1. U.S. Radiation-Curable Adhesives Market New Wave of Technologies Challenge Solvent-Based Systems “Stringent regulations from the U.S. Environmental Protection Agency (EPA) are forcing manufacturers in a wide range of industries to switch from solvent- based adhesives to newer, environmentally-friendly technologies.” Chemicals Analyst Team Frost & Sullivan

2. Detailed insights into recent developments and trends Drivers, restraints, challenges, and strategic recommendations Analyst insights into ‘hot topics’ and emerging applications in the radiation-curable adhesives market Market-sizing and competitive analysis Market forecasts and opportunity analyses Quarterly assessments End-user analysis Key Features

3. Coverage: The United States Proven methodology using extensive primary and secondary data as well as research Focused information and strategies that cover business and technology issues Credible data and analyses that highlight industry dynamics Winning strategies to create precise business models What We Offer

4. Current Market Participants Find out how you compare with the competition Assess current and future drivers as well as restraints Determine and exploit new market share opportunities New Entrants Analyze the associated challenges Calculate timescales for strategy implementation Position yourself to capitalize on the unmet needs of the market Investment Community Analyze long-term strategies of companies Determine which participants will outperform the competition Assess the attractiveness of investing in the market Benefits

5. Ato Findley Beacon Chemical Borden Chemical, Inc. Craig Adhesives & Coating Co. Dymax Corp. Elementis Preformance Polymers H.B. Fuller Co. Hernon Manufacturing, Inc. Loctite Corp. Morton International, Inc. National Starch & Chemical Co. Norland Products, Inc. Northwest Coating Corp. Quretech Rad-Cure Corp. Star Technology, Inc. Key Market Participants

6. Call toll free 877 G O F ROST (877.463.7876) Fax toll free 888.690.3329 E-mail myfrost@frost.com Visit www.frost.com For More Information