ANSYS Multiphysics 8.0 Technology Overview & Benefits

ANSYS Multiphysics 8.0 Technology Overview & Benefits
This presentation is the ANSYS Multiphysics 8.0 customer presentation. Version 3.0, January 30th Please contact Paul Lethbridge with any questions regarding content: Phone: Dr. Paul Lethbridge - Product Manager Multiphysics 8.0 Customer /30/04

Topics Covered What is Multiphysics? Market Applications
Multiphysics Benefits Educational Products Market Applications Market segments by Technology Market Segments by Industry Multi Field (Coupled Physics) Capabilities Direct physics coupling Sequential physics coupling Multi-field Solver (New feature at release 8.0) Other New features Enhanced non-linear Piezoelectric & piezoresistive element. Fluid damping elements Cyclic Symmetry for Magnetostatics Low Frequency Electromagnetic Contact Coupled E-B Particle Tracing Re-meshing for FSI Selected Multi-Physics Examples Product Roadmap & Strategy Transition to Workbench Environment Product Websites Multiphysics 8.0 Customer /30/04

The ANSYS Family of Products
Extreme functionality The whole enchilada! ANSYS Multiphysics Educational/Non Commercial Use Products ANSYS University ANSYS Mechanical High performance mechanical & Thermal ANSYS FLOTRAN Powerful tools for the physics specialist ANSYS Emag ANSYS Professional ANSYS Structural Ease of use & Entry level capability ANSYS MCAD & ECAD Connection products Multiphysics 8.0 Customer /30/04

What is ANSYS Multiphysics?
A general purpose analysis tool allowing a user to to combine the effects of two or more different, yet interrelated physics, within one, unified simulation environment. Electro- magnetic Magnetic Thermal Fluid Electrostatic Electrical Structural Multiphysics 8.0 Customer /30/04

Benefits of Multiphysics
No other analysis tool provides as many physics under one roof! Greatest breadth and technical depth of physics. Fully parametric models across physics, geometry, materials, loads. Perform Design Optimization across physics, geometry, materials and loads. Seamless integration with ANSYS Probabilistic Design System (PDS). Extremely sophisticated analysis capability. Bottom line benefits: Analysis closely match reality – bringing reality to the desktop Reduced assumptions that question certainty and compromise accuracy. Lower cost: Fewer analysis software tools to purchase,learn & manage. Lower cost: R&D process compression Multiphysics 8.0 Customer /30/04

Benefits of Multiphysics
“The use of Multiphysics allows us to return to the basics of engineering where a model and the predictive solution closely approximate reality; this allows the engineer to design with a high degree of confidence that the answers are correct.” Multiphysics 8.0 Customer /30/04 Dr. Howard Crabb - Ford Motor Company

ANSYS Multiphysics Educational Products
Educational products are: ANSYS Research K Nodes ANSYS University Advanced K Nodes ANSYS University Intermediate 32 K Nodes ANSYS University Introductory 16 K Nodes ANSYS ED K Nodes ANSYS ANSYS Productivity Pack Ed (Bundle of MCAD & ECAD Connection products) All Educational products offer the same physics, coupling and broad analysis capability of commercial ANSYS Multiphysics. Products are however problem size limited per physics… Multiphysics 8.0 Customer /30/04

Educational Products – Problem Size Limits
Multiphysics 8.0 Customer /30/04

Market Applications by Technology
Three “broad” Market segments uniquely identified as being inherently Multiphysics Sensors & Transducers Actuators Processes Inertial Pressure Mass Proximity Thermal Acoustic Fluid systems Hydraulic Pneumatic Fuel Microfluidics Electromagnetic machines Pumps Generators Motors Solenoids Induction heating RF Heating Heat-exchangers Electronics cooling Automotive A/C systems SEMICON Ion implanters PVD / CVD Multiphysics 8.0 Customer /30/04 Click mouse to progress

Market Applications by Industry
Multiphysics is not limited to any specific industry. There are analysis applications and opportunity across the board. Electronics Automotive Aerospace / Space Marine SEMICON Government / Military Medical / BioMed Pharmaceutical Appliances Multiphysics 8.0 Customer /30/04

Coupled Physics Capabilities: Methods
There are two methods to couple physics, Direct & Sequential. Direct - solves all DOF’s at the FEA coefficient matrix level. Sequential - solves DOF’s for one physics then passes results as loads & boundary conditions to the second physics. At least two iterations, one for each physics, in sequence, are needed to achieve a coupled response. There are many confusing terms for the two methods: Coupled Physics Terminology Preferred ANSYS Inc. “descriptive usage” Direct Sequential Strict Mathematical usage Matrix Load vector LHS RHS Monolithic Staggered Archaic Use at your peril! Strong Weak Tight Loose Full Partial Multiphysics 8.0 Customer /30/04

Direct Coupled Physics Applications
Thermal-Structural Anything with a structure! Gas turbines. Pressure-Structural (Inviscid FSI) Acoustics, sonar, SAW Piezoelectric Microphones, sensors Piezoresistive Pressure sensors, strain gauges, Accelerometers Circuit coupled electromagnetics: CIRCUIT124 CIRCUIT125 Motors, MEMS Electrostatic- Structural: TRANS126 TRANS109 MEMS Electro-thermal-structural -magnetic: SOLID5, PLANE13 SOLID62, SOLID98 IC, PCB electro-thermal stress, MEMS actuators Fluid-thermal Piping networks, manifolds Multiphysics 8.0 Customer /30/04

Sequential Coupled Physics Applications
Thermal-Structural Anything with a structure! Gas turbines. Electromagnetic-thermal Electromagnetic-thermal-structural Induction heating, RF heating Electrostatic-Structural Electrostatic-Structural-Fluidic MEMS Electrostatic – Charged particle Ion Optics, Field Emission Display Technology, Analytical instruments Magnetic - Structural Solenoids, electromagnetic machines Fluid-Solid: FLOTRAN based FSI MpCCI: Bi-directional FSI CFX-ANSYS unidirectional interface Aerospace, automotive fuel, hydraulic systems, fluid bearing, MEMS fluid damping, drug delivery pumps, heart valves. Electromagnetic-Solid-Fluid Fluid handling systems, EFI, hydraulic systems Thermal-CFD Electronics cooling Multi-field Solver Many! All of the above! Sigfit: Unidirectional, Structural – Optical Automotive lighting, astronomy, any optical instruments Multiphysics 8.0 Customer /30/04

Multi-field Solver - Pretext
Situation Prior to Release 8.0: Significant number of multi-physics problems can be addressed with sequential coupling using core elements. Our current tools for sequential coupling require advanced APDL and domain knowledge to process solution. We have out-grown custom-command macros that perform sequential coupling e.g..: FSSOLV ESSOLV Fluid Solid Interaction (FSI) was a first step towards automated sequential coupling technology Basically current tool for coupled physics are somewhat antiquated. Multiphysics 8.0 Customer /30/04

Multi-field Solver – Why?
There is Growing Market Requirement to: Solve multi-physics problems from all industries. Often need to incorporate more than two physics. Couple more easily to external codes Provide an easier to use Multiphysics environment for current analysts. In Response: ANSYS have developed a “multi-field” solver to automate sequential coupling, and be general enough in the design for most multi-field solution requirements” The multi-field solver is an evolution of our successful FSI solver Development has been in progress here for about 1.5 years “Why” was Also driven by the need to couple with CFX our new acquisition. Multiphysics 8.0 Customer /30/04

Multi-field Solver – Implementation
Model and mesh Single model of physical parts. Multiple, separate meshes for each “Field”, derived from base solid model. What is a FIELD ? A FIELD is an Finite Element model set up to perform a single solution It may solve for a single physics (e.g. a mechanical structure) It may solve for directly coupled physics (e.g.. piezoelectrics) A selection of element types is used to define a FIELD Each FIELD has it’s own mesh Loads, boundary conditions, solver selection are all part of the FIELD definition A FIELD may be any analysis type (Static, Harmonic, Transient) Each FIELD creates it’s own results file A FIELD may be defined (imported) from an external code via a CDB file. Slide is pretty verbose & descriptive..read the bullets! Multiphysics 8.0 Customer /30/04

Interfacing between Fields Fields “talk” to one another through surface or volumetric interfaces Field coupling is realized by mapping loads from one mesh to another Support similar or dissimilar meshes Supports 1st order and 2nd order elements or mixtures of both Automated mesh “morphing” of non-structural domains is available for all non-structural element types. Multifield Solution The solver loops through all fields Supports static, transient and harmonic analysis Convergence is monitored at the interfaces where loads are transferred. Interfacing: Can even have a mesh within another mesh! Can interface between different types of mesh, 1st order to 2nd order elements, between different element shapes etc. Multiphysics 8.0 Customer /30/04

Time loop: For transient analysis, refers to solution in time For static analysis, refers to each load step For harmonic analysis, refers to harmonic analysis within time step Stagger loop: Implicit coupling of various fields in time loop Number of stagger iterations determined by convergence of load transfer or max stagger iterations Field loop: Field solution with specific solution options Load transfer to a particular field occurs before solution of the field Dissimilar mesh across surface/ volume interface between fields Time Loop End Time Loop Stagger Loop End Stagger Loop Field Loop ( i=1,n) End Field Loop Physics Field 1 Physics Field 2 Physics Field n Multiphysics 8.0 Customer /30/04

Multi-field Solver- Physics Loads
Physics Loads Transferred in Field Loop SEND RECEIVE CFD Heat flux, Forces, Temperatures Displacement, Velocity, Temperature, Heat rate, Forces THERMAL Temperature, heat flux Temperature, Heat flux, Heat rate, Displacement STRUCTURAL Displacement, Velocity Forces, Temperature, Displacement MAGNETIC Forces, Heat rate Temperature, Displacement ELECTRIC High Frequency ELECTROMAGNETIC Heat Rate Table shows which loads are received and sent for each physics available with the multi-field solver All fields can accept displacements which are in fact movements of the boundary. Multiphysics 8.0 Customer /30/04

Multi-field Solver – Multi-user deployment
No need for a super user to handle all physics, separate physics can be processed by individual analysis experts in the company: CAD Model Intra-Company Resource Physics 1 Engineer e.g. CFD Model pre processing (loads, boundary conditions & mesh) Physics 2 Engineer e.g. Electromagnetics Model pre processing (loads, boundary conditions & mesh) Physics 3 Engineer e.g. Structural Model pre processing (loads, boundary conditions & mesh) Physics 4 Consultant Engineer e.g. HF electromagnetics Model pre processing (loads, boundary conditions & mesh) Multi-field Analysis Multiphysics 8.0 Customer /30/04

Multi-field Solver – Multi-user deployment
Each physics has its own CDB and results (*.R*) file. Solid Model Physics 1 e.g. CFD Model pre processing (loads, boundary conditions & mesh) Physics 2 e.g. Electromagnetics Physics 3 e.g. Structural Physics 4 e.g. HF electromagnetics CFD CDB File Electromagnetics CDB file Structural CDB file HF Emag CDB file Multi-field Solver Field1.RFL Results File Field2.RMG Results file Field3.RST Results file Field4.RMG Results file Multiphysics 8.0 Customer /30/04

Multi-field Solver - dissimilar mesh interface
Example of dissimilar mesh between physics: Thermal-mechanical mesh: 15,000 elements CFD mesh: 600,000 elements (Fluid region not shown) Multiphysics 8.0 Customer /30/04

Multi-field Solver- Summary
Physics is treated as a "field" with an independent model & mesh Each field is defined by a group of element types Load transfer regions are identified by surfaces and/or volumes Sequential (Load vector) coupling between fields Each field may have: Different analysis types Different solvers and analysis options Different mesh descretization Each field can be imported from an external solver (e.g. CFX) Surface load transfer across fields Volumetric load transfer across fields Automated morphing of non-structural elements Independent results files for each field Multiphysics 8.0 Customer /30/04

Multi-field Solver- Physics & Applications
Multi-Field Coupled Solver - Physics Applications/ Markets Thermal-Structural Anything with a structure! Gas turbines. Electromagnetic-thermal Induction heating, RF heating Electrostatic-Structural - Fluidic: MEMS Electrostatic – Charged particle Ion Optics, Field Emission Display Technology, Analytical instruments Magnetic – Structural - Thermal Solenoids, electromagnetic machines, Bus bars Fluid-Solid: FLOTRAN based FSI CFX-ANSYS unidirectional interface Aerospace, automotive fuel, hydraulic systems, fluid bearing, MEMS fluid damping, drug delivery pumps, heart valves. Thermal – CFD Electronics cooling, engines Magnetic - CFD MR fluids, Ferro-fluidics, automotive Third Party/External Product coupling: Sigfit: Unidirectional, Structural – Optical MpCCI: Bi-directional FSI Automotive lighting, astronomy, any optical instruments Table showing what physics we can couple and what related markets & applications we address at release 8.0. Multiphysics 8.0 Customer /30/04

Multi-field Solver- Benefits
Provides an easy to use framework to solve coupled field problems in ANSYS Multiphysics Ability to sequentially couple any number of physics fields Applicable across all physics available in ANSYS Multiphysics Multiple field specification with different solution option for each field Analysis type (Transient/Static/Harmonic) Solver options Material & geometric non-linearity Automated surface and volume load transfer across dissimilar mesh Automated Morphing of field elements Unidirectional coupling between CFX and ANSYS Multiphysics Unidirectional coupling between third party solvers and ANSYS Multiphysics Provides analysis opportunities in many new market areas where there have previously been no solutions. Multiphysics 8.0 Customer /30/04

Multi-field Solver- RF Attenuator Example
RF/microwave energy is attenuated through resistive losses in a Nichrome film attached to the microstripline waveguide. The energy is lost in the form of heat which is conducted both through the devices ceramic substrate and top insulating surface film. Image from KDI data sheet. Typical Packaged Device: Solid Model: Nichrome film Ceramic substrate This example analysis is a common type of microstripline RF attenuator. RF/microwave energy is attenuated through resistive losses in a Nichrome film attached to the microstripline waveguide. The energy is lost in the form of heat which is conducted both through the devices ceramic substrate and top insulating surface film. RF waveguide Multiphysics 8.0 Customer /30/04

Multi-field Solver- RF Attenuator Example
High-Frequency electromagnetic coupled to a steady-state thermal analysis: HF Emag Physics Field 1 Thermal Physics Field 2 Heat generation rate Thermal Mesh: 6,600 elements HF Emag mesh: 98,175 elements Note that dissimilar mesh is allowed. Multiphysics 8.0 Customer /30/04

Resultant temperature
Multi-field Solver- RF Attenuator Example Analysis results: E-field H-field Resultant temperature Multiphysics 8.0 Customer /30/04

Multi-field Solver- MEMS RF Switch Example
Transient response of MEMS RF Switch to a pulsed voltage excitation: Beam support post Ground electrode Beam electrode Substrate Perforation holes to control fluid damping Example MEMS application. RF Switch.. Consists of electrostatic actuated double supported beam. Fluid damping transient response of beam is controlled largely by the surface area of the beam normal to the direction of actuation. Adding holes to this beam drastically changes the damping, more holes = less fluid damping. Adding holes also changes the electrostatic actuation force. Example is a coupled electrostatic – structural –fluid analysis. This slide image shows the structural components of the model. Multiphysics 8.0 Customer /30/04

Each physics model is prepared independently: CAD Model Physics 1: Mechanical Engineer Mesh solid model of switch Apply clamped BC’s Perform squeeze-film damping analysis using FLUID136, FLUID138. Prepare structural dynamics analysis run Physics 2: Electronics Engineer Create Air mesh around switch Apply voltage BC’s Prepare electrostatics analysis run Write CDB file Approaching the problem: Mechanical Engineer performs squeeze film damping analysis to extract Rayleigh damping parameters using FLUID136 & FLID138 elements. Mechanical Engineer prepares dynamic structural analysis model Electrical engineer prepares electrostatics model Models are prepared independently! MFIMPORT Multi-field Analysis Multiphysics 8.0 Customer /30/04

Transient, dynamic electrostatics coupled to mechanical analysis: Mechanical Physics Field 1 Electrostatics Physics Field 2 Displacement, Forces Electrostic mesh: 16,353 elements Structural mesh: 1894 elements Double ended arrow here represents the field loop. Multiphysics 8.0 Customer /30/04

Analysis Results: Displacement of switch mid-plane Under pulse voltage excitation Multiphysics 8.0 Customer /30/04

Multi-field Solver Example: CFX Imported field
Gas turbine with internal cooling example: Unidirectional coupling between CFX and ANSYS CFX performs conjugate heat transfer fluid solution. CFX writes an ANSYS CDB file containing surface forces, volumetric temperatures; defining an “external field” for the multifield solver ANSYS interpolates CFX results onto the ANSYS FE mesh ANSYS solves the thermal-stress analysis Makes use of Cyclic symmetry (113 blades!) Analysis details: 113 blades Shaft IR=.2656 m Hub Radius=.3794 Tip Radius=.4525 m Shroud Radius=.4575 m Speed: 524 rad/s Total P: .25 Bar Total temp: 500 K Mass flow: .03 Kg/s Multiphysics 8.0 Customer /30/04

Details of field stagger loop: External Physics Field ANSYS Internal Physics Field Surface Forces Interpolated Surface Forces CFX Model Physics Field 1 Structural Physics Field 2 Volumetric Temperatures Interpolated Volumetric Temperature Multiphysics 8.0 Customer /30/04

Imported field process: Create CFD model in CFX-build, Pre-process and Solve Conjugate HT problem in CFX-solve. Use the export utility in CFX-Post create a ANSYS CDB file CDB file has SUR152/154 elements with force loads and SOLID70 with temperatures derived from CFX mesh. Create solid region in ANSYS Multiphysics and mesh for thermal-stress analysis Apply boundary conditions (Omega loading, cyclic symmetry) Read in the cdb file from CFX via the MFIMport command Create the fluid solid (FSIN) interfaces via SF command for the surface Forces Create the solid-solid volumetric (FVIN) interface via BFE command for the temperatures User defines solid region as "field2" and fluid (CFX) region as "field1" ANSYS 8.0 multi-field stagger loop algorithm is used to transfer loads from "field2“ mesh to "field1 mesh and then solves the thermal-stress analysis." Multiphysics 8.0 Customer /30/04

Field 1: CFD Results Pressure Streamlines Temperature Multiphysics 8.0 Customer /30/04

Field 2: Thermal Mechanical Results Temperature Equivalent stress (SEQV) Displacement The Equivalent stress (SEQV) includes Omega loading, thermal load, and Fluid force load Multiphysics 8.0 Customer /30/04

Multi-field Solver: CFX support
CFX can export the following to ANSYS Multiphysics At surfaces Nodal heat flux Nodal forces Within Solid volumes Nodal temperatures CFX loads can be read only with the ANSYS Multiphysics Multi-field Solver CFX5 export Stand-alone CFXExport executable available for CFX5.6 customers ANSYS CDB file created from CFX results files Works with ANSYS Multiphysics 8.0 and the Multifield solver Multiphysics 8.0 Customer /30/04

Multiphysics Benefits Educational Products Market Applications Market segments by Technology Market Segments by Industry Multi Field (Coupled Physics) Capabilities Direct physics coupling Sequential physics coupling Multi-field Solver (New feature at release 8.0) Other New features Enhanced non-linear Piezoelectric & piezoresistive elements. Direct coupled piezoresistive elements Fluid damping elements Cyclic Symmetry for Magnetostatics Low Frequency Electromagnetic Contact Coupled E-B Particle Tracing Re-meshing for FSI Selected Multi-Physics Examples Product Roadmap & Strategy Transition to Workbench Environment Product Websites Multiphysics 8.0 Customer /30/04

Direct Coupled-Field Elements - Benefits
Series 22X elements bring consistency and ease of use to our direct coupled physics: Capabilities New material models and coupled-field effects More special features and loads Consistency Flexible setting of DOFs and reactions - controlled by KEYOPT(1) Element shapes and orders - match our 18X solid structural elements Load labels - CHRG vs AMPS Large deflection capability - available for ALL analyses with structural DOFs New code architecture Use existing / enhanced ‘core’ legacy elements as building blocks Inherit the functionality of ‘core’ elements - material models, loads, special features. Calculate directly coupled-field effects inside the element. Facilitates infrastructure to rapidly deploy additional directly coupled physics. Older core/legacy elements are going into a maintenance mode, superceded by series 22X. Multiphysics 8.0 Customer /30/04

Series 22X Coupled Field Elements
Higher order solid elements for Piezoelectric analysis Piezoresistive analysis Applications Pressure transducers Sensors Accelerometers Microphones Elements PLANE D 8-Node Quad SOLID D 20-Node Brick SOLID D 10-Node Tetrahedral Couples to CIRCU124 Can build Wheatstone bridge etc R1 R2 R4 R3 Force Piezoresistive paper with full description of Fujikara device is here: Acceleration Images courtesy Endevco & Fujikura. Multiphysics 8.0 Customer /30/04

Coupled Field Piezoresistive Element
Strain gauge accelerometer principle of operation: Piezoresistors Support Frame R1 R2 R3 R4 Proof mass R1 normal compression tension piezo-resistor color key R1 R2 R4 R3 Acceleration Force R1 R2 R3 R4 Acceleration Force Multiphysics 8.0 Customer /30/04

Strain gauge accelerometer analysis example: Accelerometer uses four piezoresistive sensors per beam in a Wheatstone Bridge configuration. Objective is to compute Output voltage and sensitivity with 5 V DC excitation. SOLID95 for mass, frame, and beam SOLID226 for Piezoresistors Voltage coupling used to create Wheatstone bridge. Detail of beam: Frame Beam 5 V DC exciation Proof Mass Four Piezoresistor elements Multiphysics 8.0 Customer /30/04

Analysis results for 1 G acceleration load: Stress in beam: MPa Differential voltage in bridge: 2.79 mV Sensitivity: 2.84e-4 Vsec2/m Axial stress contour plots: Multiphysics 8.0 Customer /30/04

Damping Elements for Thin Film Applications
FLUID D 4 or 8 node squeeze film fluid element FLUID D 2 node viscous fluid link element FLUID or more node slide film damper Applicable to MEMS or macro devices where damping attributed to thin films/ air gaps is required. “KEYOPTS” control the flow regime: Continuum, High Knudsen numbers etc. The fluid environment is defined by a set of real constants. For FLUID136 & FLUID138: The elements are added to the structure and a static analysis is used to determine the damping effects at low frequencies, and a harmonic analysis is used to determine the stiffening and damping effects at high frequencies. The DMPEXT command is used to extract frequency dependent damping parameters for use with the MDAMP, DMPRAT, ALPHAD, and BETAD commands for use in structural dynamics analysis with correct damping. Accurately extract ALPHA and BETA Rayleigh damping terms for a transient analysis. One method for assessing the effect of thin films is to use thin film fluid elements based on the Reynolds number (which is known from lubrication technology and rarified gas physics) to calculate the stiffening and damping effects. These effects can then be added to the overall system model. Separate element types are used to assess squeeze and slide film effects. These elements are available in both Multiphysics and ANSYS Mechanical. Multiphysics 8.0 Customer /30/04

FLUID 136: Models viscous fluid flow behavior in small gaps between fixed surfaces and structures moving perpendicular to the fixed surfaces. Used to determine the stiffening and damping effects that the fluid exerts on the moving structure. Based on the Reynolds squeeze film theory and the theory of rarefied gases. A static analysis is used to determine the damping effects at low frequencies. A harmonic analysis is used to determine the stiffening and damping effects at high frequencies. The DMPEXT command is used to extract frequency dependent damping parameters for use with the MDAMP, DMPRAT, ALPHAD, and BETAD commands for use in structural dynamics analysis with correct damping. Accurately extract ALPHA and BETA Rayleigh damping terms for a transient analysis. One method for assessing the effect of thin films is to use thin film fluid elements based on the Reynolds number (which is known from lubrication technology and rarified gas physics) to calculate the stiffening and damping effects. These effects can then be added to the overall system model. Separate element types are used to assess squeeze and slide film effects. These elements are available in both Multiphysics and ANSYS Mechanical. Multiphysics 8.0 Customer /30/04

FLUID 138: Models the viscous fluid flow behavior through short channels (i.e., holes) in microstructures moving perpendicular to fixed surfaces. Can be used in conjunction with FLUID136 elements to determine the stiffening and damping effects that the fluid exerts on the moving perforated microstructure. Assumes isothermal flow at low Reynolds numbers. Accounts for gas rarefaction effects and fringe effects due to the short channel length. Can be used to model either continuous or high Knudsen number flow regimes. Applicable to static, harmonic, and transient analyses. FLUID 139: 139 is a combination of Couette (low frequency) and Stokes flow (inertial effects at high frequency). The viscous flow between surfaces is represented by a series connection of mass-damper elements whereby each node corresponds to a local fluid layer Applicable to large deflection. One method for assessing the effect of thin films is to use thin film fluid elements based on the Reynolds number (which is known from lubrication technology and rarified gas physics) to calculate the stiffening and damping effects. These effects can then be added to the overall system model. Separate element types are used to assess squeeze and slide film effects. These elements are available in both Multiphysics and ANSYS Mechanical. Multiphysics 8.0 Customer /30/04

Squeeze & damping constants: Damping low frequencies represents fluid displacement effects Squeeze or Spring higher frequencies represents compressible fluid effects At low frequencies (in general), the air can escape out of the air gap, hence damping is the dominant effect. At higher frequencies, the air cannot escape, and it therefore must compress like a spring. The fluid-solid damping changes drastically when the transition from compressible to incompressible flow occurs Both components are frequency dependent Multiphysics 8.0 Customer /30/04

Computing damping parameters for flexible bodies using the Modal Projection Technique: Build a structural and thin-film fluid model and mesh. Perform a modal analysis on the structure. Extract the desired mode eigenvectors. Select the desired modes for damping parameter calculations. Perform a harmonic analysis on the thin-film elements. Compute the modal squeeze stiffness and damping parameters. Compute modal damping ratio and squeeze stiffness coefficient. Display the results: MDPLOT. Modal projection techniques provide an efficient method for computing damping parameters for flexible bodies. The Modal Projection Technique is the process of calculating the squeeze stiffness and damping coefficients of the fluid using the eigenvectors of the structure. In the modal projection method, the velocity profiles are determined from the mode-frequency response of the structure. Automated using the DMPEXT command macro Multiphysics 8.0 Customer /30/04

Transient dynamic response of damped MEMS RF Switch: Viscous FEA Model of damping holes: Viscous fluid links are used to model flow of fluid through plate damping holes. Multiphysics 8.0 Customer /30/04

Damping Elements – Application Example
Results: Transient dynamic response of the switch to a pulsed voltage excitation. ALPHA and BETA damping parameters were obtained from a squeeze-film analysis of the structure Multiphysics 8.0 Customer /30/04

Damping Elements – Application Example
MEMS Accelerometer harmonic response: Pressure distribution at 100 Hz for design with matrix of damping control holes in the plate. Pressure distribution at 20 Hz for design with no damping control holes in the plate. Multiphysics 8.0 Customer /30/04

(honeycomb plate) has flattest frequency response
Damping Elements - Application Examples MEMS Accelerometer harmonic frequency response 0.1 – 10 kHz Shows results of four design iterations: Final design (honeycomb plate) has flattest frequency response Initial design (no plate holes) is overdamped Simple plate with no holes is over damped Honeycomb plate (many holes) achieve flat frequency response Multiphysics 8.0 Customer /30/04

LF Electromagnetic Cyclic Symmetry
Feature: Cyclic symmetry (periodicity) for Low Frequency Electromagnetics Commands: CYCLIC and CYCOPT Supports: PLANE13, PLANE53, SOLID96, SOLID5, SOLID98, SOLID117 Benefits: This new feature is applicable to 3D magnetic scalar potential (MSP), magnetic vector potential (MVP) and edge (SOLID117) formulations . These commands are also used for cyclic symmetry structural analyses results greater consistency across physics. Reduce FEA problem size & faster solution time by making use of symmetry. Market applications: Primarily rotating electromagnetic machines Electric motors Alternators Inductive ignition system sensors Prior to release 8.0, the only supported option for prescribing periodicity in electromagnetic analyses was to use the PERB2D command macro. This macro automated the generation of coupled degree of freedom sets (for even periodicity) or constraint equations (for odd periodicity). Its use was limited to 2D models using the magnetic vector potential (MVP) formulation. The user was required to create his or her own macro to specify periodicity in 3D models. At release 8.0, the CYCLIC and CYCOPT commands allow users to define periodicity on 3D electromagnetic models as well as on 2D models. The new feature supports the magnetic scalar potential, magnetic vector potential, and edge formulations. Limitations Harmonic and transient analyses are not supported Node patterns on periodic boundaries must be identical for SOLID117 models Circuit coupling is not allowed except when using the solenoidal options of SOLID97 and SOLID117 Multiphysics 8.0 Customer /30/04

Example: 4 pole variable reluctance machine reduced to 90 degree sector: Bcircumferential Multiphysics 8.0 Customer /30/04

Low Frequency Electromagnetic Contact
Feature: Contact for Low Frequency Electromagnetic Commands: TARGET169, CONTAC171 Supports: PLANE13, PLANE53, SOLID96, SOLID5, SOLID98 Benefits: This new feature is applicable to 3D magnetic scalar potential (MSP), and 2D magnetic vector potential (MVP). A lot easier to use than constraint equations! Market applications: Electric motors Alternators Inductive ignition system sensors Linear Motion Systems Non Destructive Testing Eddy current braking systems Placeholder….2 slides.. Multiphysics 8.0 Customer /30/04

Low Frequency Electromagnetic Contact
Example: “In pipe” eddy current based sensor. Sensor slides down pipe detecting flaw in pipe wall. Pipe Sensor B-field contours Sensor consists of a “shuttle” that has a radially polarized permanent magnet at each end. In between the magnets are two flux loss sensors that detect the magnet field as a the sensor moves down the pipe. The sensor travels fast enough down the pipe such that induced eddy currents “modestly” perturb the field. Ref: Bill Bulat, ANSYS HQ Tech. Support group. Multiphysics 8.0 Customer /30/04

Ion Optics Enhancements
Ion Optics - An important feature for the SEMICON and Analytical instrument markets: Particle tracing is a post processing feature. Can trace charged particle in either a electrostatic field or magnetostatic field or both. Particles initial conditions definable are: Mass Charge Starting coordinates (x,y,z) Velocity vector (Vx,Vy,Vz) Can define 50 particles per run. Particle trajectory can be plotted in 2D/3D or listed. Space charge effects are not accommodated. No relativistic effects (velocity is much smaller than speed of light). Multiphysics 8.0 Customer /30/04

Example of a particle trace through homogenous magnetic field, with a changing electric field. Animation is a composite of static cases Multiphysics 8.0 Customer /30/04

Example of a particle trace on a charged particle trace! PLTRACE command used to slide “visualization particles” along the charged particle trajectories. Multiphysics 8.0 Customer /30/04

FSI – Remeshing Enhancements
Coupled fluid-solid (FSI) meshing capability enhanced to handle applications with large boundary/domain changes. This feature opens up a broader range of FSI market applications: Solid can undergo large deformation or complete rotations. E.g.. Pumps or stirrers. Detached solid object movement through fluid. Enhancements: Moving boundary problem is re-meshed when mesh becomes badly distorted or ALE mesh morphing scheme fails. Improved accuracy when the mesh is distorted by ALE mesh moving scheme Regenerates a new mesh from a selected element group. All element based loads (e.g. FSI interface) are updated Body loads on the interior nodes are updated Nodal values are interpolate from old mesh to new mesh Redesigned FLOTRAN result files, creates new rfl file for each remesh Animation is possible across multiple result files (anmres) Multiphysics 8.0 Customer /30/04

New Commands: FLDATA39, REMESH, Label, Value ANMRES, Delay, Min, Max, Inc, Autocntrky, Freq, ’rfl’ Limitations: Must keep the same topology for surface (boundary) elements. Applicable to triangle (2D) and tetrahedral (3D) elements Example: Rigid body rotation, a flap valve in a tube: Multiphysics 8.0 Customer /30/04

Cylinder passing through a channel: Multiphysics 8.0 Customer /30/04

Selected Multiphysics
Heat Transfer Solid Mechanics Thermal-structural coupling Needed for any product subjected to changes in temperature! Engines, gas turbines, heat exchangers Electronic components, package solder joints Cryogenic components and systems Test & Measurement Equipment Multiphysics 8.0 Customer /30/04

Thermal Structural Example
BGA IC Package differential thermal expansion Image courtesy of MCR. Multiphysics 8.0 Customer /30/04

Heat Transfer Fluid Mechanics Thermal-Fluid Coupling (Conjugate heat transfer) Heat is transferred between fluid and solid Convection effects. Forced flow. Applications: Heat exchangers Electronics device/enclosure temperature management Multiphysics 8.0 Customer /30/04

Conjugate Heat Transfer Example
Vertical heat sink Multiphysics 8.0 Customer /30/04

Electricity Heat Transfer Solid Mechanics Electro- Thermal Coupling Resistive (Joule) heating Electro-Thermal-Structural coupling Resistive (Joule) heating resulting in thermal expansion Needed for many electronic power handling components and systems. Current-carrying conductors, bus bars Electric motors, generators, transformers Electronic components and systems Actuators Multiphysics 8.0 Customer /30/04

Electro-Thermal-Structural Example
Detail of Integrated Circuit via & aluminum trace Current Density Electrical Power Thermal Stress Geometric size is sub micron Images courtesy of Atila Mertol, LSI Logic. Multiphysics 8.0 Customer /30/04

Electrostatic Solid Mechanics Fluid Mechanics Electrostatic – Structural coupling Piezoelectric effect Electrostatic-structural-Fluid Coupling Electrostatic actuated structures incorporating effects of fluid damping. The entire MEMS Industry is based on these physics! Resonators/Actuators Electro-mechanical band pass filters Inertial sensors (Accelerometers & gyroscopes) Inkjet printer heads Multiphysics 8.0 Customer /30/04

MEMS Micromirror Example
3 electrode system Solid model Mesh ESSOLV Electrostic solution Animation of displacements Multiphysics 8.0 Customer /30/04

Electro- magnetics Heat Transfer Electromagnetic-Thermal coupling Eddy current losses (LF Emag) Resistive & dielectric losses (HF Emag) Applications: Required by those that want heat or those that want to minimize it! Induction heating systems (LF Emag) Heat treating processes Pre-heating for metal forming operations RF Microwave systems (HF Emag) Heaters Attenuators Multiphysics 8.0 Customer /30/04

Induction Heating Example
Solid model meshed Current in coil Induced current in plate Resultant B-Field Multiphysics 8.0 Customer /30/04

Induction Heating Example
Joule heating Time averaged joule heating thermal load Resultant temperature Multiphysics 8.0 Customer /30/04

Electro- magnetics Fluid Mechanics Electromagnetic - Fluid coupling Applications Magneto-Rheological (MR) devices Active structure vibration damping systems Automotive & biomedical actuators Induction furnaces for stirring molten metals MHD power systems, EHD pumps Multiphysics 8.0 Customer /30/04

Electromagnetic - Fluid coupling Example
A.C. Induction furnace: Electromagnetic field solution to compute Lorentz forces CFD analysis performed to determine stirring pattern within furnace core Multiphysics 8.0 Customer /30/04

Electro- magnetics Solid Mechanics Electromagnetic – Solid Coupling Forces due to magnetic field move/interact with mechanical structures. Magnetic force (linear systems) Magnetic torque (rotary systems) Applications: Actuators / Solenoids Rotating machines Alternators Motors Multiphysics 8.0 Customer /30/04

Moving Magnetic Probe Example
2D Axi-symmetric model using true moving object, sliding mesh boundary Animation of flux lines when V = 0.4 m/s An important dynamic effect in electromagnetics is the generation of electric fields by time-varying magnetic fields, as expressed by Faraday's law. Another is the complementary effect whereby time-varying electric fields produce magnetic fields. This latter effect is expressed through the concept of displacement current, introduced by Maxwell. "There is a far-reaching conclusion of the fact that changing magnetic flux density produces a change in electric fields and vice versa; it leads to propagation of electromagnetic waves. In general, wave phenomena result when there are two forms of energy, and the presence of a change in one leads to a change of another. If we change the magnetic field at one position, this generates a change of electric field in both time and space, by Faraday's law. The subsequent change of the electric field produces a change of magnetic field through the displacement current, and so on. In energy terms, the energy interchanges between electric and magnetic types as the wave progresses. "Electromagnetic waves exist in nature in the radiation that takes place when atoms or molecules change from one energy state to a lower one, with frequencies from the microwave through visible into x-ray regions of the spectrum. (Still lower frequencies are generated by lightning and other natural fluctuation.) These natural radiations are utilized in astronomy and radio astronomy. Telecommunications, navigational guidance, radar, and power transmission depend on our ability to generate, guide, store, radiate, receive, and detect electromagnetic waves. This involves many kinds of structures whose properties the designer must be able to predict. The complete set of laws for time-varying electromagnetic phenomena is known as Maxwell's equations and are central to such predictions." -- paraphrased from: S. Ramo, J. R. Whinnery, and T. Van Duzer, Fields and Waves in Communication Electronics, John Wiley & Sons, 1984. Multiphysics 8.0 Customer /30/04

Magnetic Levitation Example
Flux lines and levitation coil currents: Multiphysics 8.0 Customer /30/04

Rotating Machine Examples
Multiphysics 8.0 Customer /30/04 Images courtesy of CAD-FEM GmbH.

Heat Transfer Solid Mechanics Electromagnetics Thermal-Solid-Electromagnetic Coupling Thermal-mechanical dimensional changes coupled into HF Emag or LF Emag analysis. Many applications require knowledge of the effects of temperature on electromagnetic performance. Multiphysics 8.0 Customer /30/04

Thermal-Solid-Electromagnetic Coupling Example
Thermal Effects on microwave wave guide Waveguide Bend Electric Field @ 20oC Waveguide Displacement from oC Waveguide Bend Electric Field @ 60oC 20 oC : S11 = , S12 = 60 oC : S11 = , S12 = Multiphysics 8.0 Customer /30/04

Viscous Fluid Mechanics Solid Mechanics Coupled Fluid – Solid (Fluid Solid Interaction, FSI) Fluid pressure deforms mechanical structure which in turn effects fluid flow. May also include heat transfer. Applications Aero-elastic problems Hydraulic / Pneumatic / Fuel systems Fluid pumps Biomedical Blood flow – elastic artery Heart valves Multiphysics 8.0 Customer /30/04

FSI Example – Pressure Limiting Valve
Pressure-limiting valves are used in anti-lock brake systems Huge liability ramifications Per VDO, tiny geometric design changes cause wide variations in valve response and performance Without FSI VDO was guessing on new valve designs. FSI analysis significantly reduces overall time to market and improve reliability. 0.25 mm Ø 2.4 mm Ø 4.0 mm Ø 4.5 mm Ø 10.0 mm 55º Multiphysics 8.0 Customer /30/04 Courtesy : Siemens VDO

FSI Example – Pressure Limiting Valve
Mesh detail & dissimilar mesh for solid & fluid Multiphysics 8.0 Customer /30/04 Courtesy : Siemens VDO

FSI Example – Results Multiphysics 8.0 Customer 3.0- 1/30/04
Courtesy : Siemens VDO

Ball displacement time history, f  875 Hz
FSI Example – Results Ball displacement time history, f  875 Hz Multiphysics 8.0 Customer /30/04 Courtesy : Siemens VDO

Inviscid Fluid Mechanics Solid Mechanics Inviscid fluid-structural coupling (FSI) Longitudinal pressure wave travels through fluid causing displacement of solid structure. Applications (Primarily acoustics): Loudspeaker design Microphone Sonar / ultrasonics Multiphysics 8.0 Customer /30/04

Response of axisymmetric disc in tube to plane wave.
Acoustics Example Response of axisymmetric disc in tube to plane wave. Multiphysics 8.0 Customer /30/04

Product Roadmap - Overview
Target markets: Actuator and Sensors Low Frequency (Actuators and electric machines) MEMS High Frequency (RF) devices Biomedical - FSI Short/Medium Term (< 2 years): Release 8.1/9.0 ROM140 (Damping counterpart to ROM144) Publish ROM database format & provide additional ports on ROM144 for drive variable LinkCAD for ANSYS Process Emulator module CFX ANSYS integration Longer Term (2 - 3 years): Products and technology migrated to ANSYS Workbench Environment. CFX will take FLOTRAN’s place in the ANSYS Workbench Environment. MEMS coupled analysis capability in Workbench Environment. Multiphysics 8.0 Customer /30/04

Roadmap – Transition to Workbench
Objective is to migrate ALL physics technology to Workbench We will not to develop standalone physics products….Products and physics will instead be more modular and controlled through licensing. Strategy is to migrate and expose technology into the ANSYS Workbench Environment creating a general purpose product applicable to a broad range of markets. Order of physics exposure is: LF Emag CFD (CFX technology) HF Emag Advanced Physics Multiphysics 8.0 Customer /30/04

Product Websites Multiphysics 8.0 Customer /30/04

Product Websites – FSI & MEMS

The End! Acknowledgements: Dale Ostergaard Barry Christenson
Deepak Ganjoo Ray Browell Bill Bulat Achuth Rao Stephen Scampoli Daniel Shaw Mark Troscinski Miklos Gyimesi CAD-FEM GmbH Multiphysics 8.0 Customer /30/04

ANSYS Multiphysics 8.0 Technology Overview & Benefits

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ANSYS Multiphysics 8.0 Technology Overview & Benefits

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