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Welcome to HEAD Electronics BV 1 Head Electronics BV.

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Presentation on theme: "Welcome to HEAD Electronics BV 1 Head Electronics BV."— Presentation transcript:

1 Welcome to HEAD Electronics BV 1 Head Electronics BV

2 Welcome to HEAD Electronics BV 2 Electronics development Hardware Embedded software Pre-compliant EMC Electronics assembly SMD Conventional Combination PCB-Intermediair Work preparation PCB Specification PCB Mechatronics Housings Wiring Coating Product Offerings Supplier Overview Product Offerings

3 Welcome to HEAD Electronics BV 3 One Stop Shop From idea to product. Product-redesign and – engineering. Purchasing of components. PCB work preparation and purchasing. SMT and THT (trough hole) assembly. Prototyping, pre-production, series production. Housing and cabling assembly. In-house testing of product and CE-EMC. Deliveries on call (JIT) and as series. Logistics, warehouse, outsourcing. Service, upgrades and customer repairs. Supplier Overview Product Offerings

4 Welcome to HEAD Electronics BV 4 HEAD Electronics BV Ambachtsweg AH Katwijk zh Tel: +31 (0) Fax: +31 (0) Website: Supplier Overview Locations, Geografic Locations, Geografic

5 Welcome to HEAD Electronics BV 5 Industrial electronics Machinery factories Explosion Safety applications Measuring- & control equipment Led-solutions Power electronics Transportation Consumer electronics Markets served Supplier Overview Markets Served - Products & Geographic

6 Welcome to HEAD Electronics BV 6 Customer Service Capabilities Choose your own menu… Project definition. Electronics design & development. Project management / engineering support. Electronics assembly. Mechatronics, wiring, coating etc. Testing, test engineering. Logistics. After sales. Prototyping. Supplier Overview Customer Service Capabilities Menu

7 Welcome to HEAD Electronics BV 7 1.Project definition (product, specification, planning etc). 2.Electronics design & development (by customer and / or HEAD). 3.Project management / engineering support (work preparation PCB & BOM, documenting, overall view, etc.) 4.PCB assembly (SMD, THT, manual soldering, etc.). 5.Mechatronics (total assemblies, wiring, coating etc.). 6.Testengineering (AOI, EMC, X-ray etc.). 7.Purchase & Logistics (forecast, purchasing, storage, consignment, etc.). 8.After sales (upgrades, changes, customer repairs, etc.). 9.Prototyping & pre-production (hand + machine & hand). Supplier Overview Customer Service Capabilities Menu explained Customer Service Capabilities

8 Welcome to HEAD Electronics BV 8 1.Defining a project (enquiry, requirements, specs, etc.). 2.Calculation (BOM, labour, machine costs, etc.). 3.Specification (PCB, BOM, etc.). 4.Planning (lead times). 5.Purchase preparation (BOM + planning in MRP). 6.Terms & conditions (general, planning, warranty, payments, etc.). QUOTATION + ORDER + ORDER CONFORMATION. Manufacturing Capabilities Menu Project Definition Project Definition

9 Welcome to HEAD Electronics BV 9 Project Definition - RFQ Manufacturing Capabilities Menu Project Definition RFQ

10 Welcome to HEAD Electronics BV 10 Electronics Development Manufacturing Capabilities Menu Design & Development From idea to functioning product (Balancing development vs. product costs) Specification. Hardware. Embedded software. Availability of components. Cost price components. Production friendly. Programming & testing. CE, EMC pre-compliant. Working prototype. TPD - Technical Product Documentation.

11 Welcome to HEAD Electronics BV 11 Project Management Manufacturing Capabilities Menu Project Management Customer partnership Operations management. Project management. Quality management. Work preparation PCB/BOM/IT. Documentation in AEGIS. Logistics, purchase, storage. Outsourcing. Planning, controlling. Cost control, invoicing.

12 Welcome to HEAD Electronics BV 12 Work Preparation PCB Manufacturing Capabilities Menu Project Management Work Preparation PCB Panelizing and specification before purchasing: PCB data. Multilayer PCB. Panelizing with CAM350. Design/edit with Pulsonics (tool). Own internet tool for PCB specification. Enquire PCB-quotations. Prepare purchase of PCBs.

13 Welcome to HEAD Electronics BV 13 Work Preparation BOM Manufacturing Capabilities Menu Project Management Work Preparation BOM

14 Welcome to HEAD Electronics BV 14 Work Preparation Machines Manufacturing Capabilities Menu Project Management Work Preparation Machines

15 Welcome to HEAD Electronics BV 15 Work Preparation Documentation Manufacturing Capabilities Menu Project Management Work Preparation Documentation (MOS) Documentation in AEGISAEGIS MOS = Manufacturing Operations Software

16 Welcome to HEAD Electronics BV 16 Floor Documentation Manufacturing Capabilities Menu Project Management Work Preparation Floor Documentation Shop Floor paperless by AEGIS

17 Welcome to HEAD Electronics BV 17 Electronics Assembly Surface Mounted Devices Manufacturing Capabilities Menu Electronics Assembly SMD Fast, flexible and accurate Samsung CP series SMD. Placing SMD-components to 0402 Finepitch QFP 0,4 mm Finepitch (µ)BGA Prepared for intelligent feeders Up to 60k components / hour Soltec My Reflow 10 zone Reflow Oven. DEK Horizon 2 screenprinter.

18 Welcome to HEAD Electronics BV 18 Electronics Assembly Surface Mounted Devices Manufacturing Capabilities Menu Electronics Assembly SMD Close up

19 Welcome to HEAD Electronics BV 19 Electronics Assembly Surface Mounted Devices Manufacturing Capabilities Menu Electronics Assembly SMD Barcode

20 Welcome to HEAD Electronics BV 20 Electronics Assembly Surface Mounted Devices Manufacturing Capabilities Menu Electronics Assembly SMD network C pF C PF C pF C PF ETHERNET (TCP/IP) FEEDER-STATION DATABASE SERVER BARCODE PRINTER REEL BARCODE READER REEL BARCODE READER SM FEEDER DOCKING-CART Feeder ID Reading Feeder Event (insert, remove, …) MACHINE DeviceNet PART-STATION

21 Welcome to HEAD Electronics BV 21 Manufacturing Capabilities Menu Electronics Assembly Conventional Electronics Assembly Conventional Components Component preparation as cut, bend etc. Placing of all remaining components. Soldering of the leaded components. Final assembly, built in housings. Programming and loading of software. Routine testing. Labeling, PCB serial number/barcode. Packing.

22 Welcome to HEAD Electronics BV 22 Electronics Assembly Conventional Components Manufacturing Capabilities Menu Electronics Assembly Conventional Close up

23 Welcome to HEAD Electronics BV 23 Electronics Assembly Wave Soldering Manufacturing Capabilities Menu Electronics Assembly Conventional Wave Soldering Wave soldering N 2 with the Soltec Deltawave (leaded). In-line wave soldering N 2 met EPM IBL (RoHS).

24 Welcome to HEAD Electronics BV 24 Electronics Assembly Selective Soldering Selective soldering N 2 with the Soltec My Selective 6745 (RoHS). Manufacturing Capabilities Menu Electronics Assembly Conventional Selective Soldering

25 Welcome to HEAD Electronics BV 25 Electronics Assembly Mechatronics / Total Assembly PCB cleaning. PCB coating. PCB potting. Cabling in house or outsourced. Total assemblies, housing, 19 racks etc. Burn-in test. Manufacturing Capabilities Menu Electronics Assembly Mechatronics

26 Welcome to HEAD Electronics BV 26 Electronics Assembly Cleaning & Coating Manufacturing Capabilities Menu Electronics Assembly Mechatronics Cleaning & Coating

27 Welcome to HEAD Electronics BV 27 Test, Test Engineering Manufacturing Capabilities Menu Test, Test Engineering PCB: Visual, probe tester, sleeves /microscope. SMD: AOI (Viscom), X-ray (Dage 2 M pixel). CE- precompliant EMC. Product: Visual, Functional, In-circuit, self-test, climate-test. Realisation of project test tools with customers.

28 Welcome to HEAD Electronics BV 28 Logistics - Storage Manufacturing Capabilities Menu Logistics Storage Year order, rolling forecast, MRP. Purchasing and incoming goods. Identification / inspection (ATEX !*) / part storage / labeling. Packing following instructions, ESD measures. Storage intermediate and end products, consignation.

29 Welcome to HEAD Electronics BV 29 Logistics - Transportation Manufacturing Capabilities Menu Logistics Transportation Just in time, track and trace. Destinations to customer and end customer. Transportation boxes with UPS in NL, UK (Europe). Pallet Benelux with Wesseling Transport Sassenheim. Worldwide via expedition centres, airport etc.

30 Welcome to HEAD Electronics BV 30 After Sales Service Manufacturing Capabilities Menu After Sales Service After sales service, upgrades, customer repair. For hard- and software. During the lifecycle of your product. Redesign and use of other/newer parts. Spare parts, obsolete part replacements.

31 Welcome to HEAD Electronics BV 31 Manufacturing Quality Management Quality Management ISO 9001: 2008 accredited management system Scope Head Electronics BV: Design and manufacturing of printed circuit boards and assemblies, Incl. SMD production. Design and manufacturing of electronic end products. Quality manual: MSH Head electronics. Accreditation + verification & support: LRQA + BSH & IMC, NEVAT (consultancy).

32 Welcome to HEAD Electronics BV 32 Your contact persons Competitive Advantage of HEAD Contact persons Managing Director: Arie van Leeuwen Marketing & Sales: Eric Verkerke Operations & Finances: Arjan van der Ploeg Production: Wim de Boer Head Electronics BV Ambachtsweg AH Katwijk ZH tel: +31 (71) fax: +31 (71) Internet:

33 Welcome to HEAD Electronics BV 33 Next steps ……. Competitive Advantage of HEAD Next Steps …… Moving aHEAD for you!


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