1. Newest Micropackaging Concepts Including MEMS & Photonics
Ken Gilleo
ET-Trends LLC
© ET-Trends LLC

2. AGENDA Telecom Background Today’s Telecom Revolution
Challenges & Opportunities
Packaging & Assembly Issues
Packaging Panorama
Conclusions
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3. Telecom History 30,000 BC: visual signals (pre-photonics)
3,000 BC: bond fires (battle victories)
1,000 BC: smoke signals (digital)
1775 AD: Paul Revere (low tech-photonics; digital)
1880 AD: Photophone (true photonics; analog)
1890 AD Marconi: radio (RF; digital)
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4. Last 50 Years Radio improves Solid State invented/implemented
Fiber optics made practical
Cellular advances
INTERNET – a major event!
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5. Today’s Telecom Revolution
Telecom surpasses computers as driver
Internet bandwidth accelerates products
More wireless products; Internet-able
Everything gets more portable
Convergence; phone, pager, computer, TV, radio, music
All of this drives packaging innovation!
Nokia
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6. RF Wireless; Bluetooth, etc Long-Haul Fiber Backbone
Net Centric
Satellite RF
RF Wireless; Bluetooth, etc
Submarine
Fiber Link
amplifiers
Free Space Photonics
Long-Haul Fiber Backbone
Metro Ring
Loop Access
Regional Ring
gilleo
Submarine
Fiber Link
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World Wide Hub

7. Packaging Change Drivers
Miniaturization
Area
Height
Weight
Performance
High lead count
High frequency; processors, RF
MEMS/MOEMS; a new technology cluster
Reduction
Boost
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8. Packaging Miniaturization
Flip Chip
FCOB (on board)
FCIP (in package)
CSP
MultiChip Package
Single plane
Stacked
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9. Flip Chip Trends Less than 20% are FCOB
Virtually all high I/O chips are FCIP
New underfills
Molded (FCIP)
No Flow (FCOB)
Cost reduction continues
Bumping
Integral underfill
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10. Chip Scale Packaging Flex-based doing well Wafer-level; strong trend
Area molding reduces cost
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11. MEMS & MOEMS * Old new paradox
Traditional; simple; sensors
Advanced; complex, embryonic
Most important technology of 21st century?
Major packaging challenge
Many assembly issues
Opto
* Micro-Electro-Mechanical Systems
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12. The Nano World Where all technology converges Optics Electronics
The convergence point of electronics, mechanics, physics, chemistry and biology, etc.
Electronics
Mechanics
MEMS
MOEMS OE OM
Biology
Chemistry
Optics
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Where all technology converges

13. Why MEMS? Semiconductor processing used
Merges mechanical motion & electronics
VERSATILE
sensing
computing
motion
control
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14. MEMS Structures Ink jet IBM MEMS DNA Detector © ET-Trends LLC
Electrostatic Relay - UW
Grippers - UW

15. Applications
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16. Packaging Challenges MEMS devices can be very fragile.
pre-package handling concerns.
post-handling issues; can be shock sensitive.
Most require hermetic package ($$$).
MOEMS (covered later) requires a window & controlled atmosphere.
Biggest challenge: cost-effective, high volume packaging.
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17. MEMS Packaging Types Traditional hermetic; metal or ceramic
New Cap-on-Chip
wafer-level
device-level
Near- and non-hermetic
Selective packaging for accessibility
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18. Cap-on-Chip (level-0) a Wafer-Level Process!
Seal
Vacuum
MEMS Chip
Can now be handled like an ordinary die - almost!
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19. Cap-on-Chip Overmolding
1. Apply cap to device or wafer;
solder, weld, bond.
MEMS IC
2. Attach & bond device
3. Conventional overmolding followed by solder ball attach.
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20. Cap-on-Carrier Silicon or Metal Cap Molded or Liquid Encapsulant
MEMS IC
Solder, weld, or polymer
This packaging method is suitable for accelerometers, gyroscopes and other motion detectors that can be sealed.
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21. MOEMS & Photonics Projection Mirrors Photonics Switches Gratings
Micro-opto-electro-mechanical systems
Projection Mirrors
Photonics Switches
Gratings
Fiber Aligners
Modulators, Shutters
Movable Lenses
A Market powered by the Internet!
A Technology that will power the Internet!
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22. TI MOEMS: Micro-Mirrorson
off on
World’s most complex machine! on on on
off on
3 M Co.
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Ref. “Digital Light Processing TM for High-Brightness, High-Resolution Applications” Larry J. Hornbeck, Ti.com

23. MOEMS Micro-Mirror WINDOW HEAT SINK HERMETIC Getter Weld or seal
Ceramic
HEAT SINK
HERMETIC
250,000 mirrors
MEMS Digital Mirrors
one section
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24. Flip Chip for MOEMS? Light Pipe Encapsulant MEMS FLIP CHIP Underfill
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25. MOEMS Window Cap? Optical Encapsulant Transparent Cap MOEMS
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26. Assembly Issues Stiction Safe handling; some are shock sensitive
Orientation; can be critical
PWB & joint; changes affect MEMS sensitivity
Testing; not well established for some devices
Need free path for light, sound, molecules
Stiction
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27. (air bag sensor example)
Stiction Problem
(air bag sensor example)
Stuck
Analog Devices Chip
Sensing Mechanism (Analog Devices)
High surface area = high attraction =
“STICTION”
Result of rough
handling = “dead” component
© ET-Trends LLC

28. Assembly – New Rules? MEMS MOEMS, photonics All can change behavior
Component skew
Component non-coplanarity
Solder joint mass and shape
Flux residue
More heat sensitive; lead-free problem?
MOEMS, photonics
Light path
Fiber connection
© ET-Trends LLC

29. Packaging Panorama Advanced BGAs Flex-Based MultiChip Array Molded CSP
Wafer-Level
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30. Some drawings from Joe Fjelstad
10 December 1996
TRENDS
Time
TO Can
DIP
Density/efficiency
PQFP FC
BGA
Notes:
CSP
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Some drawings from Joe Fjelstad 3 3

31. Flip Chip BGA
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32. Thermally Enhanced FC BGA
Heat Spreader
Thermally Conductive Interface
AMKOR
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IBM

33. Flex-BGA TapeArray™ BGA Singulated edge Mold Compound Die Attach
Polyimide Tape
Wire Bond
TapeArray™ BGA
Singulated edge
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34. MultiChip Packages Single-Plane Stacked © ET-Trends LLC
Drawings from Pacific Consultants, LLC

35. Area Molded for high throughput
ChipArray®
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36. Molded in strip format
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37. CSPs © ET-Trends LLC µBGA is a registered trademark of Tessera, Inc.
Shellcase NS
µBGA is a registered trademark of Tessera, Inc.
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38. Wafer Scale CSP Lower Cost CSP All processing on the wafer
Fan-in structure
Wafer Level Packaging:
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Shellcase

39. Conclusions Telecom is driving packaging & assembly
Portability drives down size
Performance drives up density
New packages are smaller; 202s, FC, CSP
Handling issues; size & fragility
Catch the waves by learning & innovating
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