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Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Characterization of “Bulk Lithography” Process for Fabrication of Three-Dimensional.

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Presentation on theme: "Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Characterization of “Bulk Lithography” Process for Fabrication of Three-Dimensional."— Presentation transcript:

1 Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Characterization of “Bulk Lithography” Process for Fabrication of Three-Dimensional Microstructures J. Micro Nano-Manuf. 2013;1(4):041002-041002-8. doi:10.1115/1.4025461 Schematic representations of (a) CAD model slicing strategy in bulk lithography and (b) cured depth experimental setup and 3D microfabrication using bulk lithography [19] Figure Legend:

2 Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Characterization of “Bulk Lithography” Process for Fabrication of Three-Dimensional Microstructures J. Micro Nano-Manuf. 2013;1(4):041002-041002-8. doi:10.1115/1.4025461 Experimental results of dimensionless cured depth against dimensionless energy at constant duration (s) of exposure for TMPTA- based resin (a) under lower energy exposure and comparison with published results and (b) under wide range of energy exposure [19] Figure Legend:

3 Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Characterization of “Bulk Lithography” Process for Fabrication of Three-Dimensional Microstructures J. Micro Nano-Manuf. 2013;1(4):041002-041002-8. doi:10.1115/1.4025461 Experimental results of dimensionless cured depth against dimensionless energy at constant duration (s) of exposure along with proposed cure depth model: (a) resin, TMPTA and (b) resin, HDDA Figure Legend:

4 Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Characterization of “Bulk Lithography” Process for Fabrication of Three-Dimensional Microstructures J. Micro Nano-Manuf. 2013;1(4):041002-041002-8. doi:10.1115/1.4025461 Variation of parameter “a” and “b” against exposure time for TMPTA-based resin Figure Legend:

5 Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Characterization of “Bulk Lithography” Process for Fabrication of Three-Dimensional Microstructures J. Micro Nano-Manuf. 2013;1(4):041002-041002-8. doi:10.1115/1.4025461 SEM image of lateral surface of the 3D microstructure fabricated using conventional scanning MSL Figure Legend:

6 Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Characterization of “Bulk Lithography” Process for Fabrication of Three-Dimensional Microstructures J. Micro Nano-Manuf. 2013;1(4):041002-041002-8. doi:10.1115/1.4025461 SEM image of the variable depth microstructure (sine wave) using bulk lithography corresponding to (a) regime I and (b) regime II Figure Legend:

7 Date of download: 6/24/2016 Copyright © ASME. All rights reserved. From: Characterization of “Bulk Lithography” Process for Fabrication of Three-Dimensional Microstructures J. Micro Nano-Manuf. 2013;1(4):041002-041002-8. doi:10.1115/1.4025461 Fabrication of microstructure having variable cured depth along radial direction Figure Legend:


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