-RN1: Intel Xeon E5-2400C2005-C3: AMD Opteron 4200C2005-G11: AMD Opteron 62/300The 1U C1001 and 2U C2005 servers are SGI’s most popular Rackable half-depth servers. When mounted back to back, the C1001 ends up effectively being a 1/2U and the C2002 a 1U from a density perspective. The C1001 goes after the highest possible blade-level density of up to 2,208 cores in a 46U cabinet, each with one hot-swap 3.5” or a pair of 2.5” hard drives, one expansion slot and choice of AC or DC power supply. The C2005 is often the practical density champion, delivering a rich feature set unheard of in competitive 1U servers at the same density point – up to 5 x 3.5” or 10 x 2.5” hot-swap drives and up to five expansion slots. Redundant AC power is even available with front-facing, hot-swap power supply modules. A wide variety of compatible Intel and AMD server boards make these servers leading choices in the Rackable line.
25 Rackable® Half-Depth Server: C2005 Four top drive tray / expansion slot configurations:4 x 3.5” tray1 slot on riser8 x 2.5” tray5 low-profile slots (2-6)4 x 2.5” + 2 x 3.5” tray1 slot on riser2 x 3.5” tray5 low-profile slots (2-6)Here you can see the flexibility of the C2005 in more detail. The top portion of the server has four options and determines the type and number of hard drives, along with the server’s I/O expansion capabilities. There is an additional bay at the lower left that allows the choice of an additional 3.5” or pair of 2.5” drives (or redundant power modules) for even more server configurability.Plus additional lower-left bay capabilities:Internal 3.5” drive and/or DVD-ROM & AC or DC power supplyHot-Swap 3.5” drive or pair 2.5” drives & AC or DC power supplyRedundant AC power supply
26 Rackable® Half-Depth Servers C30xxFeaturesHigh local storage density (720TB and 360 cores/46U cabinet)Storage and/or I/O focused modelsKey ModelsISS3012-TY15: Intel Xeon 5600ISS3009-TY15: Intel Xeon 5600ISS3012-RP1: Intel Xeon E5-2600ISS3009-RP1: Intel Xeon E5-2600H4002FeaturesSpecialized applicationsQuad-socket modelsOverclocking optionsKey ModelsH4002-G6: AMD Opteron 6200The 1U C1001 and 2U C2005 servers are SGI’s most popular Rackable half-depth servers. When mounted back to back, the C1001 ends up effectively being a 1/2U and the C2002 a 1U from a density perspective. The C1001 goes after the highest possible blade-level density of up to 2,208 cores in a 46U cabinet, each with one hot-swap 3.5” or a pair of 2.5” hard drives, one expansion slot and choice of AC or DC power supply. The C2005 is often the practical density champion, delivering a rich feature set unheard of in competitive 1U servers at the same density point – up to 5 x 3.5” or 10 x 2.5” hot-swap drives and up to five expansion slots. Redundant AC power is even available with front-facing, hot-swap power supply modules. A wide variety of compatible Intel and AMD server boards make these servers leading choices in the Rackable line.26
27 SummaryRackable™ servers are industry-leading in their configurability and flexibilityDesigned from the data center down, Rackable™ servers are well suited for both homogeneous and heterogeneous scale-out environmentsFully Integrated for Easy DeploymentOptimized for RAS and ease of managementIn summary, Rackable servers are truly unmatched in their configurability and flexibility. By designing them from a data center perspective, Rackable servers are ideal for a wide range data center types and for both homogeneous and heterogeneous scale-out deployments. Eco-Logical energy efficiency, high density and their high level of integration all lead to a low Total Cost of Ownership (or TCO).
31 Rackable® Standard Depth: Single Node ModelC1104G-RP5C2110G-RP5C2108-RP2C1110-RP6Form Factor1U standard-depth2U standard-depthCPU2 x Intel Xeon E5-2600Max. Cores16ChipsetIntel C600Memory8 x DDR324 x DDR316 x DDR3Hard Drives4 x 2.5”10 x 2.5”8 x 3.5”; 12 x 3.5” or 24 x 2.5”4 x 3.5” or 10 x 2.5”Expansion SlotsTwo PCI-E 3.0 x 16 (two internal, one external) double-wide slots; one PCI-E 3.0 x8 low-profile slotFour PCI-E 3.0 x16 (internal only) double-width slots (optional riser card for 2 additional external PCI-E 3.0 x16 double width slots***), One PCI-E 3.0 x8 and one PCI-E 2.0 x4 low profileSix PCI-E 3.0 x 8 Full Height1 x Intel SAS Module***1 x PCI-E Gen3 x 8 Intel I/O Expansion moduleOne PCI-E x 16 Full Height and one PCI-E 3.0 x16 Low-ProfileNetworking2 x GigE4 x GigE3 x GigEManagementIPMI 2.0Power SupplyAC RPSAC RPS*** not available at launch
32 Two PCI-E 2.0 x16 and two PCI-E 2.0 x8 Rackable® Standard Depth: Single Node (Cont’d)ModelC2108-G9H2106-G7C1103-TY12Form Factor2U standard-depth1U standard-depthCPU2 x AMD Opteron 62/300 Series4 x AMD Opteron 62/300 Series2 x Intel Xeon 5500/5600Max. Cores326412ChipsetAMD SR SP5100AMD SR SR SP5100Intel 5520Memory16 x DDR332 x DDR312 x DDR3Hard Drives8 x 3.5”6 x 3.5”3 x 3.5”Expansion SlotsThree PCI-E 2.0 x8Two PCI-E 2.0 x16 and two PCI-E 2.0 x8[Two PCI-E 2.0 x16] or [one PCIE 2.0 x16 and two PCI-E 2.0 x8] or [four PCI-E 2.0 x8]. Additional PCI-E 2.0 x4 LPNetworking2 x GigEManagementIPMI 2.0(TBD: KVM)IPMI KVMPower SupplyAC RPSAC
33 Rackable® Standard Depth: Multi-Node ModelC2112-4RP4C2112-4RP3C2112-4G10Form Factor2U standard-depthNodes/ServerFourCPU/Node2 x Intel Xeon E5-26002 x AMD Opteron 62/6300 seriesMax. Cores/Node1624Chipset/NodeIntel C600Memory/Node16 x DDR38 x DDR3Hard Drives/Node4 x 2.5” or 3 x 3.5”3 x 3.5”Expansion Slots/NodeOne PCI-E 3.0 x16 low-profilePCI-E 3.0 Intel I/O Module1 x PCIe Gen 3 x16 low-profileNetworking/Node2 x GigE + optional QSFP QDR or FDR* InfiniBand per node2 x GigE + optional QSFP QDR or FDR* InfiniBand per node2 x GigE + optional IB QDR single-portManagement/NodeIPMI 2.0Power SupplyAC RPS* Not at launch
34 Rackable® Half-Depth: C1001 ModelC1001-TY8C1001-C1C1001-G13C1001-RP6Form Factor1U half-depthCPU2 x Intel Xeon 5500/56002 x AMD Opteron 42002 x AMD Opteron 62002 x Intel Xeon E5-2600Max. Cores121632ChipsetIntel 5520AMD SR SP5100Intel C600Memory18 x DDR312 x DDR316 x DDR3Hard Drives1 x 3.5” or 2 x 2.5”Expansion Slots1 x PCI-E 2.0 x16Networking3 x GigEManagementIPMI KVMPower SupplyAC or DC
35 Rackable® Half-Depth: C2005 ModelC2005-TY7C2005-TY15C2005-C3C2005-G11C2005-RP1C2005-RN1Form Factor2U half-depthCPU2 x Intel Xeon 5500/56002 x AMD Opteron 42002 x AMD Opteron 62002 x Intel Xeon E5-26002 x Intel Xeon E5-2400Max. Cores121632ChipsetIntel 5520AMD SR SP5100Intel C600Memory18 x DDR312 x DDR38 x DDR316 x DDR3Hard Drives5 x 3.5”, 10 x 2.5” or combinationExpansion Slots (Single Riser Slot Also Available)Three PCI-E 2.0 x8 and one PCI-E 2.0 x4Four PCI-E 2.0 x8 and one PCI-E 2.0 x4Two PCIE-E 2.0 x16, one PCI-E 2.0 x8, one PCI-E 2.0 x4 and one PCI-33One PCI-E 2.0 x16 or two PCI-E 2.0 x8 (auto-selected), one PCI-E 2.0 x8, one PCI-E 2.0 x4One PCI-E 3.0 x8 full-height (horiz) or 5 PCI-E 3.0 half-height x8 (vertical)Two PCI-E 3.0 x16, one PCI-E 3.0 x8 and two PCI-E 3.0 x4Networking4 x GigE2 x GigE2 or 4 x GigEManagementIPMI KVMPower SupplyAC, AC RPS or DC
37 SGI Board Form FactorsSGI leverages three principal form factors to achieve best-in-class designs that are thermally superior:EATX form factorRear CPU/memoryIdeal for 1U-2U Rackable + CloudRackEATX form factorOffset CPU/memoryIdeal for 2U+ Rackable + CloudRack“Twin” form factorIdeal for Rackable std-depth + CloudRack
51 TY6 Form Factor: EATX Chipset: Intel 5500 CPU: 2 x Intel Xeon 5500 or 5600 (Up to 130W)Memory: 8 x DDR3 DIMM (Max. 1333MHz)Expansion Slots:One PCI-E x8 and One PCI-E x4Networking: Embedded dual port Intel® Gigabit Ethernet with Intel I/O Acceleration Technology (I/O AT)Management: IPMI KVMOptions: Modular SAS and SAS RAID solution via optional Intel® I/O Expansion ModuleManufacturer model: Intel S5500WB
52 TY7 Form Factor: EATX Chipset: Intel 5520 (Tylersburg 36D) CPU: 2 x Intel Xeon 5500 or 5600 (Up to 95W)Memory: 18 x DDR3 DIMM (Max. 1333MHz)Expansion Slots:Four PCI-E 2.0 x8 and PCI-E x4 slotNetworking: Four GigE (Intel L)Management: IPMI KVM (also Roamer compatible)Options: Onboard SAS motherboard SKU availableManufacturer model: Tyan S7012Application: Edge servers with high memory requirements and/or need for multiple NICs
53 TY8 Form Factor: EATX Chipset: Intel 5520 (Tylersburg 36D) CPU: 2 x Intel Xeon 5500 or 5600 (Up to 95W)Memory: 18 x DDR3 DIMM (Max. 1333MHz)Expansion Slots:PCI-E 2.0 x16 or two x8 (auto-selected)Networking: Three GigE (Intel )Management: IPMI KVM (also Roamer compatible)Options: Onboard SAS motherboard SKU availableManufacturer model: Tyan S7016Positioning: Application/edge servers with high memory requirements and/or need for multiple NICs
54 TY15 Form Factor: EATX Chipset: Intel 5520 CPU: 2 x Intel Xeon 5500 or 5600 (Up to 130W)Memory: 12 x DDR3 DIMM (Max. 1333MHz)Expansion Slots:Four x PCI-E 2.0 x8 and one x4Networking: Embedded dual port Intel® 82575EB Gigabit EthernetManagement: IPMI KVMOptions: Modular SAS and SAS RAID solution via optional Intel® I/O Expansion ModuleManufacturer model: Intel S5520HC
56 Rackable® Model Numbering Introduction Rackable server model numbering is logical and extensible. Important for a large and growing product line.All Rackable model numbers are structured as follows:C: Compute Server<numeral>: Number of U’s<numeral>: Form factor0 = half-depth, 1 = std-depth, 2 = ICE Cube optimized<two numerals>: Number of hot-swap drive baysDefault to 3.5” bays if a server has the choice of either 2.5” or 3.5”<hyphen><optional numeral>: Number of nodes (one, if not present)<motherboard identifier>: Based on chipset architecture
57 Rackable® Model Numbering Example Rackable C2112-4RP4 (“Steelhead-WP”):C = Compute Server2 = 2U1 = Standard Depth12 = 12 x 3.5” hot-swap drive bays4 = four nodesRP4 = the 4th Romley-Platform board qualified
58 Rackable® Half-Depth Server: C1001 Form Factor: 1U half-depthHard Drives (hot-swap):One 3.5” SAS/SATA driveTwo 2.5” SAS/SATA/SSD drivesAccess via hinged Roamer LCDExpansion Slot: One standard-height (on riser)Power Supply: AC or DCRemote Management: Integrated IPMI KVM or RoamerPositioning:Ideal general-purpose edge serverHigh configuration flexibility, expansion slot, up to 18 DIMM slots
59 Rackable® Half-Depth Server: C2005 Form Factor: 2U half-depthHard Drives:Up to five 3.5” SAS/SATA drivesUp to ten 2.5” SAS/SATA/SSD drives2.5” / 3.5” combinations supportedAccess to lower left bay drive(s) via hinged Roamer LCDExpansion Slots:One standard-height (on riser) or five low-profile slots, config. dependent.Power Supply: AC or DCNew redundant AC RPS optionRemote Management: Integrated IPMI KVM or RoamerPositioning:Ideal general purpose 2U half-depth server where greater local storage density or I/O expansion is required. Strong in Internet search, scale-out database configurations.
60 Rackable® Half-Depth Server: H4002-G6 Form Factor: 4U half-depthCPU: AMD Opteron quad socketHard Drives:Two 3.5” SAS/SATA drivesMemory: 32 x DDR3 1600/1333/1066/800 MHzExpansion Slots:1 x PCIEx16 (full height)3 x PCIEx8 (full height)Power Supply: AC, Redundant AC, (or DC)LSI SAS 2008 : 6Gbs, RAID 0, 1, 10 option3 x GigE onboard portsPositioning:Typically sold with redundant AC power, SAS drives as a database server.
61 Rackable® Standard-Depth Servers (Intel Xeon E5-2600 and E5-2400) 1U2U2U/Multi-nodeC2112-4RP4C1104G-RP5C2110G-RP51U2UC1110-RP6C2108-RP2Altix XE U, Intel EPSD design 2 Xeon sockets, Blackford chipsetAltix XE U, Intel EPSD design 2 Xeon sockets, Blackford chipsetAltix XE U, dense, Supermicro "Thin Twin“ 2 x 2 nodes ea. with 2 Xeon Sockets, Greencreek chipsetAltix XE U, Supermicro design 2 Xeon Sockets, Seaburg chipsetAltix XE U, Dense, Supermicro "Thin Twin“2 x 2 nodes ea. with 2 Xeon Sockets, Seaburg chipsetAltix XE 270, 2U, Supermicro design 2 Xeon Sockets, QPI, Tylersburg chipsetAltix XE U, Dense, Supermicro "Thin Twin“2 x 2 nodes ea. with 2 Xeon Sockets, QPI, Tylersburg chipsetAltix XE U, Supermicro design 2 Xeon sockets, QPI, Tylersburg chipset 2 x Intel IOH's (IO Hubs)
62 IPMI Remote Management Rackable® C1104G-RP5Code Name“Pyramid 1U”Chassis Profile1U standard-depthServers/SystemOne dual-socketChipsetIntel® C600Max. ProcessorsTwo Intel® Xeon® E5-2600Max. CPU TDP115WMemory Slots8 DIMM slotsMemory Type1600/1333/1066/800 MHz DDR3 ECC RegMax. Hard Disk Drives4 x 2.5" drivesExpansion SlotThree PCI-E 3.0 x16 (two internal and one external) double-width slots One external PCI-E 3.0 x8 low-profile slotNetworking (Onboard)Dual-Port GigE controller (Intel® I350)IPMI Remote ManagementIntegrated IPMI 2.0Power Supply1800W Redundant* Platinum LevelCompute GPU/ Co-processor support:Tesla M2075, M2090**, K10, K20, Xeon PHINVIDIA graphics GPU support:Quadroplex 7000*Redundant per configuration**130W standard Max CPU TDP. 135W CPU TDP with ambient temp. restrictions
63 IPMI Remote Management Rackable® C2110G-RP5Code Name“Pyramid 2U”Chassis Profile2U standard-depthServers/SystemOne dual-socketChipsetIntel® C600Max. ProcessorsTwo Intel® Xeon® E5-2600Max. CPU TDP130WMemory Slots8 DIMM slotsMemory Type1600/1333/1066/800 MHz DDR3 ECC RegMax. Hard Disk Drives10 x 2.5” drivesExpansion SlotFour internal PCI-E 3.0 x16 double-width One external PCI-E 3.0 x8 low profile and one PCI-E 2.0 x4 full heightNetworking (Onboard)Dual-Port GigE controller (Intel® I350)IPMI Remote ManagementIntegrated IPMI 2.0Power Supply1800W Redundant** Platinum LevelCompute GPU/ Co-processor support:Tesla M2075, M2090, K10, K20, Xeon PHINVIDIA graphics GPU support:Quadroplex 7000**Redundant per configuration
64 Expansion Slots/Networking IPMI Remote Management Rackable® C2112-4RP4Code Name“Steelhead-WP”Chassis Profile2U standard-depthServers/SystemFour dual-socket (hot-pluggable)ChipsetFour Intel® C600(one/server)Max. ProcessorsEight Intel® Xeon® E5-2600(two per server node)Max. CPU TDP135W*Memory Slots64 DIMM slots (16/server)Memory Type1600/1333/1066/800 MHz DDR3 ECC reg.Max. Hard Disk Drives16 x 2.5" drives (four per server)or 12 x 3.5” drives (three per server)Expansion Slots/NetworkingFour PCI-E 3.0 x16 low-profile (one/server)Four single port IB QDR or FDR onboard optional (one/server)Four Gen3 x8 I/O moduleNetworking (Onboard)Dual-Port GigE controller (Intel® I350)IPMI Remote ManagementIntegrated IPMI 2.0Power Supply1200W Redundant** Platinum Level*130W standard Max. 135W with ambient temp. restrictions**Redundant per configuration
65 Expansion Slots/Networking IPMI Remote Management Rackable® C2112-4RP3Code Name“Steelhead-JP”Chassis Profile2U standard-depthServers/SystemFour dual-socket (hot-pluggable)ChipsetFour Intel® C600(one/server)Max. ProcessorsEight Intel® Xeon® E5-2600(two per server node)Max. CPU TDP135W*Memory Slots32 DIMM slots (8/server)Memory Type1600/1333/1066/800 MHz DDR3 ECC reg.Max. Hard Disk Drives16 x 2.5" drives (four per server)or 12 x 3.5” drives (three per server)Expansion Slots/NetworkingFour PCI-E 3.0 x16 low-profile (one/server)Four single port IB QDR or FDR onboard optional (one/server)Four Gen3 x8 I/O moduleNetworking (Onboard)Dual-Port GigE controller (Intel® I350)IPMI Remote ManagementIntegrated IPMI 2.0Power Supply1200W Redundant** Platinum Level*130W standard Max. 135W with ambient temp. restrictions**Redundant per configuration
66 IPMI Remote Management Rackable® C2108-RP2Code Name“Summit”Chassis Profile2U standard-depthServers/SystemOne dual-socketChipsetIntel® C600Max. ProcessorsTwo Intel® Xeon® E5-2600Max. CPU TDP135W*Memory Slots24 DIMM slotsMemory Type1600/1333/1066/800 MHz DDR3 ECC reg.Max. Hard Disk Drives8 x 3.5“12 x3.5"or 24 x2.5” drivesExpansion SlotsSix PCIe Gen3 x8 Full Height or Two PCIe Gen3 x16 Double Width and two PCIE Gen3 x8 Full Height1 x PCIe Gen3 x8 Intel I/O module optionNetworking (Onboard)Quad-Port GigE controller(Intel® I350)IPMI Remote ManagementIntegrated IPMI 2.0Power Supply750W Redundant Platinum Level**Compute GPU/ Co-processor support:Tesla K20, Xeon PHI*130W standard Max. 135W with ambient temp. restrictions** Redundant per configuration
67 IPMI Remote Management Rackable® C1110-RP6Code Name“Bison”Chassis Profile1U standard-depthServers/SystemOne dual-socketChipsetIntel® C600Max. ProcessorsTwo Intel® Xeon® E5-2600Max. CPU TDP135WMemory Slots16 DIMM slotsMemory Type1600/1333/1066/800 MHz DDR3 ECC reg.Max. Hard Disk Drives4 x 3.5“ or 10 x 2.5" drivesExpansion SlotsOne PCIE Gen3 x16 full height and one PCIE Gen3 x16 low profileNetworking (Onboard)Three GigE controllers (twoIntel® I350 and one Intel®82574L)IPMI Remote ManagementIntegrated IPMI 2.0Power Supply650W Redundant PS or450W Single PS
68 Rackable™ Standard-Depth Servers (Intel 5600 and AMD 62/300) 1U2U2UC2108-G9C1103-TY12C2112-4G102UH2106-G7Altix XE U, Intel EPSD design 2 Xeon sockets, Blackford chipsetAltix XE U, Intel EPSD design 2 Xeon sockets, Blackford chipsetAltix XE U, dense, Supermicro "Thin Twin“ 2 x 2 nodes ea. with 2 Xeon Sockets, Greencreek chipsetAltix XE U, Supermicro design 2 Xeon Sockets, Seaburg chipsetAltix XE U, Dense, Supermicro "Thin Twin“2 x 2 nodes ea. with 2 Xeon Sockets, Seaburg chipsetAltix XE 270, 2U, Supermicro design 2 Xeon Sockets, QPI, Tylersburg chipsetAltix XE U, Dense, Supermicro "Thin Twin“2 x 2 nodes ea. with 2 Xeon Sockets, QPI, Tylersburg chipsetAltix XE U, Supermicro design 2 Xeon sockets, QPI, Tylersburg chipset 2 x Intel IOH's (IO Hubs)
69 C1103-TY12 (1U) NVIDIA compute GPU support: Processor SupportDual Nehalem-EP Xeon CPU, 5500 seriesMemory Capacity12 DIMM, DDR3 1333/1066/800 MHzExpansion Slots2 x PCI-e X16 Gen 2.0 (Full height, double width)- Optional riser cards to split one or both x16 slots in two x 8 slots- 1 x PCI-e X4 (Low-profile)I/O ports1 x VGA, 1 x COM, 2 x Gbit LAN, 2 x USB 2.0 portsSystem managementOn board BMC (Baseboard Management Controllers) supports IPMI2.0Drive Bays3x hot-swap 3.5” SATA HDDSystem Cooling4 fans w/ Optimal Fan Speed ControlPower Supply1400W High-efficiency power supplyNVIDIA compute GPU support:S2090, M2075, M2090, M2070QNVIDIA graphics GPU support:Quadro FX 1800, 3800, 4800, 5800Quadro 2000, 4000, 5000, 6000Quadroplex 7000
70 C2108-G9 (2U) Processor Support Memory Capacity Expansion Slots AMD Socket G34 Opteron™ 6200 /6300 Series – dual socketMemory Capacity16 DIMM , DDR3 1600/1333/1066/800 MHzExpansion Slots1 UIO slot3 PCI-E 2.0 x8 slotI/O ports1 x VGA, 1 x COM, 2 x Gbit LAN, 4 x USB 2.0 portsSystem managementOn board BMC (Baseboard Management Controllers) supports IPMI2.0Drive Bays8 x 3.5” SATA/SAS HDD or SSDs: JBOD, RAID 0, 1, 5, 6, 10System Cooling4x PWM Fans w/ Optimal Fan Speed ControlPower Supply2 x 720W High-efficiency redundant power supplies
71 C2112-4G10 (2U)C2112-4G10 (2U)Processor Support4 nodes per chassisAMD Socket G34 Opteron™ 6200 /6300 Series – dual socketMemory Capacity8 DIMMs (per node), DDR3 1600/1333/1066/800 MHzExpansion Slots1 x PCI-e X16 Gen 2 per node (low profile)IB QDR single port optionalI/O ports1 x VGA, 1 x COM, 2 x Gbit LAN, 4 x USB 2.0 portsSystem managementOn board BMC (Baseboard Management Controllers) supports IPMI2.0Drive Bays3 x 3.5” SATA HDD (per node), JBODSystem Cooling4x PWM Fans w/ Optimal Fan Speed ControlPower Supply2 x 1600W High-efficiency redundant power suppliesNvidia graphics GPU support: Quadroplex 7000
72 H2106-G7 (2U) I/O ports 72 Processor Support & Chipset Memory Capacity Power Supply1400W High-efficiency Gold Level Redundant Power (RPS optional)Expansion Slots2 x PCI-E 2.0 x16 (low profile)1 x PCI-E 2.0 x8 slot (low profile)System Cooling6x 4-pin PWM Fans w/ Optimal Fan Speed ControlDrive Bays6x Hot-swappable 3.5” SAS/SATA Hard Drive BaysI/O ports1 VGA, 1 COM, 2 Gbit LAN, 4 USB 2.0 ports.IPMI 2.0Processor Support & ChipsetAMD Socket G34 Opteron™ 6200/6300 Series – quad socketMemory Capacity32 DIMMs DDR3 1600/1333/1066/800 MHz72
74 Romley Value Propositions Most dramatic performance improvement in a generation, in some cases up to 3X performance increaseMost flexible and highest price-performance product line in the industryIdeal for workloads in Private Enterprise and Public Cloud, Hadoop, HPCMost ecological solution in the industry using fine- grained power optimizationReplacing systems from 2007 will result in a 66% TCO decrease
75 New Capabilities for Romley New server for GPU compute “Pyramid”3 GPUs + IB in a 1U, or up to 6 GPUs + IB in a 2URPS availableConsolidates capabilities from several modelsNew 2U/4 node dense cluster node “Steelhead”Same great density, increased I/O optionsNew 2U I/O rich server “Summit”Six Full Height PCIE slot options, consolidates three modelsNew 1U model with RPS: “Bison”New capability!Redundant Power Supply option and up to 10 x 2.5” HDDs in 1U
76 “SandyBridge” Servers Summary Project Code Name“Tylersburg”EquivalentKey FeaturesApplication Areas“Steelhead” C2112-4RP4 and C2112-4RP3C2112-4TY14C1104-2TY94 x 2S nodes in a 2U; optional on-board IB; 4 LP PCIe x 16 slotsHPC—dense cluster compute node; cloud“Summit” C2108-RP2C2108-TY10C2108-TY11Single 2S EATX Motherboard; Up to 24 x 2.5 in. HDD; Up to 6 Full Height PCIe slotsHead node for HPC cluster“Pyramid”C1104G-RP5 (1U),C2110G-RP5 (2U)C1103-TY12C3108-TY11H4002Single 2S slim Motherboard; up to3 x GPUs in 1U or 6 x GPUs in 2U; RPSHPC—GPU computing“Bison” C1110-RP6New capability!1 x 2S EATX motherboard; RPSMedia, Financial Services computer/rending node
78 Ethernet adaptersThe Silicom SFP+ 10 Gigabit Ethernet PCI Express server adapters are based on Intel 82599ES Ethernet controller with SFP portsThe fourth-generation (T4) technology from Chelsio provides the highest 10GbE performance available and dramatically lowers host- system CPU communications overhead with onboard hardware that off-loads TCP/IP, iSCSI, FCoE, and iWARP RDMA processing from its host systemSilicom PE210G2SPi9Chelsio T420-CR
79 LG-Ericsson stacking switches 24 port and 48 port switches provide the infrastructure for Ethernet clusters as well as the administrative fabric for the IB clustersMax. stacking limit is 192 ports (4 x 48port switches)Fat tree topology utilizing the10 GbE switch at L2 and 1 GbE switches at L1 to support large clustersiPECS 10G Data Center SwitchES-5000XG SeriesiPECS Ethernet SwitchES-4500G Series
80 Mellanox/Voltaire IB QDR switches 403636 port QDR (1U)324 port QDR (19U)IS5025/IS5030/IS port 40Gb/s InfiniBand Switch Systems47004200144 port QDR (11U)IS Port InfiniBand Chassis Switch648 ports QDR108 CXP-CXP cablesFully non-blockingFlexible Racking12 x 12X connectors2 x 4700
81 Qlogic QDR IB switches Form Factors: 36 port, Internally Managed (1U) 72-96 port, Director Class (5U),port, Director Class (6U)port, Director Class (10U)port, Director Class (14U)port, Director Class (29U)6U1U
82 Mellanox IB FDR adapters and switches 5th generation SwitchX® InfiniBand switch devices, up to 56Gb/s (FDR) full bisectional bandwidth per portOnboard subnet manager, enabling simple, out-of-the-box fabric bring-up for up to 648 nodesCompliant with IBTA 1.21 and 1.3Mellanox ConnectX-3 provides one adapter for InfiniBand, 10/40 Gig Ethernet or Data Center Bridging fabrics.PCIe Base 3.0 compliant, 1.1 and 2.0 compatibleSX Port InfiniBand Director SwitchConnectX®-3SX6025/SX port 56Gb/s InfiniBand Switch Systems