2. 1.Make qualitative observations about the pieces of Mg metal at your station 2.Dip them in the bath of CuSO 4 3.Record detailed observations in your notebook 4.Use the “Activity Series” on the right – Which metal is more reactive, Copper or Magnesium? 5.What does this remind you of from the Durability Lab? 10987654321 12/17 Redox Reactions Leave your completed Precipitates Lab out to be collected. They will be graded in the exhibition category.

3. 1.Connect your Nickel to the black wire. Turn on your power supply. Quickly dip it in and out of the the blue CuSO 4 solution. Wipe /scrub firmly with a paper towel. Repeat. 2.On paper, RECORD your observations. 3.WHAT do you think is happening? WHY? 4.WRITE at least 2 questions that you would like to answer today about what happened in this demo. 5.This technique is called electroplating (coating one metal with another using electricity). WHY might an artist (or chemist) use this technique? 10987654321 12/17 Electroplating

4. lose oxidation LeO gain reduction lion LeO GeR Oxidation and Reduction

5. Oxidation and reduction always occur together. Therefore, these types of reactions are abbreviated ________________ reactions. These reactions are often broken up into ____________________. Some redox reactions occur ____________________, while others require ___________. Redox Redox Reactions half - reactions spontaneously energy Half-reaction e - Lost or Gained? Oxidation OR Reduction

6. When metals are __________________ (lose e-), they can __________________ into solution. The reverse is also possible; when a dissolved metal cation is ________________ (gains e - ) they become uncharged ______________ metal again. Using _________________ to coat the surface of one metal with another is called ______________________. oxidized Electroplating dissolve reduced solid electricity electroplating

7. Activity Series More Easily Oxidized

8. POWER SUPPLY Cu 0 (s) Cu 0 metal being oxidized (losing e-) and dissolving into solution Cu 2+ cations being reduced (gaining e-) and plating as new solid copper metal onto the nickel coin Cu 2+ SO 4 2- Cu 2+ SO 4 2- e-e- e-e- e-e- e-e- e-e- Cu 0 Cu 2+ Electroplating

9. Electroplating Left Side Front Flap REDUCTION GeR Gaining e- Copper cations in the solution are becoming solid and electroplating onto the surface of the Nickel as solid Copper Right Side Front Flap OXIDATION LeO Losing e- Solid Copper is dissolving into Copper cations

10. Electroplating Left Side Inside Flap e- travel from the negative terminal and build up on the surface of the Nickel and are absorbed by Cu cations which become solid GeR Gaining e- Oxidation Cu 2+ (aq) + 2e-  Cu 0 (s) Right Side Inside Flap e- are leaving the piece of Copper because they are drawn to the positive terminal of the power supply. LeO Losing e- Oxidation Cu 0 (s)  Cu 2+ (aq) + 2e-