1. T HE PDM INTEGRATION P. Barrillon (LAL) & G. Prévôt (APC) On behalf of the PDM crew (Simon, Lech, Philippe, Sylvie B) EUSO-SPB/MiniEUSO progress meeting, APC, 21 st March 2016

2. T AKE HOME MESSAGE MATRA assembled a complete EC unit prototype (delivered last week) Tests started last Wednesday at APC and are positive Potting mold, designed by MATRA, is ready. Potting resin received by MATRA. They are ready to pot whenever we give them back the EC unit Second EC-HVPS has been integrated to the “APC EC unit”. Tests will be performed in parallel. Connectors have been ordered for the series. We received most of them. The rest will be sent in May. We have enough to start and not be in critical situation. 2

3. R EMINDER : FIRST PDM Mechanical frame in 2 parts: DELRIN front part (9 EC units) and metallic back part (6 ASIC boards, 6 kapton cables & PDM b) HVPS located outside in 4 boxes (additional piece of mechanic) Issues: Difficulties to power the 6 ASIC boards GND handling HV cables Integration and potting of the HVPS FPGA resources Heating elements Per EC unit: 1 EC-DYNODE 4 EC-ANODE 1 EC-HV 3 Electrical architecture

4. R EMINDER : FORESEEN EVOLUTIONS HVPS CW part inside the EC unit All the elements to be potted are within the same entity Shorter HV cables, inside the EC unit Simpler assembly (no more extension or additional pins) HVPS control unit in between EC unit and PDMb, HK and battery (see dedicated talk) ASIC boards improved (see dedicated talk) PDM/Zinq board upgraded (see dedicated talks) Complete isolated mechanical structure with a flat front part (EC units) Global gnd strategy 4

5. 5 T HE NEW PDM ELECTRICAL ARCHITECTURE PDM BOARD (1) LVPS- PDM EC-ASIC (6) CCB HVPS Control Unit (1) EC-dynode (9) HVPS-EC (9) MAPMT (36) EC-anode (36) 1 power, 1 gnd 25x2 commands 8x2 signals 3x2 SPI & 1x2 GTU 2 powers, 1 gnd and 6 signals 14 HV lines 14 HV pins 64 anode signals 3 powers, 1 gnd, 76 i/o signals 1 power, 1 gnd HK 6x2 commands Battery 1 power, 1 gnd Thanks to P. Prat

6. March 2015: talk on new PDM (meeting at IRAP) June 2015: design of the new ec-dynode (4 holes removed) July 2015: production of 25 new ec-dynodes October 2015: Talk on new EC unit (meeting at APC) Design of the new ec-anodes (longer kapton, rotation of 8x8 matrix) November 2015: Production of 5 new ec-anodes of each type First meeting with MATRA (at APC) January 2016: Second meeting with MATRA (brainstorming on the EC unit assembly and potting mold) the 7th APC EC unit prototype assembled last week (week 4) February 2016: HVPS-EC tests (proto 1 and 2) Visit to MATRA (23 rd ) to deliver all the elements needed for their prototype and finalize the assembly sequence March 2016: 15 th : MATRA finished the prototype. It was brought to APC for tests end of the week 2 nd HVPS-EC validated and integrated with the APC EC unit prototype H ISTORY 6

7. The goal is to integrate the HVPS inside the EC unit. It would “replace” the EC-HV board. The EC-dynode and EC-anode philosophy is kept. But the boards are slightly different. Per EC unit there will be: 1 EC-dynode board 4 EC-anode boards 2 EM noise shields 1 HVPS-EC (1 pcb) The dimension of the EC unit in depth will be bigger because the HVPS-EC will be thicker than the EC-HV The central fixation screw is kept (see dedicated slide) MAPMT EC-DYNODE EC-ANODE HVPS-EC EM noise shield NB: fixation screw not represented R EMINDER : THE NEW EC UNIT 7

8. EC-HVPS block Limit of the potting EC-dynode Peek M3 screw (25 mm) through the EC-dynode, maintained by a column (in between EC-anode boards) + a second column (maintaining the EC-HVPS block) + a screw (through the mechanic) and a ring + nut (for final fixation to the mechanical structure). Mechanical frame Ring + nut 5.2 mm 12-15 mm 10-11 mm 29.2 – 30.2 mm NB: Drawing not at the correct scale T HE STRATEGY FOR THE FIXATION OF THE EC UNIT 8

9. 9 MATRA’s schematic

10. Our strategy was to produce our own prototype of EC unit to perform a first check of its functioning Based on our experience we gave feedback to MATRA before they started their own prototype APC EC-UNIT PROTOTYPE 10 Conclusions: Assembly simpler than previous version of the EC unit Thinner HV cables should be used Ongoing: Add the HVPS-EC Check the two different shields (with and without connection to gnd)

11. The assembly itself took 1 day. Delivery of custom screws and columns took time. But this is encouraging for the series Additional work at APC: Solder the 4 connectors of the EC anodes Prepare the set-up for the tests (black box, pulser, ASIC board, computer, NIST, etc) MATRA EC-UNIT PROTOTYPE 11

12. MATRA EC-UNIT PROTOTYPE - TESTS 12 EC-ASIC_v1.5 Mechanical structure from Frascati Integrating sphere EC unit Test board 2 MAPMTs read simultaneously with 2 SPACIROC3 ASICs.

13. It was tested at APC end of last week With and without ASIC With and without light, HV, switch MATRA EC-UNIT PROTOTYPE - TESTS 13 First light HV off HV on – switch off HV on – switch on no light 0.36 nW light0.72 nW light NB: 0.72 nW corresponds to 4 pe/GTU/pixel Nice s-curves for the 64 pixels of the 4 MAPMTs

14. The potting mold is finished and ready to pot the prototype (the resin has been also received by MATRA) P OTTING MOLD 14

15. S CHEDULE (EC UNIT ) MATRA EC unit un-potted tested until the end of this week End of this week or beginning of next week: EC unit at MATRA for potting EC unit potted back the week of 4 th of April (or hopefully before) Tests at 1bar, then tests at 3 mbar to validate completely the EC unit design If it is ok  order the FM EC units to MATRA. This should be prepared well in advance since it is planned that INFN will take care of that FM EC units production could start mid-April 15

16. P REPARING FM PDM S All EC unit FM boards should be produced 60 EC anodes of the 2 types have been ordered (18 needed per PDM) EC-dynode produced last year (21 left after the prototypes) HVPS-ECs will have to be produced EC-ASIC boards will be produced after the tests of the prototypes EC-kapton cables might be produced if we go for FM EC- ASIC without kapton PDM boards (2 pcbs) have been produced Zinq board as well (TBC) All the MAPMTs have to be measured and grouped by 4 All the SPACIROC3 ASICs have to be tested All connectors ordered and partly received 16

17. C ONCLUSIONS See Take home message We are on good tracks ! 17