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Submission Title: [Summary of Copenhagen Meeting]

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Presentation on theme: "Submission Title: [Summary of Copenhagen Meeting]"— Presentation transcript:

1 Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)
Submission Title: [Summary of Copenhagen Meeting] Date Submitted: [6 March 2000] Source: [Tom Siep] Company [Texas Instruments] Address [12500 TI Blvd, m/s 8723,Dallas, TX, 75243] Voice:[ ], FAX: [ ], Re: [Original Submission] Abstract: [Extraction from 00054r0P802-15_TG1-Bluetooth-f2f-Meeting-Minutes.doc] Purpose: [Provide information to inform TG1 membership about the f2f meeting] Notice: This document has been prepared to assist the IEEE P It is offered as a basis for discussion and is not binding on the contributing individual(s) or organization(s). The material in this document is subject to change in form and content after further study. The contributor(s) reserve(s) the right to add, amend or withdraw material contained herein. Release: The contributor acknowledges and accepts that this contribution becomes the property of IEEE and may be made publicly available by P March 2000 Tom Siep, Texas Instruments

2 Summary of Copenhagen Meeting
March 2000 doc.: IEEE /074r1 March 2000 Summary of Copenhagen Meeting Tom Siep Texas Instruments Tom Siep, Texas Instruments Tom Siep, Texas Instruments

3 March 2000 Purpose of Meeting Establish a working relationship between the SIG and IEEE on the SAPs, SDL and PICS work that would not consume SIG resources but maintain open means of communications as needed. Tom Siep, Texas Instruments

4 Agenda – presentations
March 2000 Agenda – presentations Structure of the IEEE draft standard and where the SDL and PICs proforma fit within this structure (Tom) r1 High level components of his SDL model (Allen) Bottom-up approach to the SDL modeling (David) SIG testing process and how SAPs relate to this process (Marten) Tom Siep, Texas Instruments

5 Agenda – discussion points
March 2000 Agenda – discussion points How SAPs impact the tests and how can they be aligned with the ones needed for the SDLs? How to best treat the HCI as the basis for a complementary set of MAC SAPs to the L2CAP The spec provides no clue on any PHY to MAC SAPs. What can those be? PICS: How do the IEEE PICs performa compare with the one's the SIG is working on LEGAL ASPECTS Users of the standard must sign the Bluetooth Tom Siep, Texas Instruments

6 March 2000 Work Flow Tom Siep, Texas Instruments

7 SAPs as Presented in Copenhagen
March 2000 SAPs as Presented in Copenhagen Tom Siep, Texas Instruments

8 March 2000 SAPs as Updated Tom Siep, Texas Instruments

9 March 2000 Summary In effect, our two groups have validated each other's work to date. We started with the same document(s) and independently noted the same architectural anomalies and identified the same external interface classes. Preliminary comparisons indicate that we have either the same or very similar specific definitions in those interface classes. We have decided to work together in order to leverage each other’s work. Tom Siep, Texas Instruments

10 Action Items March 2000 What Who When
Minutes of meeting (this document) Tom Publish Monday Preliminary SAP definitions Mike 10Mar00 Map HCI primitives to IEEE request/response/indicate/confirm format Allen Determine if ASN.1 from Bluetooth is feasible to directly import into TeleLogic tool 1Mar00 ASN.1 source for L2CAP Mårten 6Mar00 Plan for creation of IEEE Draft, based on version 1.1 of Bluetooth Specification Plan for PICS verification. Formulate proposition; initiate conversation between Ian and JimK; revise plan Co-simulation thoughts and evaluation ALL, both IEEE and SIG 16Mar00 Tom Siep, Texas Instruments

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